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# Overview Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/Introduction.html](https://docs.qualcomm.com/doc/80-23889-1/topic/Introduction.html) This topic provides the chipset component information, high-level functional block diagram, and the device features. ## QCS6490 and QCS5430 chipset components Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/Introduction.html](https://docs.qualcomm.com/doc/80-23889-1/topic/Introduction.html) For details regarding the QCS6490 and QCS5430 chipset components see, [QCS6490 and QCS5430 chipset components (80-23889-10A)](https://docs.qualcomm.com/bundle/publicresource/topics/80-23889-10A/chipset-components-overview.html) and [QCS6490/QCS5430 Technical Reference Manual (80-20659-5)](https://docs.qualcomm.com/bundle/80-20659-5/resource/80-20659-5.pdf). ## QCS6490 and QCS5430 functional block diagram Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/Introduction.html](https://docs.qualcomm.com/doc/80-23889-1/topic/Introduction.html) The following functional block diagram shows the overall representation of the subsystems on these chipsets. Figure : QCS6490 and QCS5430 functional block diagram ## QCS6490 and QCS5430 features Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/Introduction.html](https://docs.qualcomm.com/doc/80-23889-1/topic/Introduction.html) The following table lists the comprehensive features of the QCS6490 and QCS5430 chipsets and its capabilities. Note: The QCS5430 chipset is available in four different configurations enabled through feature packs. Some hardware features on the QCS6490 and QCS5430 are software-enabled. For details of QCS6490 and QCS5430 software-enabled features, see the latest revision of the applicable software release notes. ### Processor | Feature | Description | | --- | --- | | CPU | Qualcomm® Kryo™ CPU built on Arm v8 Cortex technology

**QCS6490**

Kryo Prime: Single high-performance core clocked up to 2.7 GHz

Kryo Gold: 3 high-performance cores running at 2.4 GHz

Kryo Silver: 4 low-power cores operating at 1.9 GHz

Available in 4 configurations:

Feature pack 1:
- Kryo Gold: 2 high-performance Kryo Gold cores, each clocked at 2.13
  GHz
- Kryo Silver: 4 low-power Kryo Silver cores running at 1.8 GHz each

Feature pack 2:
- Kryo Prime: Single high-performance core clocked up to 2.2 GHz
- Kryo Gold: 3 high-performance Kryo Gold cores, each clocked at 2.13
  GHz
- Kryo Silver: 4 low-power Kryo Silver cores running at 1.8 GHz each

Feature pack 2.5: and 3 ¹
- Kryo Prime: Single high-performance core clocked up to 2.38 GHz
- Kryo Gold: 3 high-performance Kryo Gold cores, each clocked at 2.4
  GHz
- Kryo Silver: 4 low-power Kryo Silver cores running at 1.8 GHz each

| | Digital signal processing (DSP) and artificial intelligence (AI) engine | Compute Hexagon DSP with dual Hexagon Vector eXtensions (HVX) for:

Video playback enhancements

Virtual reality

Computer vision

Camera snapshot enhancements

Video capture enhancement

Machine learning

This DSP is optimized for handling signal processing tasks efficiently

Hexagon coprocessor 2.0

Additional coprocessor that complements the main CPU and DSP

Vision and imaging hardware accelerator to offload and accelerate the Hexagon
software algorithmic functions

Hexagon Tensor Accelerator

Designed to accelerate tensor-based operations

Commonly used in deep learning and neural networks

| | Always-on subsystem | Always-on subsystem with always-on processor

The hardware-based resource and power management (RPMh) incorporates hardware
accelerators for voltage control and regulation, clock management, and resource
communication | | Low-power island (LPI) with Hexagon DSP | Embedded neuron processor unit (eNPU)/AI accelerator: Embedded AI accelerator
for sensor core and low-power audio use cases | [^1^](https://docs.qualcomm.com/doc/80-23889-1/topic/Introduction.html#fnsrc_1_features) Software enablement for feature packs 2.5 and 3 is under progress. ### Memory | Feature | Description | | --- | --- | | System memory | The memory offers dual-channel non-package-on-package (non-PoP) high-speed
LPDDR5/ LPDDR4X SDRAM

The LPDDR5 SDRAM is optimized for a clock speed of 3200 MHz using a 2 × 16‑bit
configuration

The LPDDR4X SDRAM is optimized for a clock speed of 2133 MHz using a 2 ×
16‑bit configuration

