# 参考资料

- [低速和高速扩展接口](https://docs.qualcomm.com/doc/80-70015-251Y/topic/low_speed_high_speed_expansion_connectors.html)
    - [低速扩展接口 1 (LS1)](https://docs.qualcomm.com/doc/80-70015-251Y/topic/low_speed_high_speed_expansion_connectors.html#ls1)
    - [低速扩展接口 2 (LS2)](https://docs.qualcomm.com/doc/80-70015-251Y/topic/low_speed_high_speed_expansion_connectors.html#ls2)
    - [低速扩展接口 3 (LS3)](https://docs.qualcomm.com/doc/80-70015-251Y/topic/low_speed_high_speed_expansion_connectors.html#ls3)
    - [高速扩展接口 1 (HS1)](https://docs.qualcomm.com/doc/80-70015-251Y/topic/low_speed_high_speed_expansion_connectors.html#hs1)
    - [高速扩展接口 2 (HS2)](https://docs.qualcomm.com/doc/80-70015-251Y/topic/low_speed_high_speed_expansion_connectors.html#hs2)
    - [高速扩展接口 3 (HS3)](https://docs.qualcomm.com/doc/80-70015-251Y/topic/low_speed_high_speed_expansion_connectors.html#hs3)
- [DIP 开关](https://docs.qualcomm.com/doc/80-70015-251Y/topic/rb3_dip_switches.html)
    - [主板 DIP 开关](https://docs.qualcomm.com/doc/80-70015-251Y/topic/rb3_dip_switches.html#id1)
    - [转接板 DIP 开关](https://docs.qualcomm.com/doc/80-70015-251Y/topic/rb3_dip_switches.html#interposer-dip-switch-selection)
- [温控测试和结果](https://docs.qualcomm.com/doc/80-70015-251Y/topic/thermal_testing.html)
    - [测试环境](https://docs.qualcomm.com/doc/80-70015-251Y/topic/thermal_testing.html#id3)
    - [测试场景 - 示例 1](https://docs.qualcomm.com/doc/80-70015-251Y/topic/thermal_testing.html#id4)
    - [测试用例](https://docs.qualcomm.com/doc/80-70015-251Y/topic/thermal_testing.html#id5)
    - [常见问题解答](https://docs.qualcomm.com/doc/80-70015-251Y/topic/thermal_testing.html#id9)
- [相关文档](https://docs.qualcomm.com/doc/80-70015-251Y/topic/rel-docs.html)
- [缩略词和术语](https://docs.qualcomm.com/doc/80-70015-251Y/topic/acronyms_and_terms.html)

Last Published: Jan 23, 2025

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