# PCB mounting guidelines

Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-23889-1/topic/pcb-mounting-guidelines.html)

This topic provides specifications for mounting the QCS6490 and QCS5430 onto
      PCBs.

## RoHS compliance

Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-23889-1/topic/pcb-mounting-guidelines.html)

This device meets the substance restriction requirements of the EU RoHS directive. For solder
      ball composition, see [Table : Device characteristics](https://docs.qualcomm.com/doc/80-23889-1/topic/part-reliability.html#concept_tvp_1dt_l1c__table_2).

For more information, see [<cite class="cite">Product Material Declaration - QCS6490</cite>
        (80-VG591-393C)](https://docs.qualcomm.com/bundle/80-VG591-393C/resource/80-VG591-393C.pdf)  and [<cite class="cite">Product Material Declaration - QCS5430</cite>
        (80-VG591-433C)](https://docs.qualcomm.com/bundle/80-VG591-433C/resource/80-VG591-433C.pdf) that provides RoHS and other product environmental governance
      details.

## SMT assembly guidelines

Source: [https://docs.qualcomm.com/doc/80-23889-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-23889-1/topic/pcb-mounting-guidelines.html)

For recommendations on SMT process development, see [<cite class="cite">SMT Assembly Guidelines</cite> (SM80-P0982-1)](https://docs.qualcomm.com/bundle/SM80-P0982-1/resource/SM80-P0982-1.pdf).

Last Published: Sep 23, 2025

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