# Revision history

Source: [https://docs.qualcomm.com/doc/80-73417-1/topic/revision-history.html](https://docs.qualcomm.com/doc/80-73417-1/topic/revision-history.html)

The following table lists the technical content changes for all revisions.

| Revision | Date | Description |
| --- | --- | --- |
| AH | January 30, 2026 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_fss_5s5_c3c"><br>                <li class="li"><a href="https://docs.qualcomm.com/doc/80-73417-1/topic/introduction.html#concept.dita_ccec286c-3f72-433c-b4dc-e90f60d7d110__table_xpy_vr1_4gc">Table : IQ9 feature comparison summary</a>: <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_yhy_xs5_c3c"><br>                    <li class="li">Updated TOPS numbers</li><br><br>                    <li class="li">Updated memory description</li><br><br>                  </ul><br></li><br><br>                <li class="li"><a href="https://docs.qualcomm.com/doc/80-73417-1/topic/introduction.html#concept.dita_ccec286c-3f72-433c-b4dc-e90f60d7d110__section_h24_vzr_2dc">Processor</a>: Updated CPU and artificial intelligence description </li><br><br>                <li class="li"><a href="https://docs.qualcomm.com/doc/80-73417-1/topic/mechanical-information.html#topic.dita_c837bfca-5edc-47b9-88b7-a4a1772500af__table_3">Table : Device identification details</a>: Updated TOPS numbers</li><br><br>              </ul> |
| AG | January 22, 2026 | Section *Thermal characteristics*: Updated link for the QCS9075 Package<br>              Thermal Model FloTHERM |
| AF | January 7, 2026 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_esp_cjq_whc"><br>                <li class="li">Table 1-1 <em class="ph i">IQ9 feature comparison summary</em>: Added this table</li><br><br>                <li class="li"><em class="ph i">Primary pins</em>: Updated description of PS_HOLD, MD_PS_HOLD, RTSS_PS_HOLD,<br>                  RESIN_N, RTSS_RESIN_N, RESOUT_N and RTSS_RESOUT_N</li><br><br>                <li class="li">Table 4-4 <em class="ph i">Device identification details</em>: Added the CS sample for variant<br>                  000-AC</li><br><br>              </ul> |
| AE | August 2025 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_ngx_wsv_fgc"><br>                <li class="li"><em class="ph i">QCS9075 features</em>: Removed all instances of QUP3_SE_0</li><br><br>                <li class="li"><em class="ph i">Digital logic characteristics</em>: <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_v5b_ktv_fgc"><br>                    <li class="li">Table <em class="ph i">Digital I/Os specified in this section</em>: Removed reference of<br>                      RGMII 2.5 V </li><br><br>                    <li class="li">Table <em class="ph i">DC specification of 1.8 V I/Os</em>: Removed I<sub class="ph sub">OZH</sub> and<br>                        I<sub class="ph sub">OZL</sub>, added footnote to V<sub class="ph sub">OL</sub> and V<sub class="ph sub">OH</sub></li><br><br>                    <li class="li">Table <em class="ph i">Possible drive strength settings</em>: Added this table</li><br><br>                    <li class="li">Table <em class="ph i">DC specifications for RGMII 1.8 V mode (VDD_RTSS_PX8)</em>: Added<br>                      footnote to V<sub class="ph sub">OL</sub> and V<sub class="ph sub">OH</sub></li><br><br>                    <li class="li">Table <em class="ph i">Possible drive strength</em>: Added this table</li><br><br>                    <li class="li">Table <em class="ph i">Digital I/O characteristics for UFS_RESET and UFS_REF_CLK<br>                        (VDD_PX9/VDD_PX10)</em>: Added footnote to V<sub class="ph sub">OL</sub> and<br>                      V<sub class="ph sub">OH</sub></li><br><br>                  </ul><br><ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_ek4_qvv_fgc"><br>                    <li class="li"><p class="p">Table <em class="ph i">DC specifications for SPMI (VDD_PX0)</em></p><br>: Removed<br>                        I<sub class="ph sub">OZH</sub> and I<sub class="ph sub">OZL</sub>, and added footnote to V<sub class="ph sub">OL</sub><br>                      and V<sub class="ph sub">OH</sub></li><br><br>                  </ul><br><ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_uqm_yvv_fgc"><br>                    <li class="li">Table <em class="ph i">DC specifications for PS_HOLD and MD_PS_HOLD (VDD_PX3)</em>: Removed<br>                        I<sub class="ph sub">OZH</sub> and I<sub class="ph sub">OZL</sub>, and added footnote to V<sub class="ph sub">OL</sub><br>                      and V<sub class="ph sub">OH</sub></li><br><br>                  </ul><br></li><br><br>              </ul> |
| AD | July 2025 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_xrp_rqf_h2c"><br>                <li class="li" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__li_wbv_z4s_3fc">Table <em class="ph i">Example device identification code</em>: Added<br>                  example</li><br><br>                <li class="li" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__li_yrp_rqf_h2c"><em class="ph i">Device identification details</em>: Updated ES and CS<br>                  information</li><br><br>                <li class="li">Table <em class="ph i">Qualification plan and results summary</em>: Updated this table</li><br><br>                <li class="li" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__li_uvp_trf_h2c">Editorial changes throughout the document</li><br><br>              </ul> |
| AC | January 2025 | Editorial changes throughout the document |
| AB | October 2024 | <ul class="ul" id="topic.dita_4df2cfbc-6e4a-48bd-bd56-5f335899a177__ul_syr_syk_zcc"><br>                <li class="li">Editorial changes throughout the document</li><br><br>                <li class="li">Thermal characteristics: Added FloTHERM thermal package model</li><br><br>                <li class="li">Samples and known issues: Added this chapter</li><br><br>              </ul> |
| AA | September 2024 | Initial release |

Last Published: Jan 30, 2026

[Previous Topic
Samples and known issues](https://docs.qualcomm.com/bundle/publicresource/80-73417-1/topics/samples-and-known-issues.md)