# Introduction Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Introduction.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Introduction.html) This topic provides the functional block diagram and the device features. **Document updates** See the [Revision history](https://docs.qualcomm.com/doc/80-30843-1/topic/Revision_history.html) for details on the changes included in this revision. ## Functional block diagram Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Introduction.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Introduction.html) This functional block diagram shows the overall representation of the subsystems on this chipset. Figure : QRB2210 functional block diagram Page-1 Sheet.724 Sheet.1 Sheet.2 Sheet.3 Sheet.4 Sheet.5 SM4125P QRB2210 Sheet.6 Sheet.7 WLAN DACs WLAN DACs Sheet.8 Sheet.9 WLAN ADCs WLAN ADCs Sheet.10 Sheet.11 Sheet.12 Sheet.13 Sheet.14 Sheet.15 BB t/r switch BB t/r switch Sheet.16 SD/MMC SD/MMC Sheet.17 Sheet.18 SDC2 SDC2 Sheet.19 Sheet.20 Sheet.21 Sheet.22 Sheet.37 Sheet.38 Sheet.39 Sheet.40 Sheet.44 Soundwire Soundwire Sheet.45 Sheet.46 Sheet.47 Sheet.48 Sheet.49 Sheet.50 MI2S/DMIC (×4) MI2S/DMIC (×4) Sheet.51 Sheet.52 Sheet.53 Sheet.54 Sheet.55 Sheet.56 Sheet.57 Sheet.58 Sheet.59 Dynamic connector.819 Sheet.61 Sheet.62 Sheet.100 Sheet.101 Processors Processors Sheet.102 RPM Arm Cortex-M3 RPM Arm Cortex-M3 Sheet.103 Sheet.104 Quad Cortex-A53 Quad Cortex-A53 Sheet.105 512 KB L2 512 KB L2 Sheet.106 Sheet.107 Sheet.108 Sheet.109 Sheet.110 Sheet.111 LPASS DSP LPASS DSP Sheet.112 Internal functions Internal functions Sheet.113 Security & QFPROM Security and QFPROM Sheet.114 Sheet.115 Clock generation Clock generation Sheet.116 Sheet.117 JTAG/QDSS JTAG/QDSS Sheet.118 Sheet.119 Mode/config/resets Mode/config/resets Sheet.120 debug debug Sheet.121 Sheet.122 Sheet.123 Sheet.124 Resource & pwr mgt Resource and pwr mgt Sheet.125 Sheet.126 GP clock & PDM outs GP clock and PDM outs Sheet.127 Sheet.128 Thermal sensors Thermal sensors Sheet.129 Sheet.130 cxo cxo Sheet.131 Sheet.132 Sheet.133 Sheet.134 clks clks Sheet.135 Sheet.136 Sheet.137 Sheet.138 ctls ctls Sheet.139 Sheet.140 Sheet.141 Sheet.142 Sheet.143 Sheet.144 Sheet.145 Sheet.146 Sheet.147 Sheet.148 Sheet.149 Sheet.150 Sheet.151 Sheet.152 Sheet.153 Sheet.158 Sheet.159 Sheet.160 Non-PoP Non-PoP Sheet.161 Sheet.162 LPDDR4X SDRAM LPDDR4X SDRAM Sheet.163 Sheet.164 Memory support Memory support Sheet.165 EBI1 EBI1 Sheet.166 Sheet.167 Sheet.168 Sheet.169 Sheet.170 EBI0 EBI0 Sheet.171 Sheet.172 LPDDR4X SDRAM LPDDR4X SDRAM Sheet.173 Sheet.174 Sheet.175 Sheet.176 Sheet.177 Multimedia Multimedia Sheet.178 Sheet.179 Adreno 702 GPU Qualcomm® Adreno702 GPU Sheet.180 Sheet.181 Audio: Qualcomm Voice Suite, HD audio Audio: Qualcomm® Voice Communication Suite, HD audio Sheet.182 Sheet.183 Video engine Video engine