# Revision history

Source: [https://docs.qualcomm.com/doc/80-30843-1/topic/Revision_history.html](https://docs.qualcomm.com/doc/80-30843-1/topic/Revision_history.html)

The following table lists the technical content changes for all revisions.

| Revision | Date | Description |
| :---: | :---: | :---: |
| AE | October 2025 | <ul class="ul" id="zki1594267935808__ul_bmv_fxh_fgc"><br>                <li class="li" id="zki1594267935808__li_blw_vxf_xgc">Global update: Removed UIM and GNSS support</li><br><br>                <li class="li" id="zki1594267935808__li_cmv_fxh_fgc">Added the following tables:<ul class="ul" id="zki1594267935808__ul_qwx_txf_xgc"><br>                    <li class="li" id="zki1594267935808__li_rwx_txf_xgc"><a href="https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#iqr1594375905599__table_aja_ajs_5jb">Table : QFPROM_CORR_JTAG_ID_LSB register</a></li><br><br>                    <li class="li" id="zki1594267935808__li_opw_5xf_xgc"><a href="https://docs.qualcomm.com/doc/80-30843-1/topic/Mechanical_information.html#iqr1594375905599__table_jnq_ktt_xgb">Table : Device identification register</a></li><br><br>                  </ul><br></li><br><br>                <li class="li" id="zki1594267935808__li_lsh_gxh_fgc"><a href="https://docs.qualcomm.com/doc/80-30843-1/topic/samples-and-known-issues.html">Samples and known issues</a>: Added this chapter</li><br><br>              </ul> |
| AD | August 2022 | <ul class="ul" id="zki1594267935808__ul_n1l_xn3_fgc"><br>                <li class="li" id="zki1594267935808__li_o1l_xn3_fgc">Global update:<ul class="ul" id="zki1594267935808__ul_p1l_xn3_fgc"><br>                    <li class="li" id="zki1594267935808__li_q1l_xn3_fgc">Removed GNSS and WGR7640</li><br><br>                    <li class="li" id="zki1594267935808__li_r1l_xn3_fgc">Updated 752 NSP to NSP752</li><br><br>                  </ul><br></li><br><br>                <li class="li" id="zki1594267935808__li_s1l_xn3_fgc">Cover page: Updated QRB2210 high-level block diagram</li><br><br>                <li class="li" id="zki1594267935808__li_t1l_xn3_fgc">Figure 1-1 <em class="ph i">QRB2210 functional block diagram</em>: Updated<br>                  the figure</li><br><br>                <li class="li" id="zki1594267935808__li_u1l_xn3_fgc">Section 1.2.1 <em class="ph i">Air interface features</em>: Removed table<br>                  position location and navigation summary</li><br><br>                <li class="li" id="zki1594267935808__li_v1l_xn3_fgc">Section 2.2.1 <em class="ph i">Pin map</em>: Removed to be released</li><br><br>                <li class="li" id="zki1594267935808__li_w1l_xn3_fgc">Table 2-2 <em class="ph i">Pin descriptions – general pins</em>: Updated<br>                  note</li><br><br>                <li class="li" id="zki1594267935808__li_x1l_xn3_fgc">Table 3-3 <em class="ph i">Operating conditions</em>: Updated footnote</li><br><br>              </ul> |
| AC | June 2022 | <ul class="ul" id="zki1594267935808__ul_ekx_xn3_fgc"><br>                <li class="li" id="zki1594267935808__li_fkx_xn3_fgc">Table 4-4 <em class="ph i">Device identification details</em>: Updated with<br>                  CS details</li><br><br>                <li class="li" id="zki1594267935808__li_gkx_xn3_fgc">Table 4-5 <em class="ph i">Source configuration code</em>: Added Assembly<br>                  sites</li><br><br>                <li class="li" id="zki1594267935808__li_hkx_xn3_fgc">Section 4.5 <em class="ph i">Thermal characteristics</em>: Updated this<br>                  topic</li><br><br>              </ul> |
| AB | November 2021 | Table 4-4 *Device identification              details*: Updated the ES sample date |
| AA | August 2021 | Initial release |

Last Published: Oct 08, 2025

[Previous Topic
Samples and known issues](https://docs.qualcomm.com/bundle/publicresource/80-30843-1/topics/samples-and-known-issues.md)