# Part reliability Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Part_reliability.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Part_reliability.html) This topic provides the reliability data, including a definition of the qualification samples and a summary of qualification test results. ## Reliability qualifications summary Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Part_reliability.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Part_reliability.html) The table below lists the QRB2210 reliability evaluation report for NSP752 device where, foundry source is Samsung. | Tests, standards, and conditions | Sample size | Result | | --- | --- | --- | | **ELFR in DPPM**


HTOL: JESD22-A108-A


Total samples from more than three different wafer lots | 91 | Pass


DPPM < 1000


See note below the table | | **HTOL in FIT (λ) failure in billion device hours**


HTOL: JESD22-A108-A


Total samples from more than three different wafer lots | 91 | Pass


FIT < 50


See note below the table | | **Mean time to failure (MTTF) t = 1/λ in million hours**


(Total samples from more than three different wafer lots) | 91 | > 20


See note below the table | | **ESD – Human-body model (HBM) rating**


JESD22-A114-F


Target 1000 V


Total samples from one wafer lot | 24 | Pass


± 1000 V | | **ESD – Charge-device model (CDM) rating**


JESD22-C101-D


Target 250 V


Total samples from one wafer lot | 3 | Pass


± 250 V | | **Latch-up (I-test):** EIA/JESD78C


Trigger current: ±100 mA; temperature: 85°C


Total samples from one wafer lot | 3 | Pass | | **Latch-up (Vsupply overvoltage):** EIA/JESD78C


Trigger voltage: stress at 1.5 × Vddmax per device specification; temperature: 85°C


Total samples from one wafer lot | 3 | Pass | | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | | Tests, standards, and conditions | SPIL, Taiwan

Sample size | ASE, Taiwan

Sample size | Amkor, China

Sample size | Result | | --- | --- | --- | --- | --- | | **Moisture resistance test (MRT):** J-STD-020-C


Reflow at 260 +0/-5 °C, MSL3


Total samples from three different assembly lots | 582 | 582 | 582 | Pass | | **Temperature cycle:** JESD22-A104-D


Temperature: -55°C to 125°C; number of cycles: 1000


Soak time at minimum/maximum temperature: 8–10 minutes


Cycle rate: 2 cycles per hour (CPH)


**Preconditioning:** JESD22-A113-F


MSL3, reflow temperature: 260°C +0/-5°C


Total samples from three different assembly lots | 231 | 231 | 231 | Pass | | **Unbiased highly accelerated stress test:** JESD22-A118


130°C/85% RH and 96 hours duration


Preconditioning: JESD22-A113-F


MSL3, reflow temperature: 260°C +0/-5°C


Total samples from three different assembly lots | 231 | 231 | 231 | Pass | | **Biased highly accelerated stress test:** JESD22-A110


130°C/85% RH and 96-hour duration or


110°C/85% RH and 264-hours duration


Preconditioning: JESD22-A113-F


MSL3, reflow temperature: 260°C +0/-5°C | 120 | 120 | 120 | Pass | | **High-Temperature Storage Life:** JESD22-A103-C


Temperature 150°C, 500 hours, 1000 hours


Total samples from three different assembly lots | 231 | 231 | 231 | Pass | | **Flammability**


UL-STD-94


Flammability test – not required


QTI ICs are exempt from the flammability requirements due to their sizes per UL/EN 60950-1, if they are mounted on materials rated V-1 or better. Most PWBs onto which our ICs mounted are rated V-0 (better than V-1) | N/A | N/A | N/A | N/A | | **Physical dimensions:** JESD22-B100-B


Case outline drawing: QTI internal document


Total samples from three different assembly lots | 30 | 30 | 30 | Pass | | **Solder ball shear** JESD22-B117A


Total samples from three different assembly lots | 15 | 15 | 15 | Pass | | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | The table below lists the QRB2210 reliability evaluation report for NSP752 device where, foundry source is GLOBALFOUNDRIES. | Tests, standards, and conditions | Sample size | Result | | --- | --- | --- | | **ELFR in DPPM**


HTOL: JESD22-A108-A


Total samples from more than three different wafer lots | 117 | Pass


DPPM < 1000


See note below the table | | **HTOL in FIT (** **λ** **) failure in billion device hours**HTOL: JESD22-A108-A


Total samples from more than three different wafer lots | 117 | Pass


FIT < 50


See note below the table | | **Mean time to failure (MTTF) t =** **1** **/** **λ in million hours**


