# Device description

Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/device-description.html](https://docs.qualcomm.com/doc/80-73475-1/topic/device-description.html)

QCS8275 (also known as IQ-8275) is the next generation Qualcomm® SoC designed for superior performance and power efficiency.

The QCS8275 device includes the following key components:

- Qualcomm® Kryo™  Gen 6 CPU built on Arm v8.2 Cortex technology
- 256 kB of L2 cache per core for Prime and Gold cores
- 64 kB of L2 cache per core and 512 kB shared L3 cache for Silver cores
- 1 MB shared L3 cache per cluster for Prime and Gold clusters
- Qualcomm® Adreno™  623 GPU for the highest in graphics performance and power
          efficiency
- Qualcomm® Hexagon™ Tensor Processor integrated with Qualcomm Hexagon DSP,
          quad Qualcomm Hexagon Vector eXtensions (HVX) processor, and dual Qualcomm Hexagon Matrix
          eXtensions (HMX) coprocessors for high performance machine learning use cases.
- Four-channel (independent) high-speed LPDDR5 SDRAM – up to 3200 MHz
- 256 kB IMEM, 1.5 MB GMEM, 8 MB Vector-TCM for HTP
- AI capability up to 40 TOPS (-AA) and 20 TOPS (-AC)

[Detailed functional block diagram](https://docs.qualcomm.com/doc/80-73475-1/topic/introduction.html#topic.dita_cd5b8f42-6c11-47d6-ba69-d16b45798308)

[Device physical dimensions](https://docs.qualcomm.com/doc/80-73475-1/topic/mechanical-information.html#topic.dita_bfbab7db-cc9d-4bd5-af93-36c29eb760c6)

[QCS8275 variant feature comparison](https://docs.qualcomm.com/doc/80-73475-1/topic/introduction.html#concept.dita_ccec286c-3f72-433c-b4dc-e90f60d7d110)

Last Published: Jul 21, 2026

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