# Hardware overview
The following video explains the architecture of the Qualcomm Dragonwing^™^ RB3 Gen 2 Development Kit and the location of the interfaces, buttons, LEDs, DIP switches, and connectors.
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> **Video: Dragonwing RB3 Gen 2 Development Kit — 360° walkthrough**
## Mainboard and interposer block diagram
The following block diagram shows the Dragonwing RB3 Gen 2 mainboard and interposer. Connectors are shown in dark blue. Some connectors are on the interposer board and some on the mainboard.
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> **Figure: Mainboard and interposer block diagram**
The following table describes the hardware features of the Dragonwing RB3 Gen 2 Development Kit.
Table: Hardware features in Dragonwing RB3 Gen 2 Development Kit
| Feature | Component name | Interface | Details |
| --- | --- | --- | --- |
| Audio amplifiers (2) | Qualcomm WSA8835 | Header pins (2) on interposer | Class-D SoundWire audio amplifier |
| Camera port 1 | From chipset | 30-pin flex connector | Support for C/D-PHY camera |
| Camera port 2 | From chipset | 30-pin flex connector | Support for C/D-PHY camera |
| CAN bus controller | Microchip MCP2518FD | Pins on LS1 connector | External CAN-FD controller with SPI |
| Debug UART | FTDI UART to USB converter | Micro USB connector | Connector with FTDI USB to UART converter |
| DP display | DP display output | Micro DisplayPort connector (on interposer) | Display only, not including touch or backlight control |
| DSI to HDMI bridge | Lontium LT9611UCX | HDMI Type-A connector | 4K at 30-Hz HDMI support with I2S audio |
| GNSS | SDR735G chipset | RF connector for external antenna on interposer | GNSS/GPS support |
| Input power | DC power input | Barrel jack connector | +12-V from wall supply |
| microSD storage | microSD card | microSD card tray | microSD card tray |
| On-board digital microphone | TDK T5818 | Microphone on mainboard | PDM digital MEMS microphone |
| Second Ethernet port | From QPS615 PCIe expander | IX Ethernet connector on interposer | 2.5 GbE from PCIe |
| Sensor | TDK ICM-42688-P | Sensor on mainboard | 3-axis gyroscope and 3-axis accelerometer |
| Third Ethernet port | From QPS615 PCIe expander | IX Ethernet connector on interposer | 10 GbE from PCIe (not installed by default, special order) |
| USB host/Device port | USB Type-C | Type C connector | USB Type-C with display port (direct connect to processor) |
| USB hub | Genesys GL3590 | 2x USB Type-A connectors | USB 3.1 Gen2 10 Gb 4-port hub controller |
| USB to LAN | ASIX AX88179 | RJ45 connector | USB 3.0 Gb to 1 Gb Ethernet controller |
| USB 2.0 | USB1 port from SoC | Micro USB connector on interposer | Additional USB port for host/ device mode |
| WLAN/Bluetooth® antenna | Antenna0 | Printed antenna on mainboard | 2.4 GHz/5 GHz printed antenna |
| WLAN/Bluetooth antenna | Antenna1 | Printed antenna on mainboard | 2.4 GHz/5 GHz printed antenna |
## LEDs and buttons
The following figure shows the location of the LEDs and buttons on the Dragonwing RB3 Gen 2 mainboard.
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> **Figure: [L] Top view of mainboard LEDs and buttons, [R] bottom view**
The following table describes the components shown in the preceding figure.
| **Label** | **Component** | **Description** |
| --- | --- | --- |
| 1 | Wi-Fi and Bluetooth LEDs |
Yellow LED shows the Wi-Fi status.
Blue LED shows the Bluetooth status.
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| 2 | LED | User-programmable LED connected to the SoC. |
| 3 | F\_DL button | Puts the device in Emergency Download (EDL) mode. |
| 4 | Power button | Turns the device on or off. |
| 5 | Vol- | Controls volume. The Vol- button also resets the device. |
| 6 | Vol+ | Controls volume. The Vol- button also resets the device. |
| 7 | Unused DIP switches | Not used. |
| 8 | DIP switches | User-configurable DIP switches. |
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## Mainboard and interposer connectors
The following image shows the low-speed connectors (LS1, LS2, LS3), high-speed connectors (HS1, HS2, HS3), key ports, and power button from the top view of the mainboard.

**Figure: Top view of mainboard connectors**
The following image shows the bottom view of the mainboard without the baseplate.

**Figure: Bottom view of interposer connectors**
Low-speed connectors (LS1, LS2, LS3) and high-speed connectors (HS1, HS2, HS3) provide various functionalities including UART, SPI, camera CSI, interrupt signals, DC power, and additional GPIOs.
For more information, see [low-speed and high-speed expansion connectors](https://docs.qualcomm.com/doc/80-90441-251/topic/references.html#ls-hs-connectors).
