# PCB mounting guidelines

Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html)

## ELV and RoHS requirements

Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html)

The device meets the substance restriction requirements of the EU ELV directive and the EU
      RoHS directive. Its SnAgCu solder balls have SAC405 composition.

## SMT assembly guidelines

Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html)

For recommendations on SMT process development, see the [<cite class="cite">SMT Assembly Guidelines </cite> (SM80-P0982-1)](https://docs.qualcomm.com/bundle/SM80-P0982-1/resource/SM80-P0982-1.pdf).

##  Board-level reliability 

Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html)

QTI conducts characterization tests to assess the device's board-level reliability. See
            the [<cite class="cite">Board Level Reliability, FCBGA1723+HS</cite>
                (BR80-11744-1)](https://docs.qualcomm.com/bundle/BR80-11744-1/resource/BR80-11744-1.pdf) to download the board-level reliability data.

## High temperature warpage 

Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73417-1/topic/pcb-mounting-guidelines.html)

QTI measures package warpage across SMT reflow. See the [<cite class="cite">High Temperature Warpage, FCBGA1723+HS</cite>
                (WR80-11744-1)](https://docs.qualcomm.com/bundle/WR80-11744-1/resource/WR80-11744-1.pdf) to download the high temperature warpage data.

Last Published: Jun 30, 2026

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