# Carrier, storage, and handling
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
This topic discusses shipping, storage, and handling of this chipset.
## Carrier
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
### Tape and reel information
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
All QTI tape carrier systems conform to EIA-481 standards.
The following figure shows a simplified sketch of the QRB2210 tape
carrier, including the proper part orientation, maximum number of devices per reel, and key
dimensions.
Figure : Carrier tape drawing with part orientation
The following figure shows the tape-handling recommendations.
Figure : Tape handling
### Matrix tray information
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
All QTI matrix tray carriers confirm to JEDEC standards.
The device pin 1 is oriented to the chamfered corner of the matrix tray.
Each tray of the QRB2210 contains up to 160 devices. Production orders of the QRB2210 that are shipped in matrix tray carriers will be in [10 + 1] tray stacks of [1600] units. The stacking configuration and quantity for sample orders will vary.
The following figure shows the matrix-tray key attributes and dimensions.
Figure : Matrix-tray key attributes and dimensions
## Device moisture sensitivity level
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
Plastic-encapsulated surface mount packages are susceptible to damage induced by absorbed moisture and high temperature. A package’s moisture sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high rating; a low MSL device can be exposed on the factory floor longer than a high MSL device. All pertinent MSL ratings are summarized in the following table.
Table : MSL ratings summary
| MSL | Out-of-bag floor life | Comments |
| :---: | --- | --- |
| 1 | Unlimited | ≤ 30°C/85% RH |
| 2 | 1 year | ≤ 30°C/60% RH |
| 2a | 4 weeks | ≤ 30°C/60% RH |
| 3 | 168 hours | ≤ 30°C/60% RH;
**QRB2210 rating** |
| 4 | 72 hours | ≤ 30°C/60% RH |
| 5 | 48 hours | ≤ 30°C/60% RH |
| 5a | 24 hours | ≤ 30°C/60% RH |
| 6 | Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label. | ≤ 30°C/60% RH |
QTI follows the latest IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity qualification. ***The QRB2210 devices are classified as MSL3; the qualification temperature was 255ºC.*** This qualification temperature (255°C) should not be confused with the peak temperature within the recommended solder reflow profile.
## Storage
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
### Bagged storage conditions
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
QRB2210 devices delivered in tape and reel carriers must be stored in sealed, moisture barrier, antistatic bags. See [IC Products Packing Method (80-VK055-1)](https://docs.qualcomm.com/bundle/80-VK055-1/resource/80-VK055-1.pdf) for the expected shelf life.
### Out-of-bag duration
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
The out-of-bag duration is the time a device can be on the factory floor before being installed onto a PCB.
### Handling
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
Tape handling was described in [Bagged storage conditions](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html#glf1594373682165). Other (IC-specific) handling guidelines are presented in the following subsections.
### Baking
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
It is not necessary to bake the QRB2210 if the conditions specified in [Bagged storage conditions](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html#glf1594373682165) and [Out-of-bag duration](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html#skx1594373764823) have **not been exceeded**.
It is necessary to bake the QRB2210 if any condition specified in [Bagged storage conditions](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html#glf1594373682165) or [Out-of-bag duration](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html#skx1594373764823) has been exceeded. The baking conditions are specified on the moisture-sensitive caution label attached to each bag; see the [IC Products Packing Method (80-VK055-1)](https://docs.qualcomm.com/bundle/80-VK055-1/resource/80-VK055-1.pdf) document for details.
CAUTION: If baking is required, the devices must be transferred into trays that can be baked to at least 125°C. Devices should not be baked in tape and reel carriers at any temperature.
### Electrostatic discharge
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
Electrostatic discharge (ESD) occurs naturally in laboratory and factory environments. An established high-voltage potential is always at risk of discharging to a lower potential. If this discharge path is through a semiconductor device, destructive damage may result.
ESD countermeasures and handling methods must be developed and used to control the factory environment at each manufacturing site.
QTI products must be handled according to the ESD Association standard: ANSI/ESD S20.20-1999, *Protection of Electrical and Electronic Parts, Assemblies, and Equipment*.
### Bar code label and packing for shipment
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Carrier_storage_and_handling.html)
See the [IC Products Packing Method (80-VK055-1)](https://docs.qualcomm.com/bundle/80-VK055-1/resource/80-VK055-1.pdf) document for all packing-related information, including bar code label details.
Last Published: Oct 08, 2025
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