# PCB mounting guidelines Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73475-1/topic/pcb-mounting-guidelines.html) ## ELV and RoHS requirements Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73475-1/topic/pcb-mounting-guidelines.html) The device meets the substance restriction requirements of the EU ELV directive and the EU RoHS directive. Its SnAgCu solder balls have SAC405 composition. ## SMT assembly guidelines Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73475-1/topic/pcb-mounting-guidelines.html) For recommendations on SMT process development, see the [SMT Assembly Guidelines (SM80-P0982-1)](https://docs.qualcomm.com/bundle/SM80-P0982-1/resource/SM80-P0982-1.pdf) ## Daisy-chain components Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-73475-1/topic/pcb-mounting-guidelines.html) Daisy-chain packages use the same processes and materials as actual products; they are recommended for SMT characterization and board-level reliability testing. The SMT process recommendations described in [SMT assembly guidelines](https://docs.qualcomm.com/doc/80-73475-1/topic/pcb-mounting-guidelines.html#concept_kfr_ws5_tzb) can be performed using daisy-chain components. For Daisy-chain PCB routing recommendations, see the [Daisy Chain Interconnect, FCBGA1326+HS, 25.0 × 25.0 mm, (DS90-31845-R1)](https://createpoint.qti.qualcomm.com/search/contentdocument/stream/dcn/DS90-31845-R1). Last Published: Jul 21, 2026 [Previous Topic Carrier, storage, and handling information](https://docs.qualcomm.com/bundle/publicresource/80-73475-1/topics/carrier.md) [Next Topic Part reliability](https://docs.qualcomm.com/bundle/publicresource/80-73475-1/topics/part-reliability.md)