# Revision history
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/revision-history.html](https://docs.qualcomm.com/doc/80-73417-1/topic/revision-history.html)
The following table lists the technical content changes for all revisions.
| Revision | Date | Description |
| --- | --- | --- |
| AJ | June 2026 |
- Device description: Updated the topic
- Key features: Updated the topic
- QCS9075 high-level block diagram and FCBGA1723+HS package outline drawing:
Updated the figure
- Primary pins: Updated the functional descriptions of
DDR_RESET_N, DS_EN, EBI01_CAL, EBI23_CAL, EBI45_CAL, REFGEN_REXT0, REFGEN_REXT1,
REFGEN_REXT2, REFGEN_REXT3, CXO_0, CXO_1, and RTSS_CXO
- Table : Operating conditions for non AVS voltage rails: Updated voltage range of VDD_A_PCIE_0_0P9
and VDD_A_PCIE_1_0P9
- Figure : Octa-SPI DDR timing diagram : Updated the figure
- Added the timing specifications in:
|
| Revision AI was omitted in
accordance with QTI document conventions. | Revision AI was omitted in
accordance with QTI document conventions. | Revision AI was omitted in
accordance with QTI document conventions. |
| AH | January 30, 2026 |
- Table IQ9 feature comparison summary:
- Updated TOPS numbers
- Updated memory description
- Processor: Updated CPU and artificial intelligence description
- Table Device identification details: Updated TOPS numbers
|
| AG | January 22, 2026 | Section *Thermal characteristics*: Updated link for the QCS9075 Package
Thermal Model FloTHERM |
| AF | January 7, 2026 |
- Table 1-1 IQ9 feature comparison summary: Added this table
- Primary pins: Updated description of PS_HOLD, MD_PS_HOLD, RTSS_PS_HOLD,
RESIN_N, RTSS_RESIN_N, RESOUT_N and RTSS_RESOUT_N
- Table 4-4 Device identification details: Added the CS sample for variant
000-AC
|
| AE | August 2025 |
- QCS9075 features: Removed all instances of QUP3_SE_0
- Digital logic characteristics:
- Table Digital I/Os specified in this section: Removed reference of
RGMII 2.5 V
- Table DC specification of 1.8 V I/Os: Removed IOZH and
IOZL, added footnote to VOL and VOH
- Table Possible drive strength settings: Added this table
- Table DC specifications for RGMII 1.8 V mode (VDD_RTSS_PX8): Added
footnote to VOL and VOH
- Table Possible drive strength: Added this table
- Table Digital I/O characteristics for UFS_RESET and UFS_REF_CLK
(VDD_PX9/VDD_PX10): Added footnote to VOL and
VOH
- Table DC specifications for PS_HOLD and MD_PS_HOLD (VDD_PX3): Removed
IOZH and IOZL, and added footnote to VOL
and VOH
|
| AD | July 2025 |
- Table Example device identification code: Added
example
- Device identification details: Updated ES and CS
information
- Table Qualification plan and results summary: Updated this table
- Editorial changes throughout the document
|
| AC | January 2025 | Editorial changes throughout the document |
| AB | October 2024 |
- Editorial changes throughout the document
- Thermal characteristics: Added FloTHERM thermal package model
- Samples and known issues: Added this chapter
|
| AA | September 2024 | Initial release |
Last Published: Jun 30, 2026
[Previous Topic
Samples and known issues](https://docs.qualcomm.com/bundle/publicresource/80-73417-1/topics/samples-and-known-issues.md)