# Hardware overview
The following video explains the architecture of the Qualcomm Dragonwing^™^ RB3 Gen 2 Development Kit and the location of the interfaces, buttons, LEDs, DIP switches, and connectors:
**Video: Dragonwing RB3 Gen 2 Development Kit — 360° walkthrough**
## Mainboard and interposer block diagram
The following block diagram shows the Dragonwing RB3 Gen 2 mainboard and interposer. Connectors are shown in dark blue. Some connectors are on the interposer board, and some on the mainboard.
>
>
> 
>
> **Figure: Mainboard and interposer block diagram**
The following table describes the hardware features of Dragonwing RB3 Gen 2 Development Kit:
Table: Hardware features in Dragonwing RB3 Gen 2 Development Kit
| Feature | Component name | Interface | Details |
| --- | --- | --- | --- |
| Audio amplifiers (2) | Qualcomm WSA8835 | Header pins (2) on interposer | Class-D SoundWire audio amplifier |
| Camera port 1 | From chipset | 30-pin flex connector | Support for C/D-PHY camera |
| Camera port 2 | From chipset | 30-pin flex connector | Support for C/D-PHY camera |
| CAN bus controller | Microchip MCP2518FD | Pins on LS1 connector | External CAN-FD controller with SPI |
| Debug UART | FTDI UART to USB converter | Micro-USB connector | Connector with FTDI USB to UART converter |
| DP display | DP display output | Micro DisplayPort connector (on interposer) | Display only; does not include touch or backlight control |
| DSI to HDMI bridge | Lontium LT9611UCX | HDMI Type-A connector | 4K at 30-Hz HDMI support with I2S audio |
| GNSS | SDR735G chipset | RF connector for external antenna on interposer | GNSS/GPS support |
| Input power | DC power input | Barrel jack connector | +12-V from wall supply |
| microSD storage | microSD card | microSD card tray | microSD card tray |
| On-board digital microphone | TDK T5818 | Microphone on mainboard | PDM digital MEMS microphone |
| Second Ethernet port | From QPS615 PCIe expander | IX Ethernet connector on interposer | 2.5 GbE from PCIe |
| Sensor | TDK ICM-42688-P | Sensor on mainboard | 3-axis gyroscope and 3-axis accelerometer |
| Third Ethernet port | From QPS615 PCIe expander | IX Ethernet connector on interposer | 10 GbE from PCIe (not installed by default; special order) |
| USB host/Device port | USB Type-C | Type C connector | USB Type-C with display port (direct connect to processor) |
| USB hub | Genesys GL3590 | 2x USB Type-A connectors | USB 3.1 Gen2 10 Gb 4-port hub controller |
| USB to LAN | ASIX AX88179 | RJ45 connector | USB 3.0 Gb to 1 Gb Ethernet controller |
| USB 2.0 | USB1 port from SoC | Micro-USB connector on interposer | Additional USB port for host/device mode |
| WLAN/Bluetooth^®^ antenna | Antenna0 | Printed antenna on mainboard | 2.4-GHz/5-GHz printed antenna |
| WLAN/Bluetooth antenna | Antenna1 | Printed antenna on mainboard | 2.4-GHz/5-GHz printed antenna |
## LEDs and buttons
The following figure shows the location of LEDs and buttons on the Dragonwing RB3 Gen 2 mainboard:
>
>
> 
>
>
> **Figure: [L] Top view of mainboard LEDs and buttons, [R] bottom view**
The following table describes the components shown in the figure:
| **Label** | **Component** | **Description** |
| --- | --- | --- |
| 1 | Wi-Fi and Bluetooth LEDs | Yellow LED shows the Wi-Fi status.
