# Device description Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/device-description.html](https://docs.qualcomm.com/doc/80-73417-1/topic/device-description.html) The IQ-9075 (also known as the QCS9075) is part of the IQ9 Series platform SoCs, offering unparalleled on-device AI performance for the most demanding industrial applications. It provides design flexibility for high-compute, power-efficient performance, and is capable of handling heavy workloads in extreme environments. The QCS9075 device features the following major architectural blocks: - 2 × Quad Core Qualcomm Kryo™ Gen 6 CPU built on Arm v8.2 Cortex technology - 512 kB of L2 cache per Gold Prime core - 2 MB shared L3 cache per cluster - Qualcomm® Adreno™ 663 GPU for the highest in graphics performance and power efficiency - Dual Hexagon Tensor Processor (HTP) integrated with Qualcomm Hexagon DSP, Quad Hexagon Vector eXtensions (HVX), and dual Hexagon Matrix eXtensions (HMX) co-processors - Six-channel (independent) high-speed memory – 3200 MHz LPDDR5 SDRAM, with 6400 MT/s - 256 kB IMEM, 1.5 MB GMEM, 8 MB Vector-TCM per HTP - Qualcomm Spectra 690 ISP image processing engine - Qualcomm Adreno™ 765 VPU for high-quality, ultra HD video encode and decode - Dual Adreno DPU 1199 for ultra HD multi-display support - Dedicated real-time subsystem (RTSS) equipped with quad Cortex-R52 CPU [Detailed functional block diagram](https://docs.qualcomm.com/doc/80-73417-1/topic/introduction.html#concept.dita_3a2f6a06-5bce-409e-827e-ec80bd7e5e7f__fig_3) [Device physical dimensions](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#topic.dita_bfbab7db-cc9d-4bd5-af93-36c29eb760c6) [Device ordering information](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#topic_ydv_2bb_h2c) Last Published: Jun 30, 2026 [Next Topic Key features](https://docs.qualcomm.com/bundle/publicresource/80-73417-1/topics/key-features.md)