# Acronyms and terms

Source: [https://docs.qualcomm.com/doc/80-88500-4/topic/4_Acronyms_and_definitions.html](https://docs.qualcomm.com/doc/80-88500-4/topic/4_Acronyms_and_definitions.html)

| Acronym | Expansion |
| --- | --- |
| ADC | Analog-to-digital converter |
| AI | Artificial intelligence |
| AMR | Autonomous mobile robots |
| AOP | Always-on processor |
| AOSS | Always-on subsystem |
| APDP | Application processor debug policy |
| APSS | Applications processor subsystem |
| BCL | Battery current limiting |
| BIM | Battery interface module |
| BMD | Battery missing detection |
| BSM | Battery supplemental mode |
| BTM | Boot thermal management |
| BUA | Battery UICC alarm |
| CDT | Configuration data table |
| CNOC | Configuration network-on-chip |
| CPR | Core power reduction |
| CSS | Compute subsystem |
| CXO | Crystal oscillator |
| DAL | Device abstraction layer |
| DBS | Dual-band simultaneous |
| DCC | Data capture and compare |
| DDI | Device driver interface |
| DDR | Double data rate |
| DNN | Direct neural network |
| DOU | Days-of-use |
| DTM | Dynamic thermal management |
| EL | Exception level |
| EDL | Emergency Download |
| EEPROM | Electronically erasable programmable read-only memory |
| eMMC | Embedded multimedia card |
| Fmax | Maximum frequency |
| GPIO | General purpose input output |
| HAL | Hardware abstraction layer |
| HK | Housekeeping |
| IADC | Incremental analog-to-digital converter |
| IMEM | Internal memory |
| ISR | Interrupt service register |
| IRQ | Interrupt request |
| JTAG | Joint test action group |
| KTM | Kernel thermal monitor |
| LMH | Limits management hardening |
| LPASS | Low-power audio subsystem |
| LPG | Light pulse generator |
| LUT | Lookup table |
| MMSS | Multimedia subsystems |
| NoC | Network-on-chip |
| OCIMEM | On-chip internal memory |
| PA | Power amplifiers |
| PBL | Primary boot loader |
| PD | Pull down |
| PIL | Peripheral image loader |
| PLL | Phase-locked loops |
| PMIC | Power management integrated circuit |
| PNOC | Peripheral network-on-chip |
| PoP | Package-on-Package |
| PU | Pull up |
| PWM | Pulse width modulation |
| QDSS | Qualcomm Debug Subsystem |
| QDUTT | Qualcomm DDR USB test tool |
| QHEE | Qualcomm hypervisor execution environment |
| QMesa | Qualcomm Memory Stress Application |
| QMMF | Qualcomm Multimedia framework |
| QMVS | Qualcomm memory validation suite |
| QSPI | Quad serial peripheral interface |
| Qualcomm TEE | Qualcomm® Trusted Execution Environment |
| QUP | Qualcomm universal peripheral |
| RMA | Return material authorization |
| ROT | Root of trust |
| ROS | Robotics operating system |
| RPM | Resource power management |
| RVM | Robotics vision modules |
| SCM | Secure channel manager |
| SDC | Secure digital card controller |
| SDI | System debug image |
| SE | Serial engine |
| SHRM | System hardware resource manager |
| SMEM | Shared memory |
| SMPL | Sudden momentary power loss |
| SNOC | System network-on-chip |
| SoM | System-on-module |
| SP | Secure processor |
| SPI | Serial peripheral interface |
| SPU | Secure processing unit |
| SSR | Subsystem restart |
| TLMM | Top-level mode multiplexer |
| TSENS | Temperature sensors |
| TZ | TrustZone |
| UFS | Universal flash storage |
| VADC | Versatile analog-to-digital converter |
| VIO | Visual inertial odometry |
| VMID | Virtual Master ID |
| VPU | Video processing unit |
| vSLAM | Visual simultaneous localization and mapping |
| WD or WDOG | Watchdog |
| XBL | eXtensible boot loader |
| XO | Crystal oscillator |
| xPU | eXternal protection units |

**Parent Topic:** [References](https://docs.qualcomm.com/doc/80-88500-4/topic/references.html)

Last Published: Aug 18, 2023

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