# Overview

Source: [https://docs.qualcomm.com/doc/80-70015-30/topic/thermal-overview.html](https://docs.qualcomm.com/doc/80-70015-30/topic/thermal-overview.html)

Thermal management is a configurable framework that allows you to control the
        temperature of the entire device, ensuring reliability of the device. It aids in maintaining
        the junction and surface temperatures of the device within specified limits even when
        running high workload applications.

This guide provides information about:
- Thermal architecture
- Heat dissipation techniques supported on Qualcomm Linux
- Tuning of thermal thresholds for mitigation based on the thermal requirements of
                    the product
- Sending a notification to the user space
- Features to adjust temperature configurations to achieve the required thermal
                        behavior
Note: See [Hardware SoCs](https://docs.qualcomm.com/bundle/publicresource/topics/80-70015-115/soc.html) that are supported
                        on Qualcomm Linux.

**Parent Topic:** [Thermal management](https://docs.qualcomm.com/doc/80-70015-30/topic/thermalmanagement.html)

Last Published: Oct 16, 2024

[Previous Topic
Thermal management](https://docs.qualcomm.com/bundle/publicresource/80-70015-30/topics/thermalmanagement.md) [Next Topic
Getting started](https://docs.qualcomm.com/bundle/publicresource/80-70015-30/topics/get-started-thermal.md)