# Mechanical information
Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html)
This topic provides IC mechanical information including dimensions, markings, ordering information, and thermal characteristics.
## Device physical dimensions
Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html)
The QCS615 chipsets are available in the FCBGA761+HS that includes dedicated ground pins for improved grounding,
mechanical strength, and thermal continuity. It has a 23.0 mm by 23.0 mm body, with a maximum
height of 2.45 mm. Pin A1 is located by an indicator mark on the top of the package, and by
the ball pattern when viewed from below. The following figure shows a simplified version of
the package outline drawing.
Click the [Package Outline Drawing, FCBGA761+HS, 23.0 x 23.0 x 2.45 mm, S477,
L1370, PL1, heat Spreader (NT90-PG774-1)](https://docs.qualcomm.com/bundle/NT90-PG774-1/resource/NT90-PG774-1.pdf) to download the drawing.
Figure : FCBGA761+HS outline drawing
## Part marking
Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html)
Figure : Device marking (top view, not to scale)
| Line | Marking | Description |
| --- | --- | --- |
| C0 | Qualcomm | Qualcomm name or logo |
| P1 | PRODUCT | Qualcomm Technologies, Inc. (QTI) product name
|
| E | Blank or random | Additional content, as necessary |
| T1 | • | Pin1 or pin A1 indicator |
| T1 | FAYWWXXX | F= supply source code
F= J (Samsung)
A= assembly site code
A = K (SPIL, Taiwan)
Y= single/last digit of year
WW= two-digit work week of year specified by Y
XXX = traceability number |
| | | |
## Device ordering information
Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html)
The Oracle short description is used to order QTI products, and is present on both the
customer label and this document. The short description includes the product name,
configuration code, package type, product revision code, source code, and feature
code/program ID of the part. This device can be ordered using the identification code
shown in the following table.
Table : Device identification code
| Device ID code | AAA-AAAA | -P | -TTTTTT | NNNN | A | +FF | -EE | -RR | -S | -BB or -PID[^1^](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#fntarg_1_device-ordering-information) |
| :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: | :---: |
| Symbol definition | Product name | Configuration code | Package type | Number of pins | Package variable | Additional package information | Shipping package | Product revision | Source code | Feature code |
| Example 1 | QCS-615 | -0 | -FCBGA | 761 | | +HS | -MT | -00 | -0 | -AA |
| Example 2 | QCS-615 | -0 | -FCBGA | 761 | | +HS | -TR | -00 | -0 | -AA |
[^1^](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#fnsrc_1_device-ordering-information) The feature code (BB) and the program ID (PID) are
mutually exclusive. A product may have one of them or none of them,
but it will never have both. If there is no feature code/program ID,
this field is blank, and the Oracle short description ends after the
source configuration code (S).
For example:
- Example 1: QCS-615-0-FCBGA761+HS-MT-00-0-AA
- Example 2: QCS-615-0-FCBGA761+HS-TR-00-0-AA
Device identification details for all samples available to date are summarized in [Table : Device identification details](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#topic_dcw_1jl_bhc__table_uyx_bjl_bhc).
For availability and information about daisy chain parts, contact the Qualcomm Sales team
for support.
## Device identification for each sample type
Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html)
Table : Device identification details
| Product | Sample type | Variant (PRR-BB)
SPIL: 537 | 000-AA | 0x1 02E9 0E1 | 0x0 | 1.0 | 0 | QCS615, FCBGA761+HS; No modem | 10/04/2025 |
[^1^](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#fnsrc_1_device-identification-for-each-sample-type) BB is the feature code that identifies an IC’s
specific feature set, which distinguishes it from other versions
or variants. Feature sets are detailed in the Comments
column.
[^2^](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#fnsrc_2_device-identification-for-each-sample-type) The FEATURE\_ID combined with the JTAG\_ID defines
unique product variants. This information is shown for situations
where other device identification information (such as device
marking information) is not easily accessible.
[^3^](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#fnsrc_3_device-identification-for-each-sample-type) S is the source configuration code
that identifies all the qualified die fabrication-source/assembly
site combinations available when the particular sample type was
shipped. S values are defined in [Table : Source configuration codes](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#topic_dcw_1jl_bhc__table_xsz_g1m_bhc).
Table : Source configuration codes
| S value | Die | F value = J | A value = K |
| :---: | :---: | :---: | :---: |
| 0 | Digital | Samsung | SPIL, Taiwan |
The 28-bit QFPROM\_CORR\_PTE\_ROW0\_LSB register is summarized in the following table.
Table : QFPROM_CORR_PTE_ROW0_LSB register (Address : 0x0784130)
| Bit location | Name | Description |
| :---: | :---: | --- |
| bits[27:20] | FEATURE\_ID | These bits are used for defining various feature variants (see [Table : Device identification details](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#topic_dcw_1jl_bhc__table_uyx_bjl_bhc)). |
| bits[19:0] | JTAG\_ID | These bits map to bits [31:12] of the device identification register
(see [Table : Device identification details](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#topic_dcw_1jl_bhc__table_uyx_bjl_bhc) and [Table : Device identification register](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html#topic_dcw_1jl_bhc__table_otg_dbm_bhc)). |
The device identification register allows the user to determine the device’s
manufacturer, part number, and version via the test access port (TAP). The 32-bit device
identification register is read through the JTAG interface and is summarized in the
following table.
Table : Device identification register
| Bit location | Description | Value |
| :---: | --- | :---: |
| bits[31:28] | Version data
(may change with the sample type) | 0x0 |
| bits[27:12] | Part number
(changes with the sample type) | 02E9 |
| bits[11:1] | Manufacturer identity code (administered by JEDEC) | 0x070
(QTI code) |
| bit[0] | Device identification register start bit | Always= 1 |
## Thermal characteristics
Source: [https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html](https://docs.qualcomm.com/doc/80-73480-1/topic/mechanical-information.html)
Rather than providing thermal resistance values θJC and θJA,
validated thermal package models are provided through the Qualcomm website. Designers
can extract thermal resistance values by conducting their own thermal simulations.
Click [*QCS615 Package Thermal Model Icepak*
(HS11-73480-5HW)](https://docs.qualcomm.com/bundle/HS11-73480-5HW/resource/HS11-73480-5HW.zip) and the [*QCS615 Package Thermal Model FloTHERM*
(HS11-73480-6HW)](https://docs.qualcomm.com/bundle/HS11-73480-6HW/resource/HS11-73480-6HW.zip) to download the package thermal models.
Last Published: Mar 09, 2026
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