# Overview
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/introduction.html](https://docs.qualcomm.com/doc/80-78831-1/topic/introduction.html)
This topic provides the module component information, high-level functional block
diagram, and the device features.
## Product overview
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/introduction.html](https://docs.qualcomm.com/doc/80-78831-1/topic/introduction.html)
Powered by Qualcomm high performance 1x1 2.4 GHz Wi-Fi 6/Bluetooth 5.4/802.15.4 combo
all-in-one SoC QCC744, Qualcomm QCC744M LGA module is
purposely designed to pack processing capabilities, Wi-Fi/Bluetooth/802.15.4 combo
connectivity, and on-module memory into a single 46-pin LGA form factor.
QCC744M has an integrated powerful 32‑bit RISC-V processor with FPU and DSP
running up to 325 MHz, on-chip 484 KB SRAM and 128 KB ROM, optional 4/8MB pSRAM, and
8/16MB flash System-in-Package (SiP), multimedia features such as audio and video codec
and interfaces, and 35x multiplexed GPIO rich peripherals. Its all-in-one design and
capability contribute to reduced costs and enhanced performance, making it an attractive
choice for IoT edge devices requiring single chip solution.
QCC744M operates in hostless mode, capable of running both the protocol
stack all the way to application level as well as IoT applications without requiring an
external MCU. Built on FreeRTOS, its software SDK is open-sourced on codelinaro coupled
with VS Code IDE market extension to facilitate rapid IoT application development. It
can also be used as an IoT connectivity transceiver in hosted mode with an external host
running all upper protocol stacks and applications.
## QCC744M functional block diagram
QCC744M integrates 8/16/32MB 3x4 WSON NOR Flash and optional 32KHz RTC
crystal. The design also supports PCB antenna to allow customized antenna implementation
on the motherboard. The block diagram is shown below.
Note:
- To support BLE connection retention in low power mode, connect an external 32KHz
sleep clock source crystal to GPIO 16 and GPIO 17, or an oscillator to GPIO 17.
For further details, please consult the Qualcomm support team.
- Power-on sequence for bootstrap pins CHIP\_EN and Boot (GPIO2): The
requirement is that the CHIP\_EN pin should come up after a 3.3ms delay from
the Boot pin. To achieve this, an RC circuit on the CHIP\_EN pin is required
in the customer design for hostless mode. In hosted mode, this power-up
sequence should be managed by the MCU pin connected to the CHIP\_EN pin. For
further details, please consult the Qualcomm support team.
## QCC744M features
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/introduction.html](https://docs.qualcomm.com/doc/80-78831-1/topic/introduction.html)
| Features | Capability | Capability | Capability | Capability |
| --- | --- | --- | --- | --- |
| Microcontroller | 32‑bit RISC-V processor up to
