# Overview Thermal management is a configurable framework that allows you to control the temperature of the entire device, ensuring reliability of the device. It aids in maintaining the junction and surface temperatures of the device within specified limits even when running high workload applications. This guide provides information about: - Thermal architecture - Heat dissipation techniques supported on Qualcomm Linux - Tuning of thermal thresholds for mitigation based on the thermal requirements of the product - Sending a notification to the user space - Features to adjust temperature configurations to achieve the required thermal behavior Note See [Hardware SoCs](https://docs.qualcomm.com/bundle/publicresource/topics/80-70017-115/soc.html) that are supported on Qualcomm Linux. Last Published: Jan 26, 2025 [Previous Topic Thermal management](https://docs.qualcomm.com/bundle/publicresource/80-70017-30/topics/thermalmanagement.md) [Next Topic Getting started](https://docs.qualcomm.com/bundle/publicresource/80-70017-30/topics/get-started-thermal.md)