Sheet.184 Sheet.185 Sheet.186 Sheet.187 Qualcomm ® Adreno™ DPU 920 Qualcomm ® AdrenoDPU 920 Sheet.188 1 x 4-lane DSI 1 x 4-lane DSI Sheet.189 Sheet.190 Sheet.191 Sheet.192 Sheet.193 Sheet.194 Sheet.195 Sheet.196 D-PHY 1.2 C-PHY 1.0 D-PHY 1.2C-PHY 1.0 Sheet.197 Sheet.198 Sheet.199 Sheet.200 4-lane CSI 4-lane CSI Sheet.201 Accelerometer Geomagnetic Gyros Pressure Proximity Humidity T... AccelerometerGeomagneticGyrosPressureProximityHumidityTemperatureAmbient light Sheet.202 Sheet.203 Peripherals/sensors Peripherals/sensors Sheet.204 Sheet.205 Sheet.206 Sheet.207 Sheet.208 Sheet.209 Sheet.210 I²C /SPI I²C /SPI Sheet.211 Sheet.212 Sheet.213 Pri display Pri display Sheet.214 Sheet.215 Sheet.216 Sheet.217 Sheet.218 eMMC eMMC Sheet.219 Sheet.220 Sheet.221 Sheet.222 Connectivity SDC1 Connectivity SDC1 Sheet.223 Sheet.224 Sheet.225 Flash Flash Sheet.226 Touch panel Touch panel Sheet.227 Sheet.228 I²C I²C Sheet.229 Sheet.230 Sheet.231 Sheet.232 Sheet.233 Spectra 340L camera ISP Spectra 340L camera ISP Sheet.234 4-lane CSI 4-lane CSI Sheet.235 LPDDR3 SDRAM LPDDR3 SDRAM Sheet.236 Sheet.237 Sheet.238 Sheet.239 Sheet.240 Sheet.241 Sheet.242 I3C I3C Sheet.243 Sheet.244 Sheet.245 Sheet.246 I²C I²C Sheet.247 Sheet.248 Sheet.249 Sheet.250 PM8008 PM8008 Sheet.251 Sheet.252 Camera PMIC Camera PMIC Sheet.253 Supply voltages Supply voltages Sheet.254 Dynamic connector Sheet.256 Sheet.257 Sheet.258 Sheet.259 Sheet.260 Sheet.261 Sheet.262 Sheet.263 Sheet.264 Sheet.265 Sheet.266 Sheet.267 Sheet.268 Sheet.269 Sheet.270 Sheet.271 Sheet.272 Sheet.273 Sheet.274 Sheet.275 Sheet.276 Sheet.277 Sheet.278 Sheet.279 Sheet.280 Sheet.281 Sheet.282 Sheet.283 Sheet.284 Sheet.285 Sheet.286 Sheet.287 Sheet.288 Sheet.289 Sheet.290 Sheet.291 Sheet.292 Sheet.293 Sheet.294 Sheet.295 Sheet.296 Sheet.297 Sheet.298 Sheet.299 Sheet.300 Sheet.301 Sheet.302 Sheet.303 Sheet.304 Sheet.305 Sheet.306 Sheet.307 Sheet.308 Sheet.309 Sheet.310 Sheet.311 Sheet.312 Front Front Sheet.313 Rear Rear Sheet.314 Iris Iris Sheet.315 Sheet.316 Sheet.317 Output power management Output power management Sheet.318 WLAN/Bluetooth WLAN/Bluetooth Sheet.319 Sheet.320 WLAN RFA WLAN RFA Sheet.321 WLAN RFA WLAN RFA Sheet.322 Bluetooth RF & BB Bluetooth RF and BB Sheet.323 CPU CPU Sheet.324 Coex engine Coex engine Sheet.325 WCN3910/WCN3950 WCN3910/WCN3950 Sheet.326 Sheet.327 Sheet.328 Sheet.329 UART (2-wire) UART (2-wire) Sheet.330 Sheet.331 Sheet.332 Sheet.333 Sheet.334 Sheet.335 Sheet.336 WCI2 (LTE coex) WCI2 (LTE coex) Sheet.337 Sheet.338 Sheet.339 Sheet.340 SSBI SSBI Sheet.341 Sheet.342 Sheet.343 Sheet.344 Sheet.345 Sheet.346 Sheet.347 Sheet.348 Sheet.349 Sheet.350 Sheet.351 Sheet.352 Sheet.353 Sheet.354 Sheet.355 FM FM Sheet.356 WLAN/Bluetooth front-end WLAN/Bluetooth front-end Sheet.357 Support & I/Os Support and I/Os Sheet.358 WLAN WLAN Sheet.359 Co-ex Co-ex Sheet.360 