325 MHz | 32‑bit RISC-V processor up to
325 MHz | 32‑bit RISC-V processor up to
325 MHz | 32‑bit RISC-V processor up to
325 MHz |
| On-chip Memory |
- 484 KB SRAM
- 128 KB ROM
- 1/2/4 KB OTP
- 4 Kb eFuse
|
- 484 KB SRAM
- 128 KB ROM
- 1/2/4 KB OTP
- 4 Kb eFuse
|
- 484 KB SRAM
- 128 KB ROM
- 1/2/4 KB OTP
- 4 Kb eFuse
|
- 484 KB SRAM
- 128 KB ROM
- 1/2/4 KB OTP
- 4 Kb eFuse
|
| Security System |
- Security system encryption engine
- Secure services (secure boot, secure debug, OTA, OTFAD, and so
on)
|
- Security system encryption engine
- Secure services (secure boot, secure debug, OTA, OTFAD, and so
on)
|
- Security system encryption engine
- Secure services (secure boot, secure debug, OTA, OTFAD, and so
on)
|
- Security system encryption engine
- Secure services (secure boot, secure debug, OTA, OTFAD, and so
on)
|
| Standard |
- IEEE 802.11b/g/n/ax
- Bluetooth Classic/Low Energy 5.4 dual mode
- IEEE 802.15.4
|
- IEEE 802.11b/g/n/ax
- Bluetooth Classic/Low Energy 5.4 dual mode
- IEEE 802.15.4
|
- IEEE 802.11b/g/n/ax
- Bluetooth Classic/Low Energy 5.4 dual mode
- IEEE 802.15.4
|
- IEEE 802.11b/g/n/ax
- Bluetooth Classic/Low Energy 5.4 dual mode
- IEEE 802.15.4
|
| Wi-Fi |
- Max Tx Power (HE40 and MCS9): +16 dBm
- Active Tx Power (HE40 and MCS9): 247 mA
- Rx Sensitivity (HE40 and MCS9): -69 dBm
- Active Rx Power (HE40 and MCS9): 72 mA
|
- Max Tx Power (HE40 and MCS9): +16 dBm
- Active Tx Power (HE40 and MCS9): 247 mA
- Rx Sensitivity (HE40 and MCS9): -69 dBm
- Active Rx Power (HE40 and MCS9): 72 mA
|
- Max Tx Power (HE40 and MCS9): +16 dBm
- Active Tx Power (HE40 and MCS9): 247 mA
- Rx Sensitivity (HE40 and MCS9): -69 dBm
- Active Rx Power (HE40 and MCS9): 72 mA
|
- Max Tx Power (HE40 and MCS9): +16 dBm
- Active Tx Power (HE40 and MCS9): 247 mA
- Rx Sensitivity (HE40 and MCS9): -69 dBm
- Active Rx Power (HE40 and MCS9): 72 mA
|
| Bluetooth |
- Max Tx Power
- EDR (3Mbps): +8 dBm
- EDR (2Mbps): +8 dBm
- BR (1Mbps): +10 dBm
- BLE (2Mbps): +10 dBm
- BLE (1Mbps): +10 dBm
- BLE Coded PHY (500 kbps): +10 dBm
- BLE Coded PHY (125 kbps): +10 dBm
- Active Tx Power: 136 mA
- Rx Sensitivity
- EDR (3Mbps): -91 dBm
- EDR (2Mbps): -96 dBm
- BR (1Mbps): -95 dBm
- BLE (2Mbps): -97 dBm
- BLE (1Mbps): -100 dBm
- BLE Coded PHY (500 kbps): -103 dBm
- BLE Coded PHY (125 kbps): -105 dBm
- Active Rx Power: 53 mA
|
- Max Tx Power
- EDR (3Mbps): +8 dBm
- EDR (2Mbps): +8 dBm
- BR (1Mbps): +10 dBm
- BLE (2Mbps): +10 dBm
- BLE (1Mbps): +10 dBm
- BLE Coded PHY (500 kbps): +10 dBm
- BLE Coded PHY (125 kbps): +10 dBm
- Active Tx Power: 136 mA
- Rx Sensitivity
- EDR (3Mbps): -91 dBm
- EDR (2Mbps): -96 dBm
- BR (1Mbps): -95 dBm
- BLE (2Mbps): -97 dBm
- BLE (1Mbps): -100 dBm
- BLE Coded PHY (500 kbps): -103 dBm
- BLE Coded PHY (125 kbps): -105 dBm
- Active Rx Power: 53 mA
|
- Max Tx Power
- EDR (3Mbps): +8 dBm
- EDR (2Mbps): +8 dBm
- BR (1Mbps): +10 dBm
- BLE (2Mbps): +10 dBm