Blue LED shows the Bluetooth status. |
| 2 | LED | User-programmable LED connected to the SoC |
| 3 | F\_DL button | Puts the device in emergency download (EDL) mode |
| 4 | Power button | Turns the device on or off |
| 5 | Vol- |
Controls the volume. The Vol- button also resets the device. |
| 6 | Vol+ |
Controls the volume. The Vol- button also resets the device. |
| 7 | Unused DIP switches | Not used |
| 8 | DIP switches | User-configurable DIP switches |
| | | |
## Mainboard and interposer connectors
The following image shows the low-speed connectors (LS1, LS2, LS3), high-speed connectors (HS1, HS2, HS3), key ports, and power button from the top view of the mainboard.

**Figure: Top view of mainboard connectors**
The following image shows the bottom view of the mainboard without the baseplate:

**Figure: Bottom view of interposer connectors**
Low-speed connectors and high-speed connectors provide various functionalities including UART, SPI, camera CSI, interrupt signals, DC power, and additional GPIOs.
For more information, see [low-speed and high-speed expansion connectors](https://docs.qualcomm.com/doc/80-70030-251/topic/references.html#ls-hs-connectors).
## Vision mezzanine
The Vision mezzanine supports interfacing cameras on the Dragonwing RB3 Gen 2 Vision Kit through two, second-generation gigabit multimedia serial link (GMSL2) camera inputs and five CAM/CSI camera ports. This mezzanine also has four DMICs, an IMU, compass/magnetometer, and a pressure sensor. The following figure shows the inactive connectors on the Vision mezzanine.
>
>
> 
>
> **Figure: Vision mezzanine**
The following block diagram shows the components and connectors on the mainboard and Vision mezzanine:
>
>
> 
>
> **Figure: Vision mezzanine and mainboard block diagram**
The following key components are supported on the Vision mezzanine:
**Camera**
- Two GMSL2 camera inputs use MAX9296A and connect to CSI4 and CSI5 interfaces. The labels GMSL1 and GMSL2 on the board refer to connector names only; both inputs use GMSL2 technology.
- Five CAM/CSI camera ports have identical pinouts. CSI0 connects to two cameras: CAM0A and CAM0B.
- CAM3 connector supports an optional 5 V supply rail and is compatible with the Panasonic time-of-flight (TOF) camera.
- The main camera module (part number: CMK-IMX577-B-V2.0) connects to CAM3.
- The tracking camera module (part number: CMK-VR-OV9282-V1.0) connects to CAM0A.
**Sensors**
- Inertial Measurement Unit (IMU): The DK ICM-42688-P IMU is located on the back side of the board.
- Magnetometer: The AKM AK09919 module provides magnetometer functionality.
- Pressure sensor: The TDK ICP-10111 module is used for pressure sensing.
**Audio**
- Four digital PDM mics connect directly to the mainboard.
- The speaker connectors on the mezzanine are inactive. Active speaker connectors are located on the interposer.
## Sensors
Sensors are available on the mainboard and the Vision mezzanine. Only one IMU sensor can function at a time. If both sensors are enabled, only the Vision mezzanine IMU sensor functions.
The following table lists the sensor details and identifies the appropriate DIP switch for each sensor. For the location of the switches, see [DIP switches](https://docs.qualcomm.com/doc/80-70030-251/topic/references.html#dip-switches).
| Placement | Sensor part | Sensor type | DIP switch | Name | Details | Default |
| --- | --- | --- | --- | --- | --- | --- |
| Mainboard | ICM42688 | IMU sensor: Accelerometer and Gyroscope | DIP\_SW\_0 (pin 5) | SENSOR\_IM U\_TOGGLE |
ON: on-board IMU disabled
OFF: on-board IMU enabled
ON: Snapdragon sensor core (SSC) sensor SPI routed to IMU_SPI_SELECT switch
OFF: IMU sensor SPI passthrough
ON: IMU INT1 to ACCEL_I NT, IMU INT2 to GYRO_INT
OFF: IMU INT 1 and 2 disconnected
ON: on-board
OFF: disconnected
ON: on-board
OFF: disconnected