# PCB mounting guidelines

Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73480-1/topic/pcb-mounting-guidelines.html)

This topic provides specifications for mounting the QCS615 onto
      PCBs.

## RoHS compliance

Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73480-1/topic/pcb-mounting-guidelines.html)

This device meets the substance restriction requirements of the EU RoHS directive. Its
      Sn/Ag/Cu solder balls use SAC405/Ni composition. A product material declaration (PMD) that
      provides RoHS and other product environmental governance information is published when the
      data is available.

## SMT assembly guidelines

Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73480-1/topic/pcb-mounting-guidelines.html)

For recommendations on SMT process development, see [<cite class="cite">SMT Assembly Guidelines (SM80-P0982-1)</cite>](https://docs.qualcomm.com/bundle/SM80-P0982-1/resource/SM80-P0982-1.pdf).

Last Published: Mar 09, 2026

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