Bluetooth Bluetooth Sheet.361 FM FM Sheet.362 FM RF & BB FM RF and BB Sheet.363 Sheet.364 Sheet.365 Sheet.366 Sheet.367 Sheet.368 Sheet.369 Sheet.370 Sheet.371 Sheet.372 Sheet.373 GPIOs (102) GPIOs (102) Sheet.374 Sheet.375 Sheet.376 Sheet.377 Sheet.378 Sheet.379 Sheet.380 Sheet.381 Sheet.382 Sheet.383 Sheet.384 Sheet.385 Sheet.386 Sheet.387 Sheet.388 Sheet.389 Sheet.390 Sheet.391 Sheet.392 Sheet.393 Sheet.394 Sheet.395 Sheet.396 Sheet.397 Sheet.398 Sheet.399 Peripherals Peripherals Sheet.400 USB 3.1 USB 3.1 Sheet.401 Sheet.402 Sheet.403 Sheet.404 Sheet.405 Sheet.406 QUP (x10) QUP(x10) Sheet.407 Sheet.408 Sheet.409 Sheet.410 UART UART Sheet.411 Sheet.412 Sheet.413 Sheet.414 Sheet.415 Sheet.416 Sheet.417 SPI SPI Sheet.418 I²C I²C Rectangle.2489 EUD EUD Sheet.420 Sheet.421 Sheet.422 Sheet.423 Sheet.424 Sheet.425 Sheet.426 I3C I3C Sheet.427 Bus interfaces Bus interfaces Sheet.428 Sheet.429 Sheet.430 Sheet.431 SPMI SPMI Sheet.438 Sheet.439 Sheet.440 Sheet.441 Sheet.442 Sheet.443 Sheet.450 Sheet.451 Sheet.452 Sheet.453 Sheet.454 Sheet.455 Sheet.456 Sheet.457 Sheet.458 Sheet.459 Sheet.460 Sheet.461 Sheet.462 Sheet.463 Sheet.464 Sheet.466 SSBIs SSBIs Sheet.467 WLAN WLAN Sheet.468 LPI GPIOs (27) LPI GPIOs (27) Sheet.505 Sheet.506 Sheet.507 Sheet.508 Sheet.509 Vibration motor Vibration motor Sheet.510 Sheet.511 Sheet.512 Sheet.513 Sheet.514 clks clks Sheet.515 Sheet.516 Sheet.517 power-on power-on Sheet.518 Sheet.519 Sheet.520 Sheet.521 Sheet.522 Sheet.523 Sheet.524 Sheet.525 Sheet.526 Sheet.527 Sheet.528 Sheet.529 Sheet.530 Sheet.531 Sheet.532 Sheet.533 Sheet.534 Sheet.535 Sheet.536 Sheet.537 Sheet.538 Sheet.539 Sheet.540 Sheet.541 Sheet.542 Sheet.543 from sensors from sensors Sheet.544 Sheet.545 Sheet.546 Sheet.547 Sheet.548 Sheet.549 Sheet.550 others others Sheet.551 Sheet.552 Sheet.553 Sheet.554 Sheet.555 Sheet.556 Sheet.557 Sheet.558 Sheet.559 Sheet.560 Sheet.561 Sheet.562 Sheet.563 Sheet.564 Sheet.565 Sheet.566 Sheet.567 Sheet.568 Sheet.569 Sheet.570 Sheet.571 Sheet.572 Sheet.573 Sheet.574 Sheet.575 Sheet.576 Sheet.577 Sheet.578 Sheet.579 Sheet.580 Sheet.581 Sheet.582 Sheet.583 Sheet.584 Sheet.585 Sheet.586 Sheet.587 Sheet.588 Sheet.589 Sheet.590 Sheet.591 Sheet.592 Sheet.593 Input pwr mgt (Battery charger) Input pwr mgt(Battery charger) Sheet.594 Sheet.595 Sheet.596 Sheet.597 Sheet.598 Sheet.599 PM4125 PM4125 Sheet.600 Output Pwr mgt Output Pwr mgt Sheet.601 Sheet.602 User interfaces User interfaces Sheet.603 Sheet.604 IC-level interfaces IC-level interfaces Sheet.605 Sheet.606 General house keeping General house keeping Sheet.607 Sheet.608 Audio codec Audio codec Sheet.609 Sheet.610 Sheet.611 Sheet.612 Sheet.613 Sheet.614 Sheet.615 Sheet.616 Sheet.617 Sheet.618 Sheet.619 Sheet.620 Sheet.621 Sheet.622 Sheet.623 Sheet.624 Sheet.625 Sheet.626 Sheet.627 Sheet.628 Sheet.629 Sheet.630 Sheet.631 