# Introduction Source: [https://docs.qualcomm.com/doc/80-70014-251/topic/introduction.html](https://docs.qualcomm.com/doc/80-70014-251/topic/introduction.html) The Qualcomm^®^ RB3 Gen 2 Development Kit accelerates the creation of high-performance devices for enterprise, industrial, and professional service applications. It simplifies the training and development of machine learning applications. A variety of expansion boards, SDKs, and development tools are available for rapid prototyping and evaluations. This guide details the Qualcomm RB3 Gen 2 Development Kit hardware connectors, DIP switches, and GPIOs. It is a reference for all users. **This information is also available in [Simplified Chinese](https://docs.qualcomm.com/bundle/publicresource/topics/80-70014-251Y).** Note: Some of the interfaces on the RB3 Gen 2 device are yet to be enabled; for information about feature availability and limitations, see the latest [Release Notes](https://docs.qualcomm.com/bundle/publicresource/topics/RNO-240626095531/ReleaseNote.html). Last Published: Jan 28, 2026 [Next Topic Hardware overview](https://docs.qualcomm.com/bundle/publicresource/80-70014-251/topics/rb3_hardware_overview.md)