# Electrical specifications
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html)
Note: The information in this chapter is preliminary and subject to
change without notice.
## Absolute maximum ratings
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html)
The absolute maximum ratings reflect the stress levels that, if exceeded, may cause
permanent damage to the device. No functionality is guaranteed outside the operating
specifications. Functionality and reliability are only guaranteed within the operating
conditions described in [Operating conditions](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html#operating-condition).
Table : Absolute maximum ratings
| Pin name | Min. | Max. | Unit |
| --- | :---: | :---: | :---: |
| AVDD33\_RF1
AVDD33\_RF2
AVDD33\_RF3
AVDD33\_AON
PVDD33\_DCDC
VDD33 | -0.3 | 3.63 | V |
| VDDIO1
VDDIO2 | -0.3 | 3.63 | V |
| ESD protection (HBM) | – | 2000 | V |
| TS (Storage temperature)[^1^](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html#fntarg_1_absolute-maximum-ratings)[^2^](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html#fntarg_2_absolute-maximum-ratings) | -55 | +150 | °C |
[^1^](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html#fnsrc_1_absolute-maximum-ratings) The storage temperature range
applies when the device is in the OFF state (the device is not
assembled in any platform and is not electrically connected to any
voltage or I/O signals). Damage may occur when the device is
subjected to this temperature for any length of time.
[^2^](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html#fnsrc_2_absolute-maximum-ratings) For
devices shipped in tape and reel, the storage temperature range is
[+15°C +35°C] and < 90% relative humidity (RH). QTI recommends
allowing the device to return to ambient room temperature before
usage.
## Operating conditions
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html)
Operating conditions include design team-controlled parameters such as power supply
voltage, power distribution impedances, and thermal conditions. The QCC743/QCC744 meets all performance specifications when used within the
operating conditions, unless otherwise noted in those sections (provided the absolute
maximum ratings have never been exceeded).
| Pin name | Min. | Typ | Max. | Unit |
| --- | --- | --- | --- | --- |
| AVDD33\_RF1
AVDD33\_RF2
AVDD33\_RF3
AVDD33\_AON
PVDD33\_DCDC
VDD33 | 2.97 | 3.3 | 3.63 | V |
| VDDIO1
VDDIO2 | 2.97/1.62 | 3.3/1.8 | 3.63/1.98 | V |
| | | | | |
| Item | Item | Min. | Max. | Unit |
| --- | --- | --- | --- | --- |
| Temperature | Main die | -40 | 105 | °C |
| Temperature | Multi-die SiP | -40 | 85 | °C |
| | | | | |
Table : General operating conditions
| Item | Description | Min. | Typ | Max. | Unit |
| --- | --- | :---: | :---: | :---: | :---: |
| FCPU | CPU/TCM/Cache clock frequency | – | 320 | – | MHz |
| FBUS | System bus clock frequency | – | 80 | – | MHz |
## Temperature sensor characteristics
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html)
| Parameters | Parameters | Min. | Typ | Max. | Unit |
| --- | --- | --- | --- | --- | --- |
| Ta | Main die ambient temperature | -40 | – | 105 | °C |
| Ta | Multi-die SiP ambient temperature | -40 | – | 85 | °C |
| Tj | Operating temperature (junction) | – | – | 125 | °C |
| | | | | | |
## Power-on sequence
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html)
To ensure normal power-on start-up, the power, reset, and bootstrap pins must meet the
corresponding timing requirements.
Figure : Power-on sequence

Table : Power-on sequence parameters
| Parameters | Description | Min.(ms) | Typ(ms) | Max.(ms) |
| :---: | --- | :---: | :---: | :---: |
| t0 | The power supply voltage reaches 90% rise time[^1^](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html#fntarg_1_power-on-sequence) | - | 0.1 | - |
| t1 | Internal POR duration | - | 3 | - |
| t2 | VDDCORE setting time after Internal POR down | - | 1 | - |
| t3.1 | Bootstrap pin[^2^](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html#fntarg_2_power-on-sequence) preparation time before VDDCORE establishment | 0 | - | - |
| t3.2 | Duration of valid voltage level at the bootstrap pin. | 2 | - | - |
| t4 | XTAL startup time after internal POR down | - | 1 | - |
[^1^](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html#fnsrc_1_power-on-sequence) VDD\_min is the
minimum value for proper chip operation.