Supports multichip packages (MCP) and discrete DRAMs

| | External memory | UFS 2.x/3.1, two-lane high speed (HS) gear 4

SDv3.0 4 bit for SD card and eMMC 5.1

PCIe1 interface: PCIe1 two-lane, supports non-volatile memory express (NVMe) | | Other internal memory | 172 kB internal memory (IMEM)

512 kB graphics memory (GMEM) | ### Wireless connectivity | Feature | Description | | --- | --- | | Wi-Fi/Bluetooth |

Supported with WCN6750/WCN6856

WLAN standards: 802.11ax, 2 × 2 multiple input, multiple output (MIMO) Wi-Fi
6E

Bluetooth 5.2 compliant

Only WCN6856 supports dual-band simultaneous (DBS)

Multiband GNSS - Integrated Qualcomm^® Location Suite Engine

Global positioning system (GPS), GLONASS, NavIC, BeiDou, Galileo,
quasi-zenith satellite system (QZSS)

Supports GNSS L1 and L5 bands

GNSS engine hardware version: Gen 9 v4

GNSS software version: v20

| ### Multimedia | Feature | Description | | --- | --- | | Display | Adreno display processing unit (DPU) 1075:

: Maximum resolution for
internal panel: FHD+ 144 Hz local tone map (LTM), HDR10+, WCG, improved inline
RoT, rounded corner, SPR, Demura, concurrent writeback – region of interest
(CWB-ROI)

(for all feature packs):
Maximum resolution for internal panel: FHD+ 120 Hz LTM, HDR10+, WCG, improved
inline RoT, rounded corner, SPR, Demura, CWB-ROI

One 4-lane; DSI D-PHY 1.2 or C-PHY 1.2; VESA DSC 1.2

4K60 display support over DisplayPort (USB3 + DisplayPort concurrency)

| | Camera |

Qualcomm Spectra 570 L supports 36 + 22 MP at 30 fps/3 × 22 MP 30 fps ZSL.
It also supports connectivity to multiple cameras due to 5 C-PHY/D-PHY
interfaces

Real-time sensor input resolution: 22 + 22 + 22

3 IFE + 2 IFE lite, 5 concurrent MIPI CSI configurable in 4 + 4 + 4 + 4 + 4
configuration

5x D-PHY v1.2/C-PHY v1.2

feature pack 1 and 2:

Qualcomm Spectra 570 L: 22 + 22 MP at 30 fps ZSL

Qualcomm Spectra 570 L image signal processor (ISP) supports connectivity to
multiple cameras due to 4 C-PHY/D-PHY interfaces

Real-time sensor input resolution: 22 + 22

2 IFE (22 MP + 22 MP) + 2 IFE lite, 4 concurrent MIPI CSI configurable in 4
+ 4 + 4 + 4 configuration

4x D-PHY v1.2/C-PHY v1.2

feature pack 2.5 and 3:

Qualcomm Spectra 570 L: 36 + 22 MP at 30 fps/3 x 22 MP 30 fps ZSL

Qualcomm Spectra 570 L ISP supports connectivity to multiple cameras due to
5 C-PHY/D-PHY interfaces

Real-time sensor input resolution: 22 + 22 + 22

3 IFE (22 MP + 22 MP + 22 MP) + 2 IFE lite, 5 concurrent MIPI CSI
configurable in 4 + 4 + 4 + 4 + 4 configuration

5x D-PHY v1.2/C-PHY v1.2

| | Video | Adreno video processing unit (VPU) 633 – fifth-generation ultra high definition
(UHD)

Video decode up to 4K60 for H.264/H.265/VP9

Video encode: Up to 4K30 for H.264/H.265

Video concurrency: 1080p60 decode and 1080p60 encode/ 4K30 decode + 1080p30
encode

HDR playback: Support for HDR10 and HDR10+

HFR capture: 720p at 480 fps or 1080p at 240 fps

| | Graphics |

: Adreno graphics
processing unit (GPU) 643

: Adreno GPU 642 L

OpenGL ES 3.2, Vulkan 1.x

OpenCL 2.0, DX FL12

| | Audio | Hexagon digital signal processor (DSP) V66M: LPI, improved voice UI
concurrencies, ML hardware accelerator, LPI shared with sensor subsystem

