# Part reliability Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/part-reliability.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/part-reliability.html) ## Reliability qualifications summary Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/part-reliability.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/part-reliability.html) Table : Silicon reliability results | Tests, standards, and conditions | Sample size | Result | | --- | :---: | :---: | | **HTOL in FIT (ƛ) failure in billion device hours**



HTOL: JESD22-A108



(Total samples from two wafer lots) | 77 x 2 lots | Pass



FIT < 50 | | **Mean time to failure (MTTF) t = 1/ ƛ in million hours**



(Total samples from two wafer lots) | 77 x 2 lots | Pass



>20 | | **ESD – human-body model (HBM) rating**



JS-001-2017



(Total samples from one wafer lot) | 3 | Pass +/-2 KV | | **ESD – charged-device model (CDM) rating**



JS-002-2018



(Total samples from one wafer lot) | 3 | Pass +/-500 V | | **Latch-up (I-test): EIA/JESD78**



Trigger current: ±200 mA



(Total samples from one wafer lot) | 3 | Pass | | **Latch-up (Vsupply overvoltage): EIA/JESD78**



Trigger voltage: Each VDD pin, stress at 1.5 x Vddmax per
device



(Total samples from one wafer lot) | 3 | Pass | Table : Package reliability results | Tests, standards, and conditions | SPIL sample size | TFME sample size | Result | | --- | :---: | :---: | :---: | | **Moisture resistance test (MRT):** J-STD-020/JESD22-A113



Pre-bake 125°C, 24 hours



Moisture soak: 30°C &60% RH for 192 hours



3 cycles IR reflow at 260°C | 231 x 1 lot | 231 x 1 lot | Pass | | **Temperature cycle:** JESD22-A104



Temperature: -65°C to 150°C; number of cycles: 1000



Preconditioning: J-STD-020/JESD22-A113



MSL3, reflow temperature: 260°C | 77 x 1 lot | 77 x 1 lot | Pass | | **Unbiased highly accelerated stress test**: JESD22-A118



130°C/85% RH and 192 hour duration



Preconditioning: J-STD-020/JESD22-A113



MSL3, reflow temperature: 260°C | 77 x 1 lot | 77 x 1 lot | Pass | | **Biased highly accelerated stress test:** JESD22-A110



130°C/85% RH and 96 hour duration



Preconditioning: J-STD-020/JESD22-A113



MSL3, reflow temperature: 260°C | 77 x 1 lot | 77 x 1 lot | Pass | | **High-temperature storage life:** JESD22-A103



Temperature 150°C and 1000 hours duration | 77 x 1 lot | 77 x 1 lot | Pass | ## Device characteristics Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/part-reliability.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/part-reliability.html) Table : Device characteristics | Category | Definition | | --- | --- | | Device name | | | Package type | | | Package size | | | Fab process | 40 nm | | Fab location | UMC | | Assembly sites | | Last Published: Apr 22, 2026 [Previous Topic PCB mounting guidelines](https://docs.qualcomm.com/bundle/publicresource/80-WL743-1/topics/pcb-mounting-guidelines.md) [Next Topic Samples and known issues](https://docs.qualcomm.com/bundle/publicresource/80-WL743-1/topics/samples-and-known-issues.md)