- BLE (1Mbps): +10 dBm
- BLE Coded PHY (500 kbps): +10 dBm
- BLE Coded PHY (125 kbps): +10 dBm
- Active Tx Power: 136 mA
- Rx Sensitivity
- EDR (3Mbps): -91 dBm
- EDR (2Mbps): -96 dBm
- BR (1Mbps): -95 dBm
- BLE (2Mbps): -97 dBm
- BLE (1Mbps): -100 dBm
- BLE Coded PHY (500 kbps): -103 dBm
- BLE Coded PHY (125 kbps): -105 dBm
- Active Rx Power: 53 mA
|
- Max Tx Power
- EDR (3Mbps): +8 dBm
- EDR (2Mbps): +8 dBm
- BR (1Mbps): +10 dBm
- BLE (2Mbps): +10 dBm
- BLE (1Mbps): +10 dBm
- BLE Coded PHY (500 kbps): +10 dBm
- BLE Coded PHY (125 kbps): +10 dBm
- Active Tx Power: 136 mA
- Rx Sensitivity
- EDR (3Mbps): -91 dBm
- EDR (2Mbps): -96 dBm
- BR (1Mbps): -95 dBm
- BLE (2Mbps): -97 dBm
- BLE (1Mbps): -100 dBm
- BLE Coded PHY (500 kbps): -103 dBm
- BLE Coded PHY (125 kbps): -105 dBm
- Active Rx Power: 53 mA
|
| 802.15.4 |
- Max Tx Power: +20 dBm
- Rx Sensitivity: -105 dBm
|
- Max Tx Power: +20 dBm
- Rx Sensitivity: -105 dBm
|
- Max Tx Power: +20 dBm
- Rx Sensitivity: -105 dBm
|
- Max Tx Power: +20 dBm
- Rx Sensitivity: -105 dBm
|
| Peripherals | 35 configurable I/O:
- Serial Flash
- SD/MMC
- SDIO 2.0
- QSPI
- SPI
- I2C
- UART
- I2S
- CAN (ISO 11898)
- MIPI-DBI
- DVP
- PWM
- ADC
- DAC
- JTAG
- RMII (10/100M)
| 35 configurable I/O:
- Serial Flash
- SD/MMC
- SDIO 2.0
- QSPI
- SPI
- I2C
- UART
- I2S
- CAN (ISO 11898)
- MIPI-DBI
- DVP
- PWM
- ADC
- DAC
- JTAG
- RMII (10/100M)
| 35 configurable I/O:
- Serial Flash
- SD/MMC
- SDIO 2.0
- QSPI
- SPI
- I2C
- UART
- I2S
- CAN (ISO 11898)
- MIPI-DBI
- DVP
- PWM
- ADC
- DAC
- JTAG
- RMII (10/100M)
| 35 configurable I/O:
- Serial Flash
- SD/MMC
- SDIO 2.0
- QSPI
- SPI
- I2C
- UART
- I2S
- CAN (ISO 11898)
- MIPI-DBI
- DVP
- PWM
- ADC
- DAC
- JTAG
- RMII (10/100M)
|
| Voltage |
- Input voltage: 2.97 V ~ 3.63 V
- I/O voltage: 1.8 V/3.3 V
|
- Input voltage: 2.97 V ~ 3.63 V
- I/O voltage: 1.8 V/3.3 V
|
- Input voltage: 2.97 V ~ 3.63 V
- I/O voltage: 1.8 V/3.3 V
|
- Input voltage: 2.97 V ~ 3.63 V
- I/O voltage: 1.8 V/3.3 V
|
| Environmental |
- Temperature
- Operating: -40°C ~ 85°C
- Storage: -40°C ~ 125°C
- Humidity
- Relative: < 90% Non-condensing
- Storage: < 90% Non-condensing
|
- Temperature
- Operating: -40°C ~ 85°C
- Storage: -40°C ~ 125°C
- Humidity
- Relative: < 90% Non-condensing
- Storage: < 90% Non-condensing
|
- Temperature
- Operating: -40°C ~ 85°C
- Storage: -40°C ~ 125°C
- Humidity
- Relative: < 90% Non-condensing
- Storage: < 90% Non-condensing
|
- Temperature
- Operating: -40°C ~ 85°C
- Storage: -40°C ~ 125°C
- Humidity
- Relative: < 90% Non-condensing
- Storage: < 90% Non-condensing
|
Last Published: Apr 08, 2026
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QCC744M block diagram and package outline drawings](https://docs.qualcomm.com/bundle/publicresource/80-78831-1/topics/block-diagram.md) [Next Topic
Pin definitions](https://docs.qualcomm.com/bundle/publicresource/80-78831-1/topics/pin-definitions.md)