# Mechanical information
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html)
This topic provides module mechanical information including dimensions, markings, and
ordering information.
## Device physical dimensions
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html)
Figure : QCC744M-0B LGM52
outline drawing
Figure : QCC744M-0U LGM52A
outline drawing
## Part marking
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html)
The markings located on the top side of the module are presented here.
Figure : QCC744M-0B LGM52
device marking (top view, not to scale)
Figure : QCC744M-0U LGM52A
device marking (top view, not to scale)
| Line | Marking | Description |
| --- | --- | --- |
| C1 | Qualcomm | Qualcomm logo |
| P1 | PRODUCT | QCC744M |
| P2 | VARIANT | Variant information |
| T1 | COO | Country of origin |
| T2 | VQFRRAAYMDSSSS | Device serial content |
| T3 | MAC: XX:XX:XX:XX:XX:XX | MAC address |
| - | QR Code | MAC Address, same content as Line T3 |
## Device ordering information
Source: [https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html)
The short description is used to order QTI products, and is present on both the customer
label and in this document. The short description includes the product name,
configuration code, package type, product revision code, source code, and feature
code/program ID of the part.
This device can be ordered using the identification code as shown in the following
table:
| Device ID code | AAA-AAAA | -P | -TTTTTT | A | -RR | -S | -BB or -PID[^1^](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html#fntarg_1_device-ordering-information) |
| --- | --- | --- | --- | --- | --- | --- | --- |
| Symbol definition | Product name | Configuration code | Package type | Package variable | Product revision | Source code | Feature code |
| Example | QCC-744M | -2 | -LGM52 | -MT | -01 | -0 | -AA |
| Example | QCC-744M | -2 | -LGM52 | -TR | -01 | -0 | -AA |
| Example | QCC-744M | -2 | -LGM52A | -MT | -01 | -0 | -AB |
| Example | QCC-744M | -2 | -LGM52A | -TR | -01 | -0 | -AB |
| | | | | | | | |
| | | | | | | | |
| | | | | | | | |
[^1^](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html#fnsrc_1_device-ordering-information) The
feature code (BB) and the program ID (PID) are mutually exclusive. A
product may have one of them or none of them, but it will never have
both. If there is no feature code/program ID, this field is blank,
and the short description ends after the source configuration code
(S).
Note:
The shipping package is either TR (tape and reel) or MT (matrix tray).
For availability and information to order QTI products, contact the Qualcomm sales
team.
The following table summarizes the device identification details for all samples:
| Device | Sample type | Variant (PRR-BB)[^2^](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html#fntarg_2_device-ordering-information) | Source configuration code
(S)[^3^](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html#fntarg_3_device-ordering-information) | Comments | Comments | Sample date (in MM/DD/YY
format) |
| --- | --- | --- | --- | --- | --- | --- |
| QCC744M | CS | 201-AA | 0 | QCC744M (201-0-AA), LGM52, MODULE WITH
2.4GHZ WIFI6, BT/BLE 5.X, 802.15.4, RISC-V, I-TEMP, QFN-56, 4MB PSRAM;
W/PCB ANTENNA, WALSIN | QCC744M (201-0-AA), LGM52, MODULE WITH
2.4GHZ WIFI6, BT/BLE 5.X, 802.15.4, RISC-V, I-TEMP, QFN-56, 4MB PSRAM;
W/PCB ANTENNA, WALSIN | 9/26/2025 |
| QCC744M | CS | 201-AB | 0 | QCC744M (201-0-AB), LGM52A, MODULE WITH
2.4GHZ WIFI6, BT/BLE 5.X, 802.15.4, RISC-V, I-TEMP, QFN-56, 4MB PSRAM;
W/RF CONNECTOR, WALSIN | QCC744M (201-0-AB), LGM52A, MODULE WITH
2.4GHZ WIFI6, BT/BLE 5.X, 802.15.4, RISC-V, I-TEMP, QFN-56, 4MB PSRAM;
W/RF CONNECTOR, WALSIN | 9/26/2025 |
[^2^](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html#fnsrc_2_device-ordering-information) P =
product configuration code; RR = product revision code; BB = feature
code that identifies an IC’s specific feature set, which
distinguishes it from other versions or variants. Feature sets are
detailed in the comments column.
[^3^](https://docs.qualcomm.com/doc/80-78831-1/topic/mechanical-information.html#fnsrc_3_device-ordering-information) S is the source configuration code that identifies all of the
qualified die fabrication-source combinations available when the
particular sample type was shipped.
Last Published: Apr 08, 2026
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