# Mechanical information
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html)
## Device physical dimensions
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html)
The QCS9075 device is available in the FCBGA1723+HS package,
with a 25.0 mm × 25.0 mm body and a maximum height of 2.31 mm. This package includes many
ground pins for improved electrical grounding, mechanical strength, and thermal continuity.
Pin A1 is located by an indicator mark on the top of the package, and by the ball pattern when
viewed from below. The following figure shows a simplified version of the package outline
drawing.
Click [Package Outline Drawing, FCBGA1723+HS, 25.0 × 25.0 × 2.31
mm, L1250, PL1, HS1 (NT90-11744-1)](https://docs.qualcomm.com/bundle/NT90-11744-1/resource/NT90-11744-1.pdf) to download the drawing.
Figure : Simplified FCBGA1723+HS outline drawing
## Part marking
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html)
Figure : Device marking (top view, not to scale)
Table : QCS9075 marking line definitions
| Line | Marking | Definition |
| --- | --- | --- |
| C1 | Qualcomm | Qualcomm name or logo |
| P1 | PRODUCT | Qualcomm Technologies, Inc. (QTI) product name
|
| E | Blank or random | Optional or Additional trace information |
| T1 | • | Pin 1 or pin A1 indicator |
| | FAYWWXXX | F = supply source code
F = J (Samsung)
A = assembly site code
A = C (Amkor, Korea)
A = K (SPIL, Taiwan)
Y = single/last digit of year
WW = two-digit work week of year specified by Y
XXX = traceability number |
Table : QFPROM_CORR_PTE_ROW0_LSB (Address: 0x784158)
| Bit location | Name | Description |
| --- | --- | --- |
| bits [27:20] | FEATURE\_ID | These bits are used for defining various feature variants (see [Table : Device identification details](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#topic.dita_c837bfca-5edc-47b9-88b7-a4a1772500af__table_3)). |
| bits [19:0] | JTAG\_ID | These bits map to bits [31:12] of the hardware revision number (see [Table : Device identification details](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#topic.dita_c837bfca-5edc-47b9-88b7-a4a1772500af__table_3)). |
## Device ordering information
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html)
The Oracle short description is used to order QTI products, and is present on both the
customer label and this document. The short description includes the product name,
configuration code, package type, product revision code, source code, and feature
code/program ID of the part. This device can be ordered using the identification code
shown in the following table.
Table : Example device identification code
| Device ID code | AAA-**AAAA** | -P | TTTTTT | NNNN | A | +FF | -EE | -RR | -S[^1^](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#fntarg_1_device-ordering-information) | -BB or
-PID[^2^](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#fntarg_2_device-ordering-information) |
| :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: |
| Symbol definition | Product name | Configuration code | Package type | Number of pins | Package variable | Additional package information | Shipping package | Product revision | Source code | Feature code |
| Example 1 | QCS-9075 | 0 | -FCBGA | 1723 | | +HS | -MT | -00 | -0 | -AA |
| Example 2 | QCS-9075 | 0 | -FCBGA | 1723 | | +HS | -MT | -00 | -0 | -AC |
[^1^](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#fnsrc_1_device-ordering-information) Source code is always '0'
[^2^](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#fnsrc_2_device-ordering-information) The feature code (BB) and the program ID (PID) are mutually
exclusive. A product may have one of them or none of them, but
it will never have both. If there is no feature code/program ID,
this field is blank, and the Oracle short description ends after
the source configuration code (S).
For example 1: QCS-9075-0-FCBGA1723+HS-MT-00-0-AA.
For example 2: QCS-9075-0-FCBGA1723+HS-MT-00-0-AC.
Note: The shipping package can be either TR (tape and reel) or MT
(matrix tray).
Device identification details for all samples available to date are summarized in [Table : Device identification details](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#topic.dita_c837bfca-5edc-47b9-88b7-a4a1772500af__table_3).
For availability and information about daisy chain parts, contact the Qualcomm Sales team
for support.
## Device identification for each sample type
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html)
Device identification details for all samples available to date are summarized in the
following table.
Table : Device identification details
| Device | Sample type | Variant (PRR-BB) P = product configuration code
**50 TOPS** | 6/30/2025 |
[^1^](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#fnsrc_1_device-identification-for-each-sample-type) BB is the feature code that identifies an
IC’s specific feature set, which distinguishes it from other versions or variants.
Feature sets are detailed in the Comments column.
[^2^](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#fnsrc_2_device-identification-for-each-sample-type) FEATURE\_ID combined with hardware revision number defines unique
product variants. This information is shown for situations where other device
identification information (such as device marking information) is not easily
accessible.
[^3^](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#fnsrc_3_device-identification-for-each-sample-type) S is the source configuration code that
identifies all the qualified die fabrication-source/assembly site combinations
available when the particular sample type was shipped.
## Device moisture sensitivity level
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html)
Non-hermetically sealed packages are susceptible to damage induced by absorbed moisture and
high temperature. A package’s moisture sensitivity level (MSL) indicates its ability to
withstand exposure after it is removed from its shipment bag, while it is on the factory floor
awaiting PCB installation. A low MSL rating is better than a high rating; a low MSL device can
be exposed on the factory floor longer than a high MSL device. All pertinent MSL ratings are
summarized in the following table.
Table : MSL ratings summary
| MSL | Out-of-bag floor life | Comments |
| --- | --- | --- |
| 1 | Unlimited | ≤ 30°C/85%RH |
| 2 | 1 year | ≤ 30°C/60%RH |
| 2a | 4 weeks | ≤ 30°C/60%RH |
| **3** | **168 hours** | **≤ 30°C/60%RH, QCS9075 rating** |
| 4 | 72 hours | ≤ 30°C/60%RH |
| 5 | 48 hours | ≤ 30°C/60%RH |
| 5a | 24 hours | ≤ 30°C/60%RH |
| 6 | Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label. | ≤ 30°C/60%RH |
QTI follows the latest IPC/JEDEC J-STD-020 standard revision for
moisture-sensitivityqualification. ***The QCS9075 devices are MSL3; the qualification temperature was 245°C.***
## Thermal characteristics
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html)
Rather than provide thermal resistance values ƟJC and ƟJA, validated
thermal package models are provided through the Qualcomm website. Designers can extract
thermal resistance values by conducting their own thermal simulations.
Click [QCS9075 Package Thermal Models Icepak
(HS11-73417-5HW)](https://docs.qualcomm.com/bundle/HS11-73417-5HW/resource/HS11-73417-5HW.zip) and [QCS9075 Package Thermal Model FloTHERM
(HS11-73417-6HW)](https://docs.qualcomm.com/bundle/HS11-73417-6HW/resource/HS11-73417-6HW.zip) to download the thermal package models.
## Package loading during heat sink attachment
Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html)
The following table specifies the maximum static load for each individual component:
Table : Maximum loading specification
| Component | Loading |
| :---: | :---: |
| QCS9075 | 89.6 N |
The specification above will be validated through limited compressive testing with uniform
loading applied perpendicular to the component surface of the packages at 125°C up to 2000
hours. It was determined that the above load recommendation is within safe working limits to
ensure negligible solder ball collapse and BGA shorting risk. The end user is encouraged to
validate the acceptable loading range based on intended application, motherboard, and heat
sink attach configurations.
Last Published: Jun 30, 2026
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