Qualcomm Voice Activation and keyword detection

Echo cancellation and noise suppression (ECNS)

DSP offload for audio playback, including universal serial bus (USB) digital
audio and Bluetooth audio

Codec: WCD9370/WCD9375/WCD9380/WCD9385 high fidelity audio codec

Speaker amplifier: WSA8830/WSA8835 class-H, low-noise smart amplifier | ### Physical interfaces | Interface | Description | | --- | --- | | Qualcomm universal peripheral (QUP) ports | 21: multiplexed serial interface functions | | USB | One USB 3.1 port: Gen 1, 5 Gbps (DisplayPort + data), supports Type-C with
DisplayPort v1.4 and one USB 2.0 HS port | | PCIe |

PCIe0 Gen 3 1-lane for WCN6750/WCN6856

PCIe1 interface: PCIe1 two-lane supports NVMe

| | Secure digital card (SDC) interfaces |

2 ports (SDC1 and SDC2); SD 3.0

SDC2 is dual-voltage

SD/MM card

Universal Flash Storage (UFS)

| | Audio interfaces |

SLIMbus for WCN6750/WCN6856

SoundWire interface (2 Tx and 2 Rx data for codec)

SoundWire microphone support

Dedicated SoundWire interface for smart speaker amplifier

3 digital microphone (DMIC) ports in LPI

5 MI2S with 2x data lanes to support full duplex stereo, or up to 4 channel
Tx/Rx application

One MI2S supports 4 data lanes for up to 8 channels Tx/Rx application

Audio over USB Type-C

4 MIS ports

2 I²S ports SoundWire interface

**WCN6750**

SLIMbus interface for Bluetooth audio

4-wire BT_UART to interface with host

**WCN6856**

Flexible interface SLIMbus/PCM/I²S for Bluetooth audio

4-wire BT_UART or 2-wire BT_USB to interface with the host

| | Touchscreen support | Capacitive panels via external IC (I²C, I3C, SPI, and interrupts) | ### Chipset interfaces | Interface | Description | | --- | --- | | QLink | QLink port for GNSS application | | Power management | 2-line SPMI; plus other lines as needed, via GPIOs, I²C

PM7325, PM7350C, PMK7325/PMK7325-1, PMR735A, PM8008, PM7325B, PM7250B-2, SMB1355,
SMB1393

Note:

PM7250B-2 can only be paired with PMK7325-1

PM7325B can only be paired with PMK7325

QTI recommends using PM7250B-2 + PMK7325-1 combination in the customer design.
For more information, see *QCM6490/QCS6490+ PM7325 + PM7350C + PM7250B-2 Reference Schematic*[(80-20659-44).](https://docs.qualcomm.com/bundle/80-20659-44/resource/80-20659-44.pdf) | | Wireless connectivity | WLAN: PCIe interface SLIMbus

Bluetooth: universal asynchronous receiver-transmitter (UART) interface | | GPIO |

169 GPIO ports

Input configurations: pull-up, pull-down, keeper, or no pull

Output configurations: programmable drive current

Top-level mode multiplexer: provides a convenient way to program groups of
GPIOs

Wake-up capable

| ### Internal functions | Function | Description | | --- | --- | | Security |

Crypto: advance encryption standard (AES)-GCM, hardware elliptic-curve
cryptography (ECC) and RSA, ICE crypto engine v5 (CE5), FIPS/CAVP
certifiable

QFPROM: fuse bits are available for original equipment manufacturer (OEM)
use

Access control: programmable security domain protection and sand-boxing

Secure boot and tools: secure boot with Sectools 2.0; easy to use tool
set

User data encryption: file-based encryption (FBE)

Storage security: secure file system (SFS); fast trusted storage TrustZone:
Qualcomm^® Trusted Execution Environment (TEE) v5.3

DRM: Widevine V16 L1, HDCP v2.3

QTEE services: ISDB-T, IP protection, camera security, trusted UI, DSP
security, device attestation, connection security, trusted location, and
RTIC

| | Boot sources |

Supports the following boot sources:
- Universal serial bus (USB)
- Universal flash storage (UFS)
- Embedded multimedia card (eMMC)

Supports force boot from USB with dedicated GPIO to trigger

| | PLLs and clocks |

Multiple clock regimes; watchdog and sleep timers

Input: 19.2 MHz clock crystal oscillator (CXO)

General-purpose outputs: MN counter and PDM

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