# Revision history

Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/revision-history.html](https://docs.qualcomm.com/doc/80-73417-1/topic/revision-history.html)

The following table lists the technical content changes for all revisions.

| Revision | Date | Description |
| --- | --- | --- |
| AL | August 31, 2026 | [Figure : Simplified FCBGA1723+HS outline drawing](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#topic.dita_bfbab7db-cc9d-4bd5-af93-36c29eb760c6__fig_2): Updated the figure |
| AK | August 28, 2026 | Added information for clarity in:<ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_ygk_vdy_jkc"><br>                <li class="li">Figure 2-1 <em class="ph i">QCS9075 bottom pin assignments</em></li><br><br>                <li class="li">Figure 4-1 <em class="ph i">Simplified FCBGA1723+HS outline drawing</em></li><br><br>              </ul> |
| AJ | June 2026 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_ojt_53t_kjc"><br>                <li class="li">Device description: Updated the topic</li><br><br>                <li class="li">Features: Updated the topic</li><br><br>                <li class="li">QCS9075 high-level block diagram and FCBGA1723+HS package outline drawing:<br>                  Updated the figure</li><br><br>                <li class="li">Primary pins: Updated the functional descriptions of DDR_RESET_N, DS_EN,<br>                  EBI01_CAL, EBI23_CAL, EBI45_CAL, REFGEN_REXT0, REFGEN_REXT1, REFGEN_REXT2,<br>                  REFGEN_REXT3, CXO_0, CXO_1, and RTSS_CXO</li><br><br>                <li class="li">Table 3-3 <em class="ph i">Operating conditions for non AVS voltage rails</em>: Updated voltage<br>                  range of VDD_A_PCIE_0_0P9 and VDD_A_PCIE_1_0P9</li><br><br>                <br>                <li class="li">Figure 3-9 <em class="ph i">Octa-SPI DDR timing diagram</em>: Updated the figure</li><br><br>                <br>                <li class="li">Added the timing specifications in:<ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_tnb_djt_kjc"><br>                    <li class="li">Section 3.8.1 <em class="ph i">Camera interfaces </em></li><br><br>                    <li class="li">Section 3.8.3 <em class="ph i">Display support </em></li><br><br>                    <li class="li">Section 3.8.4 <em class="ph i">DisplayPort</em></li><br><br>                    <li class="li">Section 3.9.1 <em class="ph i">USB interfaces</em></li><br><br>                    <li class="li">Section 3.9.2 <em class="ph i">PCIe interface</em></li><br><br>                    <li class="li">Section 3.9.4 <em class="ph i">HSGMII interface</em></li><br><br>                    <li class="li">Section 3.9.5 <em class="ph i">Secured digital interfaces</em></li><br><br>                  </ul><br></li><br><br>              </ul><br><br>              <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_wmj_nvy_rjc"><br>                <li class="li">Section 3.9.12 <em class="ph i">CAN-FD-interface</em>: Updated this section</li><br><br>              </ul> |
| Revision AI was omitted in<br>              accordance with QTI document conventions. | Revision AI was omitted in<br>              accordance with QTI document conventions. | Revision AI was omitted in<br>              accordance with QTI document conventions. |
| AH | January 30, 2026 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_fss_5s5_c3c"><br>                <li class="li">Table <em class="ph i">IQ9 feature comparison summary</em>: <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_yhy_xs5_c3c"><br>                    <li class="li">Updated TOPS numbers</li><br><br>                    <li class="li">Updated memory description</li><br><br>                  </ul><br></li><br><br>                <li class="li"><em class="ph i">Processor</em>: Updated CPU and artificial intelligence description </li><br><br>                <li class="li">Table <em class="ph i">Device identification details</em>: Updated TOPS numbers</li><br><br>              </ul> |
| AG | January 22, 2026 | Section *Thermal characteristics*: Updated link for the QCS9075 Package<br>              Thermal Model FloTHERM |
