# Revision history Source: [https://docs.qualcomm.com/doc/80-73475-1/topic/revision-history.html](https://docs.qualcomm.com/doc/80-73475-1/topic/revision-history.html) The following table lists the technical content changes for all revisions. | Revision | Date | Description | | --- | --- | --- | | AG | January 2026 |

Table : Pin descriptions – primary pins : Updated the functional descriptions of
PS_HOLD, MD_PS_HOLD, RTSS_PS_HOLD, RESIN_N, RTSS_RESIN_N, RESOUT_N, and
RTSS_RESOUT_N

| | AF | December 2025 |

Figure 1-1 QCS8275 functional block diagram: Corrected the DSP
information

- Section 1.2 QCS8275 features: LPASS – corrected the number of GPDSPs
  to one
- HS-I²S – corrected the number of receive interfaces to three
- PCIe – corrected the 4-lane PCIe Gen4 to PCIe1

Table 2-1 I/O parameter definitions: Removed unsupported parameters and
updated the voltage to 1.2 V in the PX_11 description

Table 2-2 Pin descriptions – primary pins:
- Updated the pad type for multiple pins
- Updated the PCIe pin descriptions to Gen 4

Table 2-6 Pin descriptions – power supply pins:
- Updated the functional description for application processor pins
- Updated the functional description for the pins N13, BD28, and BD30

Section 3.5 Digital logic characteristics: Removed the DC specification
information for VDD_RTSS_PX_8

Figure 3-7 SPI slave timing diagram: Added the figure

Table 3-27 SPI slave timing characteristics: Corrected the
parameters

Added the following topics:
- Section 4.7 Package loading during heat sink attachment
- Section 4.8 Board flexure guidance

| | AE | August 2025 |

Table 2-3 Pin descriptions – general-purpose input/output ports: Removed
all instances of QUP2

Added the following sections:
- Section 3.1 Absolute maximum ratings
- Section 3.3 Power distribution network
- Section 3.4 Average operating current
- Section 3.5 Digital logic characteristics
- Section 3.6 Memory support
- Section 3.7 Multimedia
- Section 3.7.1 Camera interfaces
- Section 3.7.2 Display support
- Section 3.7.3 DisplayPort (DP)
- Section 3.8 Connectivity
- Section 3.8.1 USB interfaces
- Section 3.8.2 PCIe interface
- Section 3.8.3 UFS interface
- Section 3.8.4 SGMII interface
- Section 3.8.5 Octa-SPI/Quad-SPI interface
- Section 3.8.6 RGMII interface
- Section 3.8.7 Audio support
- Section 3.8.7.1 I²S interfaces
- Section 3.8.7.2 PCM/TDM interfaces
- Section 3.8.8 I²C interface
- Section 3.8.9 Serial peripheral interface
- Section 3.9 Internal functions
- Section 3.9.1 Modes and resets
- Section 3.9.2 JTAG
- Section 7.1 Reliability qualifications summary
- Section 7.2 Qualification sample description

Table 4-3 Device identification details: Added CS samples

Section 5.3 Device moisture sensitivity level: Added the MSL rating

Introduction: Added a note

Figure : QCS8275 functional block diagram: Updated this figure and added a note

Table : QCS8275 variant feature set comparison: Added this table

QCS8275 features: Added RF information

Physical interfaces: Updated QSPI description

Added the following sections:
- Table : Pin descriptions – general-purpose input/output ports: Updated
  GPIO[10] through GPIO[16]
- Part marking
- Device ordering information
- Device identification for each sample type
- Daisy chain devices Device moisture sensitivity level
- Thermal characteristics

Samples and known issues: Added this chapter

| | AB | September 17, 2024 |

Table: Pin descriptions – general-purpose input/output ports: Updated GPIO_9
configurable function

Table : Pin descriptions – RTSS I/O: Updated RTSS_IO_52 functional
description

Device physical dimensions: Updated the NT90 download link

| | AA | September 12, 2024 | Initial release | Last Published: Jan 08, 2026 [Previous Topic Samples and known issues](https://docs.qualcomm.com/bundle/publicresource/80-73475-1/topics/samples-known-issues.md)