# Carrier, handling, and storage information
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
## Tape and reel information
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
All QTI tape carrier systems conform to EIA-481 standards. A simplified sketch of the QCS9075 tape carrier is shown in the following figure including the
proper part orientation, maximum number of devices per reel, and key dimensions
Tape-handling recommendations are shown in the following figure.
## Matrix tray information
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
All QTI matrix tray carriers confirm to JEDEC standards.
The device pin 1 is oriented to the chamfered corner of the matrix tray.
All matrix tray media is available for sampling only. Production is supported on tape and
reel.
| Key dimensions (mm) | Key dimensions (mm) |
| --- | --- |
| Array | 4 × 11 (44) |
| M | 26.70 |
| M1 | 20.00 |
| M2 | 27.50 |
| M3 | 27.50 |
## Storage
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
### Bagged storage conditions
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
QCS9075 devices delivered in tape and reel carriers must be stored in
sealed, moisture barrier, anti-static bags. See [IC Products Packing Method (80-VK055-1)](https://docs.qualcomm.com/bundle/80-VK055-1/resource/80-VK055-1.pdf)
for the expected shelf life.
### Out-of-bag duration
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
The out-of-bag duration is the time a device can be on the factory floor before being
installed onto a PCB. It is defined by the device MSL rating, as described in [Device moisture sensitivity level](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#topic.dita_d5ae67e0-e04d-4a55-8d09-3bf87bf30594).
## Handling
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
Tape handling was described in [Tape and reel information](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html#concept_qjy_vxl_bbc). Other (IC-specific) handling guidelines are presented
in the following subsections.
### Baking
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
It is not necessary to bake the QCS9075 if the conditions specified
in [Bagged storage conditions](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html#concept_edf_zgr_bbc) and [Out-of-bag duration](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html#concept_qq5_mjr_bbc) have not been
exceeded.
It is necessary to bake the QCS9075 if any condition specified in
[Bagged storage conditions](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html#concept_edf_zgr_bbc) or [Out-of-bag duration](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html#concept_qq5_mjr_bbc) has been exceeded. The
baking conditions are specified on the moisture-sensitive caution label attached to each
bag; see the [IC Products Packing Method (80-VK055-1)](https://docs.qualcomm.com/bundle/80-VK055-1/resource/80-VK055-1.pdf)
document for details.
CAUTION: If baking is required, the devices must be transferred into trays that can be
baked to at least 125°C for 24 hours. Devices should not be baked in tape and reel
carriers at any temperature.
### Electrostatic discharge
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
Electrostatic discharge (ESD) occurs naturally in laboratory and factory environments. An
established high-voltage potential is always at risk of discharging to a lower
potential. If this discharge path is through a semiconductor device, destructive damage
may result.
ESD counter measures and handling methods must be developed and used to control the
factory environment at each manufacturing site.
QTI products must be handled according to the ESD Association standard: ANSI/ESD
S20.20-1999, *Protection of Electrical and Electronic Parts, Assemblies, and Equipment*
See [Reliability qualifications summary](https://docs.qualcomm.com/doc/80-73417-1/topic/Part-reliability.html#concept_lsk_yjh_kbc) for the QCS9075 ESD ratings.
## Bar code label and packing for shipment
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/carrier-storage-and-handling-information.html)
See the [IC Products Packing Method (80-VK055-1)](https://docs.qualcomm.com/bundle/80-VK055-1/resource/80-VK055-1.pdf)
document for all packing-related information, including bar code label details.
Last Published: Jan 30, 2026
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