## Vision mezzanine
The Vision mezzanine supports interfacing cameras to the Dragonwing RB3 Gen 2 platform through two, second-generation gigabit multimedia serial link (GMSL2) camera inputs and five CAM/CSI camera ports. This mezzanine also has four DMICs, an IMU, compass/magnetometer, and a pressure sensor.
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> **Figure: Vision mezzanine**
The following block diagram shows components and connectors on the mainboard and Vision mezzanine.
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> **Figure: Vision mezzanine and mainboard block diagram**
The following key components are supported on the Vision mezzanine:
**Camera**
- Two GMSL2 camera inputs (using MAX9296A), CSI4 and CSI5. Labels on board (GMSL1 and GMSL2) are connector names only. Both inputs are GMSL2 technology.
- Five CAM/CSI camera ports with identical pinouts. CSI0 splits into two cameras (CAM0A and CAM0B).
- CAM3 connector includes an option for a higher supply voltage of 5 V and accommodates the Panasonic TOF camera.
- Main camera (IMX577). Part number: CMK-IMX577-B-V2.0, connect to CAM3.
- Tracking camera (OV9282). Part number: CMK-VR-OV9282-V1.0, connect to CAM0A.
**Sensors**
- DK ICM-42688-P IMU (located on the back side of the board)
- AKM compass/magnetometer AK09919
- TDK pressure sensor (ICP-10111)
**Audio**
- Four digital PDM mics that interface directly with the Dragonwing RB3 Gen 2 platform.
- Speaker connectors on the mezzanine are inactive. They’re replaced by the speaker connectors located on the interposer.
## Sensors
Sensors are available on the mainboard and the Vision mezzanine. Only one IMU sensor can function at a time. When you have enabled both sensors, only the Vision mezzanine IMU functions.
The following table lists the sensor details and identifies the appropriate DIP switch for each sensor. For location of the switches, see [DIP switches](https://docs.qualcomm.com/doc/80-90441-251/topic/references.html#dip-switches).
| Placement | Sensor part | Sensor type | DIP switch | Name | Details | Default |
| --- | --- | --- | --- | --- | --- | --- |
| Mainboard | ICM42688 | Inertial Measurement Unit (IMU) sensor: Accelerometer and Gyroscope | DIP\_SW\_0 (pin 5) | SENSOR\_IM U\_TOGGLE |
| ON |
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## Ethernet
The Dragonwing RB3 Gen 2 Development Kit has a gigabit Ethernet interface on the mainboard through an RJ45 connector and a 2.5GbE Ethernet interface on the interposer board through an IX connector. An adapter cable, which isn’t part of the kit, is required to use the IX connector. An adapter cable is available as an optional accessory for additional purchase.
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> **Figure: [L] Ethernet connector on top view of mainboard, [R] Ethernet connector on bottom view of interposer**
Hover over each step in the following snippet of the mainboard and interposer diagram to see a high-level description of the Ethernet functionality, flow, and components in the Dragonwing RB3 Gen 2 Development Kit.
On the interposer board, the PCIe1 2L signals are connected to the QPS615 (PCIe bridge).
SGMII signals from the QPS615 are connected to QEP8121 PHY and terminated to the IX connector supporting 2.5GbE.
Based on the DIP SW 3 (bit 2) settings, the QPS 1 lane PCIe signals are connected to either PCIe to USB (uPD720201) where it is converted to USB or routed straight to the 500-pin connector. The default switch position is to select the path via PCIe to USB (uPD720201).
The mainboard has the USB 3.1 Gen2 Hub (4) along with USB to LAN (AX88179) which is terminated to the RJ 45 connector.
## Mainboard RF antennas
The Dragonwing RB3 Gen 2 mainboard uses two dual-band, 2.4 GHz/5 GHz/6 GHz, WLAN/Bluetooth technology printed antennas on the mainboard. To avoid detuning the antennas, use nylon standoffs for mounting holes and check that there is no metal directly above or below the antennas. The QCS6490/QCS5430 chipset supports 2 × 2 MIMO with 2x Wi-Fi antenna ports and 1x Bluetooth technology antenna port.
The current SoM uses a shared Wi-Fi/Bluetooth technology approach on RF Chain0. The SoM has the option to route RF signals through the board-to-board connector to the mainboard to eliminate the need for external coaxial cables (current configuration).
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> **Figure: Dual-band RF antennas on the mainboard (bottom view)**
As shown in the following image, connectors are available on the interposer to connect high-performance external antennas. These antennas are optional and aren’t included in the kit. Use I-PEX MHF-SW 23 series cables to connect external antennas. A GNSS connector is also available.
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> **Figure: Dual-band RF antenna and GNSS connectors on the interposer**
Last Published: Aug 13, 2025
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Source: [https://docs.qualcomm.com/doc/80-90441-251/topic/rb3_hardware_overview.html](https://docs.qualcomm.com/doc/80-90441-251/topic/rb3_hardware_overview.html)