# Revision history

Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/revision-history.html](https://docs.qualcomm.com/doc/80-73480-1/topic/revision-history.html)

The following table lists the technical content changes for all revisions.

| Revision | Date | Description |
| --- | --- | --- |
| AG | March 2026 | [Pin map](https://docs.qualcomm.com/doc/80-73480-1/topic/pin-definitions.html#nmp1605206419297) and [Pin descriptions](https://docs.qualcomm.com/doc/80-73480-1/topic/pin-definitions.html#kxg1605206453609): Updated<br>                            document download links |
| AF | November 2025 | Following are the changes made in this revision:<ul class="ul" id="concept_zzj_tbl_wcc__ul_fgs_l2m_bhc"><br>                                <li class="li">Chapter 4 <em class="ph i">Mechanical information</em>: Added the following<br>                                        topics<ul class="ul" id="concept_zzj_tbl_wcc__ul_kjh_g2m_bhc"><br>                                        <li class="li">Section 4.2 <em class="ph i">Part marking</em></li><br><br>                                        <li class="li">Section 4.3 <em class="ph i">Device ordering information</em></li><br><br>                                        <li class="li">Section 4.4 <em class="ph i">Device identification for each sample<br>                                                type</em></li><br><br>                                        <li class="li">Section 4.5 <em class="ph i">Thermal characteristics</em></li><br><br>                                    </ul><br></li><br><br>                                <li class="li">Chapter 7 <em class="ph i">Part reliability</em>: Added the following topics<ul class="ul" id="concept_zzj_tbl_wcc__ul_tyn_42m_bhc"><br>                                        <li class="li">Section 7.1 <em class="ph i">Reliability qualifications<br>                                            summary</em></li><br><br>                                        <li class="li">Section 7.2 <em class="ph i">Device characteristics</em></li><br><br>                                    </ul><br></li><br><br>                            </ul><br><ul class="ul" id="concept_zzj_tbl_wcc__ul_uz4_q2m_bhc"><br>                                <li class="li">Chapter 8 <em class="ph i">Samples and known issues</em>: Added this<br>                                    chapter</li><br><br>                            </ul> |
| AE | August 2025 | Following are the changes made in this revision:<ul class="ul" id="concept_zzj_tbl_wcc__ul_uy5_gkp_hgc"><br>                                <li class="li" id="concept_zzj_tbl_wcc__li_vy5_gkp_hgc">Operating conditions: Added a note regarding<br>                                    the operating condition specifications.</li><br><br>                                <li class="li" id="concept_zzj_tbl_wcc__li_qsd_lkp_hgc">Digital-logic characteristics: <ul class="ul" id="concept_zzj_tbl_wcc__ul_rxb_3mp_hgc"><br>                                        <li class="li" id="concept_zzj_tbl_wcc__li_sxb_3mp_hgc">Added a note regarding the operating<br>                                            temperature and voltage ranges.</li><br><br>                                        <li class="li" id="concept_zzj_tbl_wcc__li_ftm_mmp_hgc">Added a note regarding the digital<br>                                            logic characteristics specification.</li><br><br>                                        <li class="li" id="concept_zzj_tbl_wcc__li_f23_nmp_hgc">Added possible drive strength for<br>                                            all V<sub class="ph sub">OL</sub> and V<sub class="ph sub">OH</sub> parameters.</li><br><br>                                    </ul><br></li><br><br>                                <li class="li" id="concept_zzj_tbl_wcc__li_f33_qmp_hgc">Table : SDCC timing specification with<br>                                    respect to controller – regular mode: Added this table.</li><br><br>                            </ul> |
| AD | February 2025 | Following are the changes made in this revision: <ul class="ul" id="concept_zzj_tbl_wcc__ul_a2r_xzz_l2c"><br>                                <li class="li">QCS615 features: <ul class="ul" id="concept_zzj_tbl_wcc__ul_yjh_pc1_m2c"><br>                                        <li class="li" id="concept_zzj_tbl_wcc__li_b2r_xzz_l2c"><em class="ph i">Multimedia</em>: Updated Video<br>                                            encode to 4K30.</li><br><br>                                        <li class="li" id="concept_zzj_tbl_wcc__li_yhg_zzz_l2c"><em class="ph i">Physical interfaces</em>: Updated<br>                                            QSPI NOR flash external memory support.</li><br><br>                                        <li class="li" id="concept_zzj_tbl_wcc__li_odn_111_m2c"><em class="ph i">Wireless connectivity</em>: Added<br>                                            QCA6698 wireless connectivity.</li><br><br>                                    </ul><br></li><br><br>                            </ul> |
| AC | January 2025 | Editorial changes made; no technical updates. |
| AB | October 2024 | Restructured the document to adhere to HTML standards. Review the<br>                            document in its entirety. |
| AA | September 2024 | Initial release |

Last Published: Mar 09, 2026

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Samples and known issues](https://docs.qualcomm.com/bundle/publicresource/80-73480-1/topics/samples-and-known-issues1.md)