# Mechanical information
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html)
## Device physical dimensions
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html)
### QCC743 QFN-40 device physical dimensions
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html)
Figure : QCC743 QFN-40 package drawing
| Symbol | Unit of measure = millimeter | Unit of measure = millimeter | Unit of measure = millimeter |
| --- | --- | --- | --- |
| Symbol | Min | Nom | Max |
| A | 0.80 | 0.85 | 0.90 |
| A1 | 0.00 | 0.02 | 0.05 |
| A2 | 0.60 | 0.65 | 0.70 |
| A3 | 0.20 REF | 0.20 REF | 0.20 REF |
| b | 0.15 | 0.20 | 0.25 |
| D | 4.90 | 5.00 | 5.10 |
| E | 4.90 | 5.00 | 5.10 |
| D2 | 3.60 | 3.70 | 3.80 |
| E2 | 3.60 | 3.70 | 3.80 |
| e | 0.35 | 0.40 | 0.45 |
| K | 0.20 | - | - |
| L | 0.35 | 0.40 | 0.45 |
| R | 0.075 | - | - |
| c1 | - | 0.12 | - |
| c2 | - | 0.12 | - |
| | | | |
### QCC744 QFN-56 device physical dimensions
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html)
Figure : QCC744 QFN-56 package drawing
| Symbol | Unit of measure = millimeter | Unit of measure = millimeter | Unit of measure = millimeter |
| --- | --- | --- | --- |
| Symbol | Min | Nom | Max |
| A | 0.80 | 0.85 | 0.90 |
| A1 | 0.00 | 0.02 | 0.05 |
| A2 | 0.60 | 0.65 | 0.70 |
| A3 | 0.20 REF | 0.20 REF | 0.20 REF |
| b | 0.15 | 0.20 | 0.25 |
| D | 6.90 | 7.00 | 7.10 |
| E | 6.90 | 7.00 | 7.10 |
| D2 | 5.10 | 5.20 | 5.30 |
| E2 | 5.10 | 5.20 | 5.30 |
| e | 0.30 | 0.40 | 0.50 |
| H | 0.35 REF | 0.35 REF | 0.35 REF |
| K | 0.50 REF | 0.50 REF | 0.50 REF |
| L | 0.35 | 0.40 | 0.45 |
| R | 0.09 | - | - |
| | | | |
## Part marking
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html)
### QCC743 part marking
Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html)
Figure : QCC743 device marking
| Line | Marking | Description |
| --- | --- | --- |
| C1 | Qualcomm | Qualcomm name |
| P1 | PRODUCT | Qualcomm Technologies, Inc. (QTI) product name |
| P2 | VARIANT | Variant code (PRR) |
| T1 | AYWWXXX | A = assembly site codeA = S (SPIL, Suzhou) A = 1 (TFME) A = S (SPIL, Suzhou) A = 1 (TFME)
Page-1 Sheet.1 Sheet.2 Sheet.3 Sheet.4 Sheet.5 Example Sheet.6 Device ID code code Sheet.7 Symbol definition definition Sheet.8 Product name name Sheet.9 AAA-AAAA Sheet.10 Config code code Sheet.11 P Sheet.12 Sheet.13 Sheet.14 Sheet.15 Sheet.16 Sheet.17 Sheet.18 Sheet.19 Sheet.20 Sheet.21 Sheet.22 Sheet.23 Sheet.24 Sheet.25 Sheet.26 Sheet.27 Sheet.28 Sheet.29 Sheet.30 Sheet.31 Sheet.32 Sheet.33 Sheet.34 Sheet.35 Sheet.36 Sheet.37 Number of pins of pins Sheet.38 Sheet.39 Sheet.40 Sheet.41 Sheet.42 Sheet.43 Package type type Sheet.44 Sheet.45 Sheet.46 Sheet.47 Sheet.48 Sheet.49 Shipping package package Sheet.50 Sheet.51 Sheet.52 Sheet.53 Sheet.54 Sheet.55 Product revision revision Sheet.56 Sheet.57 Sheet.58 Sheet.59 Sheet.60 Sheet.61 Source code code Sheet.62 Sheet.63 Sheet.64 Sheet.65 Sheet.66 Sheet.67 BBB Sheet.68 CCC Sheet.69 EE Sheet.70 RR Sheet.71 S Sheet.72 — Sheet.73 — Sheet.74 — Sheet.75 — Sheet.76 — Sheet.77 WCN-7881 3 Sheet.78 1 Sheet.79 NSP Sheet.80 377 Sheet.81 TR or MT Sheet.82 00 Sheet.83 0 Sheet.84 — Sheet.85 — Sheet.86 — Sheet.87 — Sheet.88 — Sheet.89 Sheet.90 Sheet.91 Sheet.92 Sheet.93 Sheet.94 Sheet.95 Sheet.96 Sheet.97 CCC is not a fixed length; it depends on the # of pins in the... the # of pins in the package. Sheet.98 Sheet.99 Package type varies in the # of characters. the # of characters. Sheet.100 Sheet.101 Feature or PID Code or PID Code Sheet.102 BB Sheet.103 —
JA | Thermal resistance, J-to-A | Junction-to-ambient (still air) [^1^](https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html#fntarg_1_thermal-characteristics) | 38 | °C/W |
[^1^](https://docs.qualcomm.com/doc/80-WL743-1/topic/mechanical-information.html#fnsrc_1_thermal-characteristics) Package mounted on 4LPCB using
Finite Differential Modeling (FDM) method.
Last Published: Apr 22, 2026
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