# References

Source: [https://docs.qualcomm.com/doc/80-70014-251/topic/references.html](https://docs.qualcomm.com/doc/80-70014-251/topic/references.html)

- **[Low-speed and high-speed expansion connectors](https://docs.qualcomm.com/doc/80-70014-251/topic/low_speed_high_speed_expansion_connectors.html)**  

This section provides tables listing the functionalities, pin numbers, GPIOs, and         additional details for each low-speed and high-speed connector on the RB3 Gen 2         mainboard.
- **[DIP switches](https://docs.qualcomm.com/doc/80-70014-251/topic/rb3_dip_switches.html)**  

This section provides details and shows the location of the DIP switches on the         mainboard, interposer, and vision mezzanine.
- **[QCS6490 thermal testing and results](https://docs.qualcomm.com/doc/80-70014-251/topic/thermal_testing.html)**
- **[Related documents](https://docs.qualcomm.com/doc/80-70014-251/topic/rel-docs.html)**  

List of reference documents and drawings.
- **[Acronyms and terms](https://docs.qualcomm.com/doc/80-70014-251/topic/acronyms_and_terms.html)**  

List of acronymns and terms used in this document.

Last Published: Jan 28, 2026

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