SPMI SPMI Sheet.632 dsc dsc Sheet.633 Sheet.634 Sheet.635 Sheet.636 Indicators Indicators Sheet.637 Sheet.638 Sheet.639 Sheet.640 Sheet.641 Sheet.642 Sheet.643 Sheet.644 Sheet.645 Sheet.646 Sheet.647 Dynamic connector.2629 Sheet.649 Sheet.650 Sheet.651 Sheet.652 Sheet.653 Sheet.654 Sheet.655 Sheet.656 WSA8810 WSA8810 Sheet.657 Sheet.658 Sheet.659 Sheet.660 Sheet.661 Sheet.662 Sheet.663 Sheet.664 Sheet.665 Sheet.666 External sources External sources Sheet.667 Sheet.668 Sheet.669 Sheet.670 Sheet.671 Sheet.672 Sheet.673 Sheet.674 Sheet.675 Sheet.676 Sheet.677 Sheet.678 Sheet.679 Sheet.680 Sheet.681 Sheet.682 Sheet.683 Sheet.684 Sheet.685 Sheet.686 Sheet.687 Sheet.688 Sheet.689 Sheet.690 Sheet.691 Sheet.692 Sheet.693 Sheet.694 Sheet.695 Sheet.696 Sheet.697 Sheet.698 Sheet.699 Sheet.700 Sheet.701 Sheet.702 Sheet.703 Sheet.704 Sheet.705 Sheet.706 Sheet.707 Sheet.708 Sheet.709 Processors Air interfaces Sheet.722 RPM Arm Cortex-M3 WLAN/BT/FM Sheet.723 ## QRB2210 features Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Introduction.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Introduction.html) This table lists the comprehensive features of the QRB2210 chipset and its capabilities. Note: Some hardware features integrated within the QRB2210 chip must be enabled by software. See the latest revision of the applicable software release notes to identify the enabled QRB2210 features. ### Processors | Function | Description | | :---: | :---: | | Applications | 64‑bit applications processor | | Always-on system | Always-on subsystem with always-on processor power management (RPM) for voltage
control and regulation, clock management, and resource communication | | LPASS | QDSP6 v66 K | ### Memory support | Function | Description | | :---: | :---: | | System memory via EBI | | ### External memory | Function | Description | | :---: | :---: | | Via | eMMC 5.1 and SD 3.0 | ### RF support | Function | Description | | :---: | :---: | | WLAN/Bluetooth | Yes (with WCN3910 and WCN3950) | | Antenna sharing | Antenna shared between Wi-Fi and WAN | ### Multimedia | Function | Description | | --- | --- | | ***Display support*** | ***Display support*** | | MIPI-DSI | One 4-lane DSI D-PHY 1.2 port, up to 1.5 Gbps per lane with split link
support | | General display features | | | Mobile display processor | Adreno DPU 920 | | ***Camera support*** | ***Camera support*** | | Camera interfaces | 2x ISP (13 MP + 13 MP or 25 MP) at
30 fps ZSL | | MIPI-CSI | MIPI combination D-PHY 1.2 /C-PHY 1.0 configurable in 4/4 or 4/2/1 | | Performance | | | ***Video applications performance*** | ***Video applications performance*** | | Encode | | | Decode | | | Concurrency | 1080p 30 decode + 720p 30 encode | | HFR capture | 480p 120 | | ***Graphics performance*** | ***Graphics performance*** | | Graphics | | | ***Audio***



