# Key features

Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/key-features.html](https://docs.qualcomm.com/doc/80-73417-1/topic/key-features.html)

- 1 × OSPI/QSPI interface (166 MHz) in RTSS domain for boot-up, multiplexed with RTSS
        GPIOs
- Two PCIe interfaces
    - 1 × 2-lane PCIe Gen4 (PCIe0)
    - 1 × 4-lane PCIe Gen4 (PCIe1)
- 2 × SGMII (SGMII0, SGMII1) in Main Domain supporting up to 3.125 Gbps
- 1 × RGMII v1.3 and v2.0 up to 1 Gbps over RTSS domain, muxed with RTSS GPIOs
- Three USB interfaces:
    - USB0 – USB 3.1 Gen 2 (HS + SS, support device and host modes)
    - USB1 – USB 3.1 Gen 2 (HS + SS, support device and host modes)
    - USB2 – USB 2.0 (HS, support device and host modes)
- 2 × UFS 3.1 up to Gear 4 (UFS0, UFS1), 2-Lanes, Rate B, 11.67 Gbps, bootable over UFS0
        only
- 1 × SDIO interface (SDC1) for eMMC 5.1 (bootable)/SD card (storage only)
- 4 × 4-lane CSI C-PHY/D-PHY interfaces (CSI0, CSI1, CSI2, CSI3)
    - 8-dedicated CCI\_I2C interfaces muxed with GPIOs
    - 4 camera MCLKs, muxed with GPIOs
    - Each 4-lanes PHY configurable as 2 PHYs with 1 + 2 lanes each
- 2 × 4-lane DSI C-PHY/D-PHY interfaces (DSI0, DSI1)
- 4 × DP/eDP interface up to 4-lanes. DP is compliant with VESA DisplayPort v1.4
- 149 GPIOs in Main Domain, 79 GPIOs in RTSS domain. Multiplexed with
        SPI/I²C/I3C/UART/CAN
- Audio interfaces like LS-I2S, PCM/TDM, HS-I2S

[Detailed features](https://docs.qualcomm.com/doc/80-73417-1/topic/introduction.html#concept.dita_ccec286c-3f72-433c-b4dc-e90f60d7d110)

Last Published: Jun 30, 2026

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