# Mechanical information
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html)
This topic provides IC mechanical information including dimensions, markings, ordering information, and thermal characteristics.
## Device physical dimensions
The QRB2210 device is available in the NSP752, a 12 mm × 12.4 mm non-PoP package. The package includes many ground pins for improved electrical grounding, mechanical strength, and thermal continuity. Pin A1 is located by an indicator mark on the top of the package, and by the ball pattern when viewed from below. A simplified version of the package outline drawing is shown in the following figure.
Note:
Click [Package Outline Drawing, NSP752,
12.0 mm × 12.4 mm × 0.91 mm, M530, S143 (NT90-PR195-1)](https://docs.qualcomm.com/bundle/NT90-PR195-1/resource/NT90-PR195-1.pdf) to download the
drawing.
Figure : NSP752 (12.0 × 12.4 × 0.91 mm) outline drawing
## Part marking
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html)
Figure : QRB2210 device marking (top view, not to scale)
| Line | Marking | Description |
| --- | --- | --- |
| C1 | Qualcomm | Qualcomm name |
| P1 | PRODUCT | QTI product name
|
| | Blank or random | Optional information |
| T1 | FAYWWXXX | F = supply source code
F = H (GLOBALFOUNDRIES)
F = J (Samsung)
A = assembly site code
A = E (ASE, Taiwan)
A = U (Amkor, China)
A = K (SPIL, Taiwan)
Y = single/last digit of year
WW = two-digit work week of year specified by Y
XXX = traceability number |
| T1 | ● | Ball A1 indicator |
| | | |
## Device ordering information
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html)
The Oracle short description is used to order QTI products, and is present on both the customer label and this document. The short description includes the product name, configuration code, package type, product revision code, source code, and feature code/program ID of the part.
This device can be ordered using the identification code shown in the following table.
Table : Device identification code
| Device ID code | AAA- AAAA | -P | -TTTTTT | NNNN | A | +FF | -EE | -RR | -S | -BB or
**-PID** [^1^](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#fntarg_1_Device_ordering_information) |
| :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: |
| Symbol definition | Product name | Configuration code | Package type | Number of pins | Package variable | Additional package information | Shipping package | Product revision | Source code | Feature code |
| Example | QRB-2210 | -0 | -NSP | 752 | | | -TR | -00 | -0 | |
[^1^](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#fnsrc_1_Device_ordering_information) The feature code (BB) and the program ID (PID) are mutually exclusive. A product may have one of them or none of them, but it will never have both. If there is no feature code/program ID, this field is blank, and the Oracle short description ends after the source configuration code (S).
For example: QRB-2210-0-NSP752-TR-00-0
Note: The shipping package is either TR (tape and reel) or MT (matrix tray).
## Device identification for each sample type
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html)
Device identification details for all samples available to date are summarized in the following table.
Table : Device identification details
| Device | Sample type | Variant (PRR-BB)
| 0x0 01C8 0E1 | 0x0 | v1.0 | 0 | NSP752, CPU 2.0, GPU 845, 13 MP + 13 MP, LP4 at 1866 MHz, LP3, NAVIC, SVA, S\_CAM, 1080P30 encode/decode, IoT, RB1, Samsung/GLOBALFOUNDRIES | 05/31/2022 |
[^1^](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#fnsrc_1_device-identification-for-each-sample-type) BB is the feature code that identifies an IC’s specific feature set, which distinguishes it from other versions or variants. Feature sets are detailed in the comments column.
[^2^](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#fnsrc_2_device-identification-for-each-sample-type) The FEATURE\_ID
combined with the hardware revision number (JTAG\_ID) defines unique product
variants. This information is shown for situations where other device
identification information (such as device marking information) is not easily
accessible.
[^3^](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#fnsrc_3_device-identification-for-each-sample-type) S is the source configuration code that
identifies all of the qualified die fabrication-source combinations available when
the particular sample type was shipped. The S values are defined in [Table : Source configuration code](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#iqr1594375905599__table_ajs_ajl_bkb).
| S value | Die | F value = H | F value = J | A value = E | A value = U | A value = K |
| --- | --- | --- | --- | --- | --- | --- |
| 0 | Digital | GLOBALFOUNDRIES | Samsung | ASE, Taiwan | Amkor, China | SPIL, Taiwan |
| Other columns and rows will be added in future revisions of this document, if needed. | Other columns and rows will be added in future revisions of this document, if needed. | Other columns and rows will be added in future revisions of this document, if needed. | Other columns and rows will be added in future revisions of this document, if needed. | Other columns and rows will be added in future revisions of this document, if needed. | Other columns and rows will be added in future revisions of this document, if needed. | Other columns and rows will be added in future revisions of this document, if needed. |
The 28‑bit QFPROM JTAG register is summarized in the following table:
Table : QFPROM_CORR_JTAG_ID_LSB register
| Bit location | Name | Description |
| :---: | :---: | --- |
| bits [27:20] | FEATURE\_ID | These bits are used for defining various feature variants (see [Table : Device identification details](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#iqr1594375905599__table_hwg_5vl_bkb)). |
| bits [19:0] | JTAG\_ID | These bits map to bits [31:12] of the hardware revision number (see [Table : Device identification details](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#iqr1594375905599__table_hwg_5vl_bkb)). |
The device identification register allows the user to determine the device’s manufacturer,
part number, and version via the test access port (TAP). The 32-bit device identification
register is read through the JTAG interface and is summarized in the following table.
Table : Device identification register
| Bit location | Description | Value[^4^](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#fntarg_4_device-identification-for-each-sample-type) |
| --- | --- | --- |
| bits [31:28] | Version data
(may change with sample type) | 0x0 |
| bits [27:12] | Part number
(QTI code) |
| bit [0] | Device identification register start bit | Always = 1 |
[^4^](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#fnsrc_4_device-identification-for-each-sample-type) The hardware revision numbers for all sample types are provided in [Table : Device identification details](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#iqr1594375905599__table_hwg_5vl_bkb).
## Thermal characteristics
Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html)
Rather than providing thermal resistance values Ө JC and Ө JA, validated thermal package models are provided through the Qualcomm website. Designers can extract thermal resistance values by conducting their own thermal simulations.
Note:
Click [QRB2210 Package Thermal Model Icepak
(HS11-30843-5HW)](https://docs.qualcomm.com/bundle/HS11-30843-5HW/resource/HS11-30843-5HW.zip) and [QRB2210 Package Thermal Model FloTHERM
(HS11-30843-6HW)](https://docs.qualcomm.com/bundle/HS11-30843-6HW/resource/HS11-30843-6HW.zip) to download the package thermal models from the Qualcomm
website.
Last Published: Oct 08, 2025
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