Integrated codec in PM4125, WSA8810 (optional) | ***Audio***



Integrated codec in PM4125, WSA8810 (optional) | | Voice UI | | | Low-power voice activation | Supported | | Low-power audio | Low power; 7.1 surround sound | | Speaker amplifier | WSA8810 in analog mode | | Audio interfaces | SLIMbus: WCN Bluetooth/FM SLIMbus



SWR: SoundWire interface (two Tx and two Rx data lines) for codec



Digital mic: Four DMICs



4 × MI2S: Three MI2S with 2x data lanes to support full duplex stereo, or up to 4
channel Tx/Rx application



One MI2S supports four data lanes for up to eight channels Tx/Rx application | | Voice codec | EVS, EVRC, EVRC-B, EVRC-WB



G.711 and G.729A/AB



GSM-FR, GSM-EFR, and GSM-HR



AMR-NB and AMR-WB | | Voice processing | Qualcomm® Noise and Echo Cancellation and Qualcomm® Voice Suite | | Audio codec support | MP3; AAC; HE AAC v1, v2; FLAC; APE; ALAC; AIFF | | Enhanced audio | DSP-offload for low-power audio playback | | Sensors | QUP (×4 in LPI) dedicated for sensors | ### Connectivity | Interface | Description | | :---: | :---: | | Qualcomm universal peripheral (QUP) ports | 10 serial engines | | UART | UART interface; six on GPIO and three on LPI GPIO | | I^2^C | I^2^C interface; six on GPIO and three on LPI GPIO for touch, sensors,
and NFC; dedicated controller for each port | | I3C | I3C interface; one on GPIO and two on LPI GPIO | | SPI | SPI interfaces; six on GPIO and one on LPI GPIO for sensors and so on. | | CCI I^2^C | Two dedicated I^2^C interfaces for camera. | | USB | USB 3.1 Type-C/Micro USB | | PWM | Nine | | Secure digital interfaces | | | Wireless connectivity | WCN3910 1 × 1 802.11b/g/n



WCN3950 1 × 1 802.11a/b/g/n/ac | | Touchscreen support | Capacitive panels via ext IC (I^2^C, SPI, and interrupts) | ### Configurable GPIOs | Function | Description | | :---: | :---: | | Number of GPIO ports | 102 | | Number of LPI GPIO ports | 27 | | Input configurations | Pull-up, pull-down, keeper, or no pull | | Output configurations | Programmable drive current | | Top-level mode multiplexer | Provides a convenient way to program groups of GPIOs | ### Internal functions | Function | Description | | :---: | :---: | | Security | | | | Secure boot, secure debug, secure key provisioning, TrustZone,
Qualcomm ® Trusted Execution Environment, hardware supported
KeyStore | | | Crypto engine v5 (CE5), DRBG/PRNG (FIPS-compliant), inline crypto
engine (FIPS-compliant), HWKM and HW ECC | | | Secure file system, fast trusted storage | | | PlayReady SL2000/SL3000, Widevine level 1, ISDB-T, and CPZ for GPU
and DSP | | PLLs and clocks | | | Debug | JTAG, QDSS, embedded USB debug (EUD), and ETM | | Others | Thermal sensors, modes and resets, and peripheral subsystem | ### Chipset and Qualcomm RF interface features | Function | Description | | :---: | :---: | | Power management | | | Wireless connectivity | | | | I/Q differential pair interface | | | UART interface | ### Fabrication technology and package | Function | Description | | :---: | :---: | | Non-PoP – small, thermally efficient package | NSP752: 12 mm × 12.4 mm × 0.91 mm; 0.4 mm pitch | Last Published: Oct 08, 2025 [Previous Topic QRB2210 high-level block diagram and NSP752 drawing](https://docs.qualcomm.com/bundle/publicresource/80-30843-1/topics/high_level_block_diagram_and_752_NSP_drawing.md) [Next Topic Pin definitions](https://docs.qualcomm.com/bundle/publicresource/80-30843-1/topics/Pin_definitions.md)