# Key features

Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/key-features.html](https://docs.qualcomm.com/doc/80-73475-1/topic/key-features.html)

- Qualcomm Spectra™  692 ISP  image processing engine
- Adreno 623 VPU for high-quality, Ultra HD video encode and decode
- Qualcomm® Adreno™  1199 DPU for Ultra HD multi-display support
- Dedicated real time subsystem (RTSS) equipped with quad Arm Cortex-R52 CPU
- 1 × OSPI/QSPI interface (166 MHz) in RTSS domain for boot-up
- 2 × PCIe interfaces:
    - 1 × 2-lane PCIe Gen 4 (PCIe0)
    - 1 × 4-lane PCIe Gen 4 (PCIe1)
- 1 × SGMII (SGMII0) supporting up to 3.125 Gbps
- 1 × RGMII v1.3 and v2.0 up to 1 Gbps over RTSS domain, multiplexed with RTSS I/Os
- Two USB interfaces:
    - USB0 – USB 3.1 Gen 2 (HS and SS, supporting device and host modes)
    - USB1 – USB 2.0 (HS, supporting device and host modes)
- 1 × UFS 3.1 up to Gear 4 (UFS0), 2 lanes, Rate B, 11.67 Gbps (bootable)
- 1 × SDIO interface (SDC1) for eMMC 5.1 (bootable)/SD Card (storage only)
- 3 × 4-lane CSI C-PHY/D-PHY interfaces (CSI0, CSI1, CSI2)
    - 6 dedicated CCI\_I2C interfaces multiplexed with GPIOs
    - 3 camera MCLKs, multiplexed with GPIOs
    - Each 4-lane interface configurable as 2 × PHY with 2 or 1 lanes each
- 1 × 4-lane DSI C-PHY/D-PHY interface (DSI0)
- 1 × DP/eDP interface up to 4 lanes; DP is compliant with VESA DisplayPort v1.4
- 133 GPIOs in main domain, 68 GPIOs in RTSS domain, multiplexed with
          SPI/I²C/I³C/UART/CAN
- Audio interfaces: LS-I2S, PCM/TDM, HS-I2S

Last Published: Jul 21, 2026

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