# Carrier, storage, and handling information
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
## Tape and reel information
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
All QTI tape carrier systems conform to EIA-481 standards.
A simplified sketch of the QCS8275 tape carrier is shown in the
following figure including the proper part orientation, maximum number of devices per
reel, and key dimensions.
Figure : Carrier tape drawing with part orientation
Tape-handling recommendations are shown in the following figure.
Figure : Tape handling
## Matrix tray information
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
All QTI matrix tray carriers confirm to JEDEC standards.
The device pin 1 is oriented to the chamfered corner of the matrix tray.
All matrix tray media is available for sampling only. Production is supported on tape and
reel.
| Key dimensions (mm) | Key dimensions (mm) |
| --- | --- |
| Array | 4 × 11 (44) |
| Standard bundle | 5 + 1 trays (220 units) |
| M | 26.70 |
| M1 | 20.00 |
| M2 | 27.50 |
| M3 | 27.50 |
Figure : Matrix tray part orientation
## Device moisture sensitivity level
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
Non-hermetically sealed packages are susceptible to damage induced by absorbed moisture
and high temperature. A package’s moisture sensitivity level (MSL) indicates its ability
to withstand exposure after it is removed from its shipment bag, while it is on the
factory floor awaiting PCB installation. A low MSL rating is better than a high rating;
a low MSL device can be exposed on the factory floor longer than a high MSL device. All
pertinent MSL ratings are summarized in the following table.
Table : MSL ratings summary
| MSL | Out-of-bag floor life | Comments |
| --- | --- | --- |
| 1 | Unlimited | ≤ 30°C/85%RH |
| 2 | 1 year | ≤ 30°C/60%RH |
| 2a | 4 weeks | ≤ 30°C/60%RH |
| 3 | 168 hours | ≤ 30°C/60%RH, QCS8275 target rating |
| 4 | 72 hours | ≤ 30°C/60%RH |
| 5 | 48 hours | ≤ 30°C/60%RH |
| 5a | 24 hours | ≤ 30°C/60%RH |
| 6 | Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label. | ≤ 30°C/60%RH |
QTI follows the latest IPC/JEDEC J-STD-020 standard revision for
moisture-sensitivityqualification. ***The QCS8275 devices are targeted as MSL3; the qualification temperature was 255°C.***
## Bagged storage conditions
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
QCS8275 devices delivered in tape and reel carriers must be
stored in sealed, moisture barrier, anti-static bags. See [IC Products Packing Method (80-VK055-1)](https://docs.qualcomm.com/bundle/80-VK055-1/resource/80-VK055-1_REV_HD_IC_Products_Packing_Method.pdf) for the expected shelf life.
## Out-of-bag duration
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
The out-of-bag duration is the time a device can be on the factory floor before being
installed onto a PCB. It is defined by the device MSL rating, as described in [Device moisture sensitivity level](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html#concept_in5_t2z_szb).
## Handling
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
Tape handling was described in [Tape and reel information](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html#concept_cgx_q3z_szb). Other
(IC-specific) handling guidelines are presented in the following subsections.
### Baking
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
It is not necessary to bake the QCS8275 if the conditions
specified in [Bagged storage conditions](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html#concept_cdx_1b5_tzb) and [Out-of-bag duration](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html#concept_adg_gb5_tzb) have not been exceeded. It is necessary to bake
the QCS if any condition specified in [Bagged storage conditions](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html#concept_cdx_1b5_tzb) or
[Out-of-bag duration](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html#concept_adg_gb5_tzb) has been exceeded. The baking conditions are
specified on the moisture-sensitive caution label attached to each bag; see the [IC Products Packing Method (80-VK055-1)](https://docs.qualcomm.com/bundle/80-VK055-1/resource/80-VK055-1_REV_HD_IC_Products_Packing_Method.pdf) document for details.
CAUTION: If baking is required, the devices must be transferred into trays that can be
baked to at least 125°C for 12 hours. Devices should not be baked in tape and reel
carriers at any temperature.
### Electrostatic discharge
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
Electrostatic discharge (ESD) occurs naturally in laboratory and factory environments. An
established high-voltage potential is always at risk of discharging to a lower
potential. If this discharge path is through a semiconductor device, destructive damage
may result.
ESD counter measures and handling methods must be developed and used to control the
factory environment at each manufacturing site.
QTI products must be handled according to the ESD Association standard: ANSI/ESD
S20.20-1999, Protection of Electrical and Electronic Parts, Assemblies, and
Equipment.
## Bar code label and packing for shipment
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html](https://docs.qualcomm.com/doc/80-73475-1/topic/carrier.html)
See the [IC Products Packing Method (80-VK055-1)](https://docs.qualcomm.com/bundle/80-VK055-1/resource/80-VK055-1_REV_HD_IC_Products_Packing_Method.pdf) document for all packing-related
information, including bar code label details.
Last Published: Jan 08, 2026
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