| AF | January 7, 2026 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_esp_cjq_whc"><br>                <li class="li">Table 1-1 <em class="ph i">IQ9 feature comparison summary</em>: Added this table</li><br><br>                <li class="li"><em class="ph i">Primary pins</em>: Updated description of PS_HOLD, MD_PS_HOLD, RTSS_PS_HOLD,<br>                  RESIN_N, RTSS_RESIN_N, RESOUT_N and RTSS_RESOUT_N</li><br><br>                <li class="li">Table 4-4 <em class="ph i">Device identification details</em>: Added the CS sample for variant<br>                  000-AC</li><br><br>              </ul> |
| AE | August 2025 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_ngx_wsv_fgc"><br>                <li class="li"><em class="ph i">QCS9075 features</em>: Removed all instances of QUP3_SE_0</li><br><br>                <li class="li"><em class="ph i">Digital logic characteristics</em>: <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_v5b_ktv_fgc"><br>                    <li class="li">Table <em class="ph i">Digital I/Os specified in this section</em>: Removed reference of<br>                      RGMII 2.5 V </li><br><br>                    <li class="li">Table <em class="ph i">DC specification of 1.8 V I/Os</em>: Removed I<sub class="ph sub">OZH</sub> and<br>                        I<sub class="ph sub">OZL</sub>, added footnote to V<sub class="ph sub">OL</sub> and V<sub class="ph sub">OH</sub></li><br><br>                    <li class="li">Table <em class="ph i">Possible drive strength settings</em>: Added this table</li><br><br>                    <li class="li">Table <em class="ph i">DC specifications for RGMII 1.8 V mode (VDD_RTSS_PX8)</em>: Added<br>                      footnote to V<sub class="ph sub">OL</sub> and V<sub class="ph sub">OH</sub></li><br><br>                    <li class="li">Table <em class="ph i">Possible drive strength</em>: Added this table</li><br><br>                    <li class="li">Table <em class="ph i">Digital I/O characteristics for UFS_RESET and UFS_REF_CLK<br>                        (VDD_PX9/VDD_PX10)</em>: Added footnote to V<sub class="ph sub">OL</sub> and<br>                      V<sub class="ph sub">OH</sub></li><br><br>                  </ul><br><ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_ek4_qvv_fgc"><br>                    <li class="li"><p class="p">Table <em class="ph i">DC specifications for SPMI (VDD_PX0)</em></p><br>: Removed<br>                        I<sub class="ph sub">OZH</sub> and I<sub class="ph sub">OZL</sub>, and added footnote to V<sub class="ph sub">OL</sub><br>                      and V<sub class="ph sub">OH</sub></li><br><br>                  </ul><br><ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_uqm_yvv_fgc"><br>                    <li class="li">Table <em class="ph i">DC specifications for PS_HOLD and MD_PS_HOLD (VDD_PX3)</em>: Removed<br>                        I<sub class="ph sub">OZH</sub> and I<sub class="ph sub">OZL</sub>, and added footnote to V<sub class="ph sub">OL</sub><br>                      and V<sub class="ph sub">OH</sub></li><br><br>                  </ul><br></li><br><br>              </ul> |
| AD | July 2025 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_xrp_rqf_h2c"><br>                <li class="li" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__li_wbv_z4s_3fc">Table <em class="ph i">Example device identification code</em>: Added<br>                  example</li><br><br>                <li class="li" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__li_yrp_rqf_h2c"><em class="ph i">Device identification details</em>: Updated ES and CS<br>                  information</li><br><br>                <li class="li">Table <em class="ph i">Qualification plan and results summary</em>: Updated this table</li><br><br>                <li class="li" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__li_uvp_trf_h2c">Editorial changes throughout the document</li><br><br>              </ul> |
| AC | January 2025 | Editorial changes throughout the document |
| AB | October 2024 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_syr_syk_zcc"><br>                <li class="li">Editorial changes throughout the document</li><br><br>                <li class="li">Thermal characteristics: Added FloTHERM thermal package model</li><br><br>                <li class="li">Samples and known issues: Added this chapter</li><br><br>              </ul> |
| AA | September 2024 | Initial release |

Last Published: Aug 31, 2026

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Samples and known issues](https://docs.qualcomm.com/bundle/publicresource/80-73417-1/topics/samples-and-known-issues.md)