# Part reliability
Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html](https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html)
This topic provides the reliability data, including a definition of the qualification samples
and a summary of qualification test results.
## Reliability qualification summary
Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html](https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html)
The following table provides the reliability evaluation report for QCS6490 and QCS5430 for the foundry source TSMC‑F15.
Table : Silicon reliability results
| Tests, standards, and conditions | Sample size | Result |
| --- | :---: | :---: |
| **ELFR in DPPM**
HTOL: JESD22-A108-A
(Total samples from 3 different wafer lots) | 333 | Pass |
| **HTOL in FIT (** **l** **) failure in billion device hours** HTOL: JESD22-A108-A
(Total samples from 3 different wafer lots) | 333 | Pass |
| **Mean time to failure (MTTF) t =** **1** **/** **l in million hours**
(Total samples from 3 different wafer lots) | 333 | > 20 |
| **ESD – human-body model (HBM) rating**
JS001-2017
(Total samples from 1 wafer lot) | 21 | Pass
±1 kV |
| **ESD – charged-device model (CDM) rating**
JS-002-2014
(Total samples from 1 wafer lot) | 6 | Pass
± 250 V |
| **Latch-up (I-test)**: EIA/JESD78E
Trigger current: ±100 mA; temperature: 85°C
(Total samples from 1 wafer lot) | 6 | Pass
Class II, Level A |
| **Latch-up (Vsupply overvoltage)**: EIA/JESD78E
Trigger voltage: Each VDD pin, stress at 1.5 × Vddmax per device specification; temperature: 85°C
(Total samples from 1 wafer lot) | 6 | Pass
Class II, Level a |
The following table provides the package reliability results for QCS6490 and QCS5430.
Table : Package reliability results
| Tests, standards, and conditions | ASE sample size | SPIL sample size | SCK sample size | Results |
| :---: | :---: | :---: | :---: | :---: |
| **Moisture resistance test (MRT)**: J-STD-020C
MSL3, reflow at 260 +0/-5°C
(Total samples from 3 different assembly lots) | 2205 | 2205 | 2250 | Pass |
| **Temperature cycle:** JESD22-A104
Temperature: -55°C to 125°C; number of cycles: 1000
Soak time at minimum/maximum temperature: 8–10 minutes
Cycle rate: 2 cycles per hour (cph)
Preconditioning: JESD22-A113-H
MSL3, reflow temperature: 260 +0/-5°C
(Total samples from 3 different assembly lots) | 765 | 765 | 765 | Pass |
| **Unbiased highly accelerated stress test**: JESD22-A118
130°C/85% RH and 96‑hour duration
Preconditioning: JESD22-A113-H
MSL3, reflow temperature: 260 +0/-5°C
(Total samples from 3 different assembly lots) | 715 | 715 | 715 | Pass |
| **Biased highly accelerated stress test**: JESD22-A110
130°C/85% RH and 96‑hour duration
Preconditioning: JESD22-A113-H
MSL3, reflow temperature: 260 +0/-5°C
(Total samples from 3 different assembly lots) | 360
Pass | 360 | 351 | Pass |
| **High-temperature storage life**: JESD22-A103
Temperature 150°C, 500, 1000 hours
(Total samples from 3 different assembly lots) | 765 | 765 | 765 | Pass |
| **Flammability**
Note: Flammability test – not required
UL-STD-94 | – | – | – | Note [^1^](https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html#fntarg_1_reliability-evaluation-summary) |
| **Physical dimensions**: JESD22-B100-A
Case outline drawing: QTI internal document
(Total samples from 3 different assembly lots at each SAT) | 30 | 30 | 30 | Pass |
| **Die shear**
MIL-STD-883E, Method 2019
(Total samples from 3 different assembly lots at each SAT) | 30 | 30 | 30 | Pass [^2^](https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html#concept.dita_77d8420b-5f99-4843-a1f9-7ac9c5024b11__fn_lhy_dgk_tpb) |
| **Solder bump shear**
(Total samples from 3 different assembly lots at each SAT) | 30 | 30 | 30 | Pass [^2^](https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html#concept.dita_77d8420b-5f99-4843-a1f9-7ac9c5024b11__fn_lhy_dgk_tpb) |
| **Solder ball shear**: JESD22-B117
(Total samples from 3 different assembly lots at each SAT) | 30 | 30 | 30 | Pass [^2^](https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html#concept.dita_77d8420b-5f99-4843-a1f9-7ac9c5024b11__fn_lhy_dgk_tpb) |
| Internal/external visual
(Total samples from 3 different assembly lots at each SAT) | 30 | 30 | 30 | Pass |
[^1^](https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html#fnsrc_1_reliability-evaluation-summary) Qualcomm Technologies, Inc. (QTI) ICs are exempt from the
flammability requirements due to their sizes per UL/EN 60950-1, as long as they are
mounted on materials rated V-1 or better. Most PWBs onto which QTI ICs are mounted,
are rated V-0 (better than V-1).
^2^ Data is based on other previously qualified PSP
packages that are similar to this configuration.
## Qualification sample description
Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html](https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html)
The following table provides details of the category and definition of the device.
Table : Device characteristics
| Category | Definition |
| :---: | :---: |
| Device name | QCS6490 and QCS5430 |
| Package type | 1287 PSP |
| Package body size | 14.0 × 12.0 × 0.91 mm |
| Ball count | 1287 |
| Ball composition | SAC125/Ni |
| Fab process | 6 nm |
| Supply sources (fab sites) | TSMC |
| Assembly sites | ASE, Taiwan; JCET STATS ChipPAC, Korea; SPIL, Taiwan |
| Solder ball pitch | 0.35 mm |
Last Published: Sep 23, 2025
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