# Mechanical information
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html)
This topic provides IC mechanical information including dimensions, markings, ordering information, and thermal characteristics.
## Device physical dimensions
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html)
The QCS8275 device is available in the FCBGA1326+HS, with a
25.0 mm × 25.0 mm body and a maximum height of 2.76 mm. Pin A1 is located by an indicator mark
on the top of the package, and by the ball pattern when viewed from below. The following
figure shows a simplified version of the package outline drawing.
Click the [QCS8275 Package Outline
Drawing, FCBGA1326+HS, 25.0 × 25.0 × 2.76 mm, L1620, S716, PL1, HS1
(NT90-31845-1)](https://docs.qualcomm.com/bundle/NT90-31845-1/resource/NT90-31845-1.pdf) to download the drawing.
Figure : Simplified FCBGA1326+HS outline drawing
## Part marking
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html)
Figure : QCS8275 device marking (top view, not to scale)
| Line | Marking | Description |
| --- | --- | --- |
| C1 | Qualcomm | Qualcomm name |
| P1 | PRODUCT | Qualcomm Technologies, Inc. (QTI) product name
XXX = traceability number |
| | | |
## Device ordering information
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html)
The Oracle short description is used to order QTI products, and is present on both the
customer label and this document. The short description includes the product name,
configuration code, package type, product revision code, source code, and feature
code/program ID of the part. This device can be ordered using the identification code
shown in the following table.
Table : Example device identification code
| Device ID code | AAA-**AAAA** | -P | -TTTTTT | NNNN | A | +FF | -EE | -RR | -S[^1^](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html#fntarg_1_device-ordering-information) | -BB or
-PID[^2^](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html#fntarg_2_device-ordering-information) |
| :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: |
| Symbol definition | Product name | Configuration code | Package type | Number of pins | Package variable | Additional package information | Shipping package | Product revision | Source code | Feature code |
| Example | QCS-8275 | -0 | -FCBGA | 1326 | | +HS | -MT | -00 | -0 | -AA |
[^1^](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html#fnsrc_1_device-ordering-information) Source code is always '0'.
[^2^](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html#fnsrc_2_device-ordering-information) The feature code (BB) and the program ID (PID) are mutually
exclusive. A product may have one of them or none of them, but
it will never have both. If there is no feature code/program ID,
this field is blank, and the Oracle short description ends after
the source configuration code (S).
For example: QCS-8275-0-FCBGA1326+HS-MT-00-0-AA
[Table : Example device identification code](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html#concept_rrc_h1z_szb__table_mzh_4x3_nzb_radhikav_11-22-23-1223-56-978) shows the current
package-type nomenclature. For legacy parts, the Oracle short description has the
position of package type and number of pins reversed.
## Device identification for each sample type
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html)
Device identification details for all samples available to date are summarized in the
following table.
Table : Device identification details
| Device | Sample type | Variant (PRR-BB)
| 000-AC | 0x4 | 0x0 02E7 0E1 | v1.0 | 0 | QCS8275, Octa Kryo Gen6, Adreno GPU 623, neural signal processor, 4 × 16-bit LPDDR5, IoT low, 2 × PMIC |
[^1^](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html#fnsrc_1_device-identification-for-each-sample-type) BB is the feature code that identifies an IC’s
specific feature set, which distinguishes it from other versions
or variants. Feature sets are detailed in the comments
column.
[^2^](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html#fnsrc_2_device-identification-for-each-sample-type) The FEATURE\_ID combined with the hardware revision
number (JTAG\_ID) defines unique product variants. This information
is shown for situations where other device identification
information (such as device marking information) is not easily
accessible.
[^3^](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html#fnsrc_3_device-identification-for-each-sample-type) S is the source configuration code
that identifies all of the qualified die fabrication-source/assembly
site combinations available when the particular sample type was
shipped.
## Daisy chain devices
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html)
For daisy chain part information, contact the Qualcomm Sales team for support.
## Thermal characteristics
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html)
Rather than providing thermal resistance values θJC and θJA,
validated thermal package models are provided through the Qualcomm website. Designers
can extract thermal resistance values by conducting their own thermal simulations.
Note:
Click the following link to download the QCS8275 thermal
package model from the Qualcomm website.
[QCS8275 Package Thermal Models (Icepak,
FloTHERM, And 6Sigma) (HS11-73475-5HW)](doc/HS11-73475-5HW/HS11-73475-5HW.zip)
## Package loading during heat sink attachment
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html)
The following table specifies the maximum static load.
Table : Maximum loading specification
| Component | Loading |
| :---: | :---: |
| QCS8275 | 56 N |
Note: Loading should be compressive and non-zero in
magnitude. Tensile loads should be avoided on the SoC during and post-SMT and mechanical
assembly.
The maximum static compressive load should not exceed 56 N.
The specification above has been determined through limited compressive testing with
uniform loading applied perpendicular to the integrated heat spreader lid surface of the
package at 125°C up to 2000 hours. It was determined that the above load recommendation
is within safe working limits to ensure negligible solder ball collapse and BGA shorting
risk. The end user is encouraged to validate the acceptable loading range based on
intended application, motherboard, and heat sink attach configurations.
## Board flexure guidance
Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html)
The following table specifies the maximum strain limit of the PCB
after SMT assembly.
Table : Maximum strain specification
| Parameter | Value |
| :---: | :---: |
| Maximum PCB flexure | 500 µε |
This value is based on testing according to IPC/JEDEC-9707 using a 1.6 mm thick test
board, to ensure no mechanical damage to the SoC or the solder interconnects that attach
the SoC to the PCB.
Last Published: Jan 08, 2026
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