# Ground

Source: [https://docs.qualcomm.com/doc/80-WL740-3/topic/ground.html](https://docs.qualcomm.com/doc/80-WL740-3/topic/ground.html)

If designing a module using the QCC74x, note the following:

- The EPAD on the back of the module should have exposed copper, and should be
                connected to the system motherboard in actual applications.
- The diameter of the vias on the EPAD shouldn't exceed 10 mil to prevent solder
                wicking.
- Reserve a ground pad or a via stitching area on both sides of the module’s antenna
                to minimize coupling to other I/Os.
- Drill multiple ground vias on the top and bottom layers to reduce the current
                path.

Last Published: Apr 08, 2025

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