# Features

Source: [https://docs.qualcomm.com/doc/80-70014-16/topic/features.html](https://docs.qualcomm.com/doc/80-70014-16/topic/features.html)

The key features of the audio subsystem are as follows:

- **LPAI hardware**
    The low power AI subsystem is the next generation  Qualcomm®  hardware architecture dedicated for low power,
                    always-on processing for audio use cases. It leverages a dedicated
                    hardware-based AI accelerator for machine learning-based workload offloads.
- **Audio IO interfaces**
    The Qualcomm developer kit supports audio IO interfaces
                    such as I2S, TDM, DMIC, etc. It exposes I/O connections that can be used to
                    connect peripherals to the device. The GPIO pinout can be inferred from IO
                    interface sections.
- **Digital microphone/audio capture**
    A digital microphone connected to the
                    digital codec residing in the LPAI hardware supports capture of audio data.
- **Speaker amplifier/audio playback**
    Supports 2x WSA8835 Aqstic class-D smart
                    speaker amplifiers. The WSA speaker amp is connected through a SoundWire
                    interface to the device.
- **Fluence**
    Low power echo cancellation and noise suppression (ECNS) solution
                    for crystal clear sound. Capable of offering better non-stationary noise
                    suppression and higher signal-to-noise ratio improvement (SNRi).
- **Post-processing features**
    Audio software supports audio data post processing
                    features such as MBDRC, IIR, Upmixing, Limiter, DRC, Enhanced Audio Noise
                    Suppression (EANS), and more.

The following audio decoders and encoders are supported:

| Category | Codec | GStreamer support |
| :---: | :---: | :---: |
| Decoder | MP3 | Yes |
| Decoder | Vorbis | Yes |
| Decoder | FLAC | Yes |
| Decoder | OGG | Yes |
| Encoder | PCM | Yes |
| Encoder | FLAC | Yes |

Last Published: Jul 15, 2024

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