[^2^](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html#fnsrc_2_power-on-sequence) Bootstrap pin is GPIO2.
## Shutdown sequence
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html)
Figure : Shutdown sequence

Table : Shutdown sequence parameters
| Parameters | Description | Min. | Typ | Max. | Unit |
| :---: | --- | :---: | :---: | :---: | :---: |
| VRST | Shutdown occurs after CHIP\_EN lower than this voltage | 0 | 0.1\*VDD33 | 0.3\*VDD33 | V |
| tRST | The required time that CHIP\_EN lower than VRST | 1 | 1 | - | ms |
| tpd | Time for VDDCORE to decrease to 0 after shutdown | 1 | 1 | - | ms |
## Power tree
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html)
Figure : Power block diagram
## DC power characteristics
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/electrical-specifications.html)
Test conditions: VDDIO = 3.3 V, temperature = 25°C
| Symbol | Description | GPIO number | Conditions | Min. | Typ | Max. | Unit |
| --- | --- | --- | --- | --- | --- | --- | --- |
| VOH | Output voltage high | GPIO21-22, GPIO28-29 | GPIO drive strength 0, source current = 2.8 mA | – | 0.9\*VDDIO | – | V |
| VOH | Output voltage high | GPIO21-22, GPIO28-29 | GPIO drive strength 1, source current = 9.5 mA | – | 0.9\*VDDIO | – | V |
| VOH | Output voltage high | GPIO21-22, GPIO28-29 | GPIO drive strength 2, source current = 17.4 mA | – | 0.9\*VDDIO | – | V |
| VOH | Output voltage high | GPIO21-22, GPIO28-29 | GPIO drive strength 3, source current = 23.8 mA | – | 0.9\*VDDIO | – | V |
| VOH | Output voltage high | GPIO0-20,
GPIO23-27,
GPIO30-34 | GPIO drive strength 0, source current = 2.9 mA | – | 0.9\*VDDIO | – | V |
| VOH | Output voltage high | GPIO0-20,
GPIO23-27,
GPIO30-34 | GPIO drive strength 1, source current = 8.5 mA | – | 0.9\*VDDIO | – | V |
| VOH | Output voltage high | GPIO0-20,
GPIO23-27,
GPIO30-34 | GPIO drive strength 2, source current = 16.8 mA | – | 0.9\*VDDIO | – | V |
| VOH | Output voltage high | GPIO0-20,
GPIO23-27,
GPIO30-34 | GPIO drive strength 3, source current = 22.2 mA | – | 0.9\*VDDIO | – | V |
| VOL | Output voltage low | GPIO21-22, GPIO28-29 | GPIO drive strength 0, sink current = 3.4 mA | – | 0.1\*VDDIO | – | V |
| VOL | Output voltage low | GPIO21-22, GPIO28-29 | GPIO drive strength 1, sink current = 10.2 mA | – | 0.1\*VDDIO | – | V |
| VOL | Output voltage low | GPIO21-22, GPIO28-29 | GPIO drive strength 2, sink current = 20 mA | – | 0.1\*VDDIO | – | V |
| VOL | Output voltage low | GPIO21-22, GPIO28-29 | GPIO drive strength 3, sink current = 26.5 mA | – | 0.1\*VDDIO | – | V |
| VOL | Output voltage low | GPIO0-20,
GPIO23-27,
GPIO30-34 | GPIO drive strength 0, sink current = 3.1 mA | – | 0.1\*VDDIO | – | V |
| VOL | Output voltage low | GPIO0-20,
GPIO23-27,
GPIO30-34 | GPIO drive strength 1, sink current = 9.2 mA | – | 0.1\*VDDIO | – | V |
| VOL | Output voltage low | GPIO0-20,
GPIO23-27,
GPIO30-34 | GPIO drive strength 2, sink current = 18.2 mA | – | 0.1\*VDDIO | – | V |
| VOL | Output voltage low | GPIO0-20,