(Total samples from more than three different wafer lots) | 117 | > 20


See note below the table | | **ESD – Human-body model (HBM) rating**


JESD22-A114-F


Target 1000 V


(Total samples from one wafer lot) | 24 | Pass


± 1000 V | | **ESD – Charge-device model (CDM) rating**


JESD22-C101-D


Target 250 V


(Total samples from one wafer lot) | 3 | Pass


± 250V | | **Latch-up (I-test):** EIA/JESD78C


Trigger current: ±100 mA; temperature: 85°C


(Total samples from one wafer lot) | 3 | Pass | | **Latch-up (Vsupply overvoltage):** EIA/JESD78C


Trigger voltage: stress at 1.5 × Vdd max per device specification; temperature: 85°C


(Total samples from one wafer lot) | 3 | Pass | | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | Note: Data is leveraged from other previously qualified PSP packages that are similar to this configuration. | | Tests, standards, and conditions | SPIL, Taiwan

Sample size | ASE, Taiwan

Sample size | Amkor, China

Sample size | Result | | --- | --- | --- | --- | --- | | **Moisture resistance test (MRT):** J-STD-020-C


Reflow at 260 +0/-5 °C, MSL3


Total samples from three different assembly lots | 582 | 582 | 582 | Pass | | **Temperature cycle:** JESD22-A104-D


Temperature: -55°C to 125°C; number of cycles: 1000


Soak time at minimum/maximum temperature: 8–10 minutes


Cycle rate: 2 cycles per hour (CPH)


**Preconditioning:** JESD22-A113-F


MSL3, reflow temperature: 260°C+0/-5°C


Total samples from three different assembly lots | 231 | 231 | 231 | Pass | | **Unbiased highly accelerated stress test:** JESD22-A118


130°C/85% RH and 96 hours duration


Preconditioning: JESD22-A113-F


MSL 3, reflow temperature: 260°C+0/-5°C


Total samples from three different assembly lots | 231 | 231 | 231 | Pass | | **Biased highly accelerated stress test:** JESD22-A110


130°C/85% RH and 96-hour duration or


110°C/85% RH and 264-hours duration


Preconditioning: JESD22-A113-F


MSL 3, reflow temperature: 260°C +0/-5°C | 120 | 120 | 120 | Pass | | **High-Temperature Storage Life:** JESD22-A103-C


Temperature 150°C, 500 hours, 1000 hours


Total samples from three different assembly lots | 231 | 231 | 231 | Pass | | **Flammability**


UL-STD-94


Flammability test – not required


QTI ICs are exempt from the flammability requirements due to their sizes per UL/EN 60950-1, if they are mounted on materials rated V-1 or better. Most PWBs onto which our ICs mounted are rated V-0 (better than V-1) | N/A | N/A | N/A | N/A | | **Physical dimensions:** JESD22-B100-B


Case outline drawing: QTI internal document


Total samples from three different assembly lots | 30 | 30 | 30 | Pass | | **Solder ball shear** JESD22-B117A


Total samples from three different assembly lots | 15 | 15 | 15 | Pass | | Note: Since assembly process is the same for Samsung and GLOBALFOUNDRIES, data provided here is based on the qualification test results from Samsung. | Note: Since assembly process is the same for Samsung and GLOBALFOUNDRIES, data provided here is based on the qualification test results from Samsung. | Note: Since assembly process is the same for Samsung and GLOBALFOUNDRIES, data provided here is based on the qualification test results from Samsung. | Note: Since assembly process is the same for Samsung and GLOBALFOUNDRIES, data provided here is based on the qualification test results from Samsung. | Note: Since assembly process is the same for Samsung and GLOBALFOUNDRIES, data provided here is based on the qualification test results from Samsung. | ## Qualification sample description Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Part_reliability.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Part_reliability.html) Table : Device characteristics | Category | Definition | | --- | --- | | Device name | QRB2210 | | Package type | NSP | | Package body size | 12.0 × 12.4 × 0.91 mm | | Ball count | 752 | | Ball composition | SAC125/Ni | | Fab process | 11 LPP | | Fab sites | Samsung, GLOBALFOUNDRIES | | Assembly sites | | | Solder ball pitch | 0.4 mm | Last Published: Oct 08, 2025 [Previous Topic PCB mounting guidelines](https://docs.qualcomm.com/bundle/publicresource/80-30843-1/topics/PCB_mounting_guidelines.md) [Next Topic Samples and known issues](https://docs.qualcomm.com/bundle/publicresource/80-30843-1/topics/samples-and-known-issues.md)