# Audio overview The audio subsystem powered by low-power AI (LPAI) delivers voice UI and audio experiences. It uses a dedicated hardware-based AI accelerator for machine learning-based work. VBackground-1 Solid Page-1 Sheet.28 Sheet.1 Sheet.22 Interfaces Interfaces Sheet.2 Application DSP Application DSP Sheet.5 Application DSP firmware Application DSP firmware Sheet.6 TDM TDM Sheet.7 MI2S MI2S Sheet.8 SoundWire SoundWire Sheet.10 Application processor Application processor Sheet.11 Multimedia framework/kernel drivers Multimedia framework/kernel drivers Dynamic connector.16 Dynamic connector.18 Sheet.15 Audio record Audio record Sheet.16 Audio playback Audio playback Sheet.17 Sheet.23 Codec Codec Dynamic connector Dynamic connector.25 Dynamic connector.26 Dynamic connector.27 Sheet.29 Audio component overview The audio system includes: - **Application processor** – CPU that handles audio processing tasks. Tasks include: - Managing audio record and playback - Decoding audio formats - Using LPAI for postprocessing tasks - **Low-Power AI (LPAI)** – Subsystem that runs audio playback/record and voice-activation (VA) algorithms. It integrates with a dedicated Qualcomm® Hexagon™ Processor (QDSP6) and a low-power island (LPI). - **Audio codec** – Hardware that includes: - Analog-to-Digital Converter (ADC) - Digital-to-Analog Converter (DAC) These convert analog audio to digital, and vice versa. - **Speaker AMP and microphone** – Devices that connect over I2S/TDM/SoundWire. ## Architecture The following figure shows the high-level audio software architecture. VBackground-1 Solid Page-1 Sheet.117 Legend Legend Sheet.19 Application layer Application layer Sheet.21 Middleware layer Middleware layer Sheet.25 Hardware abstraction layer Hardware abstraction layer Sheet.26 Kernel space Kernel space Sheet.27 LPAI LPAI Sheet.41 PC PC Sheet.1 PipeWire Pulse PipeWire Pulse Sheet.4 PAL PAL Sheet.5 ARGS ARGS Sheet.8 AGM AGM Sheet.9 TinyALSA TinyALSA Sheet.10 Application Application Can ACDB Sheet.12 ACDB Sheet.15 QACT QACT Sheet.16 ASOC ASOC Sheet.17 SPF SPF Sheet.18 Codec Codec Dynamic connector Dynamic connector.42 USB USB Dynamic connector.43 Dynamic connector.44 Dynamic connector.46 Dynamic connector.51 Dynamic connector.52 Sheet.57 Sheet.94 Sheet.95 Dynamic connector.96 Dynamic connector.97 Dynamic connector.98 Dynamic connector.101 Sheet.102 Qualcomm Qualcomm Sheet.104 Open source Open source Sheet.105 Hardware Hardware Sheet.106 Data flow Data flow Sheet.107 Data + control Data + control Sheet.108 Control Control Dynamic connector.111 Dynamic connector.112 Sheet.113 Sheet.114 Sheet.1001 PipeWire PAL plugin PipeWire PAL plugin Sheet.1002 GStreamer GStreamer Dynamic connector.1006 Dynamic connector.1017 Sheet.1019 PipeWire PipeWire Dynamic connector.1020 Dynamic connector.1021 Dynamic connector.1024 Dynamic connector.1025 Dynamic connector.1026 High-level audio software architecture The following are the major audio software architecture components: [PipeWire](https://docs.qualcomm.com/doc/80-70030-16/topic/enable-audio.html#enable-pipewire) PipeWire is a multimedia server for Linux that routes audio between Apps and hardware. It replaces PulseAudio, offering low-latency, secure, and flexible media handling for applications. [Platform Abstraction Layer (PAL)](https://docs.qualcomm.com/doc/80-70030-16/topic/pal.html#pal) Provides higher-level audio-specific APIs to access the audio hardware and drivers to enable audio features. [Audio Graph Manager (AGM)](https://docs.qualcomm.com/doc/80-70030-16/topic/agm.html#agm) Provides interfaces to allow TinyALSA-based mixer controls and PCM/compressed plug-ins to interact and enable audio features. [AudioReach Graph Service (ARGS)](https://docs.qualcomm.com/doc/80-70030-16/topic/agm.html#args) Consists of the Graph Service Layer (GSL), Generic Packet Router (GPR), and acdb Management Layer (AML) modules. Handles initialization and creation of graphs, and creation of packets for sending a series of commands to the signal processing framework (SPF). [Audio calibration database (acdb)](https://docs.qualcomm.com/doc/80-70030-16/topic/agm.html#section-rhd-fg4-zbc) Includes information about various audio use cases such as graphs, module calibration data, etc. The Apps processor parses acdb files to get the graph information used by SPF to enable the use case. [Signal Processing Framework (SPF)](https://docs.qualcomm.com/doc/80-70030-16/topic/agm.html#spf-sw) Modular framework that runs on the LPAI DSP. It helps set up, configure, and run signal processing modules for audio features. [Qualcomm Audio Calibration Tool (QACT™ Platform)](https://docs.qualcomm.com/doc/80-70030-16A/topic/tools.html) PC-based software that provides a GUI to visualize, configure, and store audio graphs in the acdb for audio use cases. Last Published: Jun 17, 2026 [Previous Topic Audio documentation](https://docs.qualcomm.com/bundle/publicresource/80-70030-16/topics/audio.md) [Next Topic Enable audio](https://docs.qualcomm.com/bundle/publicresource/80-70030-16/topics/enable-audio.md)