# PCB mounting guidelines

Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/pcb-mounting-guidelines.html)

## RoHS declaration

Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/pcb-mounting-guidelines.html)

This device meets the substance restriction requirements of the EU RoHS directive. The
            composition of second-level interconnect is Matte Sn.

## SMT assembly guidelines

Source: [https://docs.qualcomm.com/doc/80-WL743-1/topic/pcb-mounting-guidelines.html](https://docs.qualcomm.com/doc/80-WL743-1/topic/pcb-mounting-guidelines.html)

For recommendations on SMT process development, see the <cite class="cite">SMT Assembly
                Guidelines</cite> (SM80-P0982-1).

Last Published: Apr 22, 2026

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