# Carrier, storage, and handling information
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html)
This topic discusses shipping, storage, and handling of this module.
## Tape and reel information
All QTI tape carrier systems conform to EIA-481 standards.
The following figure shows the simplified sketch of the QCC744M tape
carrier including the part orientation, maximum number of devices per reel, and key
dimensions.
Table : QCC744M-0B
LGM52
| Tape feed: Single | Reel diameter: 330 mm | Tape width: 44 mm |
| --- | --- | --- |
| Units per reel: 500 | Hub diameter: 178 mm | Pocket pitch: 24 mm |
Table : QCC744M-0U
LGM52A
| Tape feed: Single | Reel diameter: 330 mm | Tape width: 32 mm |
| --- | --- | --- |
| Units per reel: 500 | Hub diameter: 178 mm | Pocket pitch: 24 mm |
The following figure shows the tape-handling recommendation.
Figure : Tape handling
## Matrix tray information
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html)
All matrix tray media is available for sampling only. All QTI matrix tray carriers
conform to JEDEC standards.
The device pin 1 is oriented to the chamfered corner of the matrix tray. The following
table lists the key dimensions:
Table : QCC744M-0B
LGM52
| Array | Key dimensions |
| --- | --- |
| M | 14.45 mm |
| M1 | 17.75 mm |
| M2 | 27.95 mm |
| M3 | 21.40 mm |
| Units per tray | 6 × 11 (66) |
Table : QCC744M-0U
LGM52A
| Array | Key dimensions |
| --- | --- |
| M | 14.45 mm |
| M1 | 15.60 mm |
| M2 | 23.65 mm |
| M3 | 21.40 mm |
| Units per tray | 6 × 13 (78) |
The following figure shows the matrix tray orientation.
Figure : Matrix tray orientation
## Device moisture sensitivity level
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html)
A package’s moisture sensitivity level (MSL) indicates its ability to withstand exposure
after it is removed from its shipment bag, while it is on the factory floor awaiting PCB
installation. A low MSL rating is better than a high rating; a low MSL device can be
exposed on the factory floor longer than a high MSL device. All pertinent MSL ratings
are summarized in [Table : MSL ratings summary](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html#device-moisture-sensitivity-level__device-moisture-sensitivity-level_dhz1612798901371_table_m4v_nts_bkb).
Table : MSL ratings summary
| MSL | Out-of-bag floor
life | Comments |
| --- | --- | --- |
| 1 | Unlimited | ≤ 30°C/85% RH |
| 2 | 1 year | ≤ 30°C/60% RH |
| 2a | 4 weeks | ≤ 30°C/60% RH |
| 3 | 168 hours | ≤ 30°C/60% RH; QCC744M |
| 4 | 72 hours | ≤ 30°C/60% RH |
| 5 | 48 hours | ≤ 30°C/60% RH |
| 5a | 24 hours | ≤ 30°C/60% RH |
| 6 | Mandatory bake before use. After baking, it must be reflowed within
the time limit specified on the label. | ≤ 30°C/60% RH |
QTI follows the latest IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity
qualification. The QCC744M devices are targeted as MSL3); see package
reliability results for final MSL level and the classification temperature. This
classification temperature should not be confused with the peak temperature within the
recommended solder reflow profile discussed in SM80-P0982-1.
## Bagged storage conditions
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html)
QCC744M devices delivered in tape and reel carriers must be stored in
sealed, moisture barrier, antistatic bags. For the expected shelf life, see the IC
Products Packing Method document (80-VK055-1).
## Out-of-bag duration
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html)
The out-of-bag duration is the time that a device can be exposed before being installed
onto a PCB.
## Handling
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html)
Tape handling is described in Tape and reel information. For other (IC-specific) handling
guidelines, see the following topics.
### Baking
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html)
It is not necessary to bake the QCC744M if the conditions specified in
Bagged storage conditions and Out-of-bag duration have not **been exceeded**.
It is necessary to bake the QCC744M if any condition specified in Bagged
storage conditions or Out-of-bag duration has **been exceeded**. The baking
conditions are specified on the moisture-sensitive caution label attached to each bag.
For more details, see IC Products Packing Method (80-VK055-1).
Caution:
If baking is required, the devices must be
transferred into trays that can be baked to at least 125°C. Do not bake devices in tape
and reel carriers at any temperature.
### Electrostatic discharge
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html)
Electrostatic discharge (ESD) occurs naturally in laboratory and factory environments. An
established high-voltage potential is always at risk of discharging to a lower
potential. If this discharge path is through a semiconductor device, destructive damage
may result.
ESD countermeasures and handling methods must be developed and used to control the
factory environment at each manufacturing site.
QTI products must be handled according to the ESD Association standard: ANSI/ESD
S20.20-1999, Protection of Electrical and Electronic Parts, Assemblies, and
Equipment.
## Bar code label and packing for shipment
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html](https://docs.qualcomm.com/doc/80-78831-1/topic/packaging.html)
See the IC Products Packing Method (80-VK055-1) document for all
packing-related information, including bar code label details.
Last Published: Apr 08, 2026
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