# PCB mounting guidelines Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/PCB_mounting_guidelines.html](https://docs.qualcomm.com/doc/80-30843-1/topic/PCB_mounting_guidelines.html) This topic provides specifications for mounting the QRB2210 onto PCBs ## RoHS compliance Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/PCB_mounting_guidelines.html](https://docs.qualcomm.com/doc/80-30843-1/topic/PCB_mounting_guidelines.html) The device complies with the requirements of the EU RoHS directive. Its SnAgCu solder balls use SAC125/Ni composition. A product material declaration (PMD) that provides RoHS and other product environmental governance information is published when the data is available. ## SMT assembly guidelines Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/PCB_mounting_guidelines.html](https://docs.qualcomm.com/doc/80-30843-1/topic/PCB_mounting_guidelines.html) For recommendations on SMT process development, see the [SMT Assembly Guidelines (SM80-P0982-1)](https://docs.qualcomm.com/bundle/SM80-P0982-1/resource/SM80-P0982-1.pdf). ## Daisy chain components Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/PCB_mounting_guidelines.html](https://docs.qualcomm.com/doc/80-30843-1/topic/PCB_mounting_guidelines.html) For daisy chain part information, contact the Qualcomm Sales team for support. Last Published: Oct 08, 2025 [Previous Topic Carrier, storage, and handling](https://docs.qualcomm.com/bundle/publicresource/80-30843-1/topics/Carrier_storage_and_handling.md) [Next Topic Part reliability](https://docs.qualcomm.com/bundle/publicresource/80-30843-1/topics/Part_reliability.md)