# `meta-qcom-extras` This layer is an optional metadata layer for registered users. This layer allows source compilation of select components, which are otherwise present as binaries in `meta-qcom-hwe`. If you are entitled to receive this metadata layer, you can use the steps shared in the [Qualcomm Linux Build Guide](https://docs.qualcomm.com/bundle/publicresource/topics/80-70022-254/build_addn_info.html). ## Firmware recipes The `meta-qcom-extras` layer provides recipe append files for the firmware recipes defined in `meta-qcom-hwe` layer at `meta-qcom-hwe/recipes-firmware/firmware`. The following code snippet shows these recipe append files, with extension `.bbapend`. The firmware recipe append files have the `SRC_URI` set to zip files that you may want to use instead of the default zip files distributed with this Qualcomm Linux release. Follow the [Qualcomm Linux Build Guide](https://docs.qualcomm.com/bundle/publicresource/topics/80-70022-254/build_addn_info.html) to build cDSP, aDSP, boot firmware, and generate the zip file that you can integrate using the provided recipe append files. | recipes-firmware
└── firmware
├── firmware-qcom-bootbins_1.0.bbappend
├── firmware-qcom-dspso_1.0.bbappend
├── firmware-qcom-hlosfw_1.0.bbappend
└── firmware-qcom-partconf_1.0.bbappend
Copy to clipboard | The recipes in `meta-qcom-extras` override the `SRC_URI` in recipes from `meta-qcom-hwe`.
The `meta-qcom-hwe` layer uses pre-built firmware binaries by default, while
the `meta-qcom-extras` layer builds the firmware zip provided by the user.


The `meta-qcom-extras` layer ignores the pre-built binaries from the default
zip files. These recipes instead search for user-provided zip files set
in FWZIP\_PATH as follows:

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