# RB3 Gen 2 开发套件文档 Qualcomm® RB3 Gen 2 开发套件的组件、布局、硬件接口、DIP 开关和 GPIO 的位置和描述。 ## 简介 [简介](https://docs.qualcomm.com/doc/80-70018-251Y/topic/introduction.html#introduction) 观看此视频，了解 RB3 Gen 2 开发套件。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/introduction.html#introduction ## 硬件概述 [LED 状态灯和按钮](https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_mainboard_leds_and_buttons_2.html#leds-buttons) 显示主板上 LED 和按钮的位置。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_mainboard_leds_and_buttons_2.html#leds-buttons [接口](https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_mainboard_connectors2.html#connectors) 显示主板和转接板上接口的位置。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_mainboard_connectors2.html#connectors [机器视觉 mezzanine](https://docs.qualcomm.com/doc/80-70018-251Y/topic/vision_mezzanine2.html#vision-mezzanine) 关键组件列表和框图。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/vision_mezzanine2.html#vision-mezzanine [传感器](https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_hardware_overview.html#sensors) 主板和机器视觉 mezzanine 上的传感器列表。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_hardware_overview.html#sensors [以太网](https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_hardware_overview.html#ethernet) 展示以太网接口的位置并提供以太网功能的说明。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_hardware_overview.html#ethernet [主板 RF 天线](https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_mainboard_rf_antennas2.html#mainboard-rf-antennas) 显示主板和转接板上 RF 天线的位置。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_mainboard_rf_antennas2.html#mainboard-rf-antennas ## 上电与断电重启 [主板电源](https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_mainboard_power.html#mainboard-power) 为设备上电。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_mainboard_power.html#mainboard-power ## 强制 RB3 进入紧急下载模式 [EDL模式](https://docs.qualcomm.com/doc/80-70018-251Y/topic/rb3_gen2_force_edl_mode.html#force-edl) 强制设备进入紧急下载 (EDL) 模式。 ## 参考资料 [低速和高速扩展接口](https://docs.qualcomm.com/doc/80-70018-251Y/topic/references.html#ls-hs-connectors) 显示低速 (LS) 和高速 (HS) 接口位置、GPIO 和引脚编号。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/references.html#ls-hs-connectors [DIP 开关](https://docs.qualcomm.com/doc/80-70018-251Y/topic/references.html#dip-switches) 显示 DIP 开关位置和功能描述。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/references.html#dip-switches 温控测试和结果有关 RB3 Gen 2 热测试用例和结果的详细信息。 [定制相机传感器](https://docs.qualcomm.com/doc/80-70018-251Y/topic/references.html#custom-camera-sensor) 将定制摄像头传感器与 RB3 Gen 2 设备相连。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/references.html#custom-camera-sensor 参考设计及相关文档查找参考设计、原理图和文档。 [缩略词和术语](https://docs.qualcomm.com/doc/80-70018-251Y/topic/references.html#acronyms-and-terms) 本文档中使用的缩略词和术语列表。 https://docs.qualcomm.com/doc/80-70018-251Y/topic/references.html#acronyms-and-terms Last Published: Feb 11, 2026 [Next Topic 简介](https://docs.qualcomm.com/bundle/publicresource/80-70018-251Y/topics/introduction.md)