# Audio overview The audio subsystem powered by low power AI (LPAI) delivers voice UI and audio experiences. It uses a dedicated hardware-based AI accelerator for machine learning-based work. VBackground-1 Solid Page-1 Sheet.28 Sheet.1 Sheet.22 Interfaces Interfaces Sheet.2 Application DSP Application DSP Sheet.5 Application DSP firmware Application DSP firmware Sheet.6 TDM TDM Sheet.7 MI2S MI2S Sheet.8 SoundWire SoundWire Sheet.10 Application processor Application processor Sheet.11 Multimedia framework/kernel drivers Multimedia framework/kernel drivers Dynamic connector.16 Dynamic connector.18 Sheet.15 Audio record Audio record Sheet.16 Audio playback Audio playback Sheet.17 Sheet.18 Sheet.23 Codec Codec Dynamic connector Dynamic connector.25 Dynamic connector.26 Dynamic connector.27 Audio component overview The audio system includes: - **Application processor** – CPU that handles audio processing tasks. Tasks include: - Managing audio record and playback - Decoding audio formats - Using LPAI for postprocessing tasks - **Low Power AI (LPAI)** – Subsystem that runs audio playback/record and voice-activation (VA) algorithms. It integrates with a dedicated Qualcomm® Hexagon™ Processor (QDSP6) and a low power island (LPI). - **Audio codec** – Hardware that includes: - Analog-to-Digital Converter (ADC) - Digital-to-Analog Converter (DAC) These convert analog audio to digital, and vice versa. - **Speaker AMP and microphone** – Devices that connect over I2S/TDM/SoundWire. ## Architecture The following figure shows the high-level audio software architecture. VBackground-1 Solid Page-1 Sheet.116 Sheet.117 Legend Legend Sheet.19 Application layer Application layer Sheet.21 Middleware layer Middleware layer Sheet.25 Hardware abstraction layer Hardware abstraction layer Sheet.26 Kernel space Kernel space Sheet.27 LPAI LPAI Sheet.41 PC PC Sheet.3 Sheet.1 PulseAudio PulseAudio Sheet.2 Gstreamer Gstreamer Sheet.4 PAL PAL Sheet.5 ARGS ARGS Sheet.8 AGM AGM Sheet.9 TinyALSA TinyALSA Sheet.10 Application Application Can ACDB Sheet.12 ACDB Sheet.15 QACT QACT Sheet.16 ASOC ASOC Sheet.17 SPF SPF Sheet.18 Codec Codec Sheet.32 Client middleware Client middleware Sheet.34 MM framework MM framework Dynamic connector Dynamic connector.42 USB USB Dynamic connector.43 Dynamic connector.44 Dynamic connector.46 Dynamic connector.47 Dynamic connector.48 Dynamic connector.49 Dynamic connector.51 Dynamic connector.52 Dynamic connector.54 Dynamic connector.55 Dynamic connector.56 Sheet.57 Sheet.94 Sheet.95 Dynamic connector.96 Dynamic connector.97 Dynamic connector.98 Dynamic connector.101 Sheet.102 Qualcomm Qualcomm Sheet.104 Open source Open source Sheet.105 Hardware Hardware Sheet.106 Data flow Data flow Sheet.107 Data + control Data + control Sheet.108 Control Control Dynamic connector.111 Dynamic connector.112 Sheet.113 Sheet.114 High-level audio software architecture The following are the major audio software architecture components: [PulseAudio](https://docs.qualcomm.com/doc/80-70020-16/topic/enable-audio.html#enable-pulseaudio) A sound server for POSIX OSes (mostly targeting Linux) that acts as a proxy and router between hardware device drivers and applications on one or many hosts. [Platform Abstration Layer (PAL)](https://docs.qualcomm.com/doc/80-70020-16/topic/pal.html#pal) Provides higher-level audio-specific APIs to access the audio hardware and drivers to enable audio features. [Audio Graph Manager (AGM)](https://docs.qualcomm.com/doc/80-70020-16/topic/agm.html#agm) Provides interfaces to allow TinyALSA-based mixer controls and PCM/compressed plug-ins to interact and enable audio features. [AudioReach Graph Service (ARGS)](https://docs.qualcomm.com/doc/80-70020-16/topic/agm.html#args) Consists of the Graph Service Layer (GSL), Generic Packet Router (GPR), and acdb Management Layer (AML) modules. Handles initialization and creation of graphs, and creation of packets for sending a series of commands to the signal processing framework (SPF). [Audio calibration database (acdb)](https://docs.qualcomm.com/doc/80-70020-16/topic/agm.html#section-rhd-fg4-zbc) Includes information about various audio use cases such as graphs, module calibration data, etc. The APPS processor parses acdb files to get the graph information used by SPF to enable the use case. [Signal Processing Framework (SPF)](https://docs.qualcomm.com/doc/80-70020-16/topic/agm.html#spf-sw) Modular framework that runs on the LPAI DSP. It helps set up, configure, and run signal processing modules for audio features. [Qualcomm Audio Calibration Tool (QACT™ Platform)](https://docs.qualcomm.com/bundle/resource/topics/80-70020-16A/tools.html) PC-based software that provides a GUI to visualize, configure, and store audio graphs in the acdb for audio use cases. Last Published: Jan 07, 2026 [Previous Topic Audio documentation](https://docs.qualcomm.com/bundle/publicresource/80-70020-16/topics/audio.md) [Next Topic Enable audio](https://docs.qualcomm.com/bundle/publicresource/80-70020-16/